Polymer Property : Thermal Conductivity = 0.190 W/m-K Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	ASTM C177
SABIC Innovative Plastics Lexan® 123R PC (Asia Pacific) Nonhalogenated. 17.5 MFR, for small, intricate parts. UV stabilized. Internal mold release.
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	ASTM C177
SABIC Innovative Plastics Lexan® 131 PC Nonhalogenated. 3.5 MFR.
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	ASTM C177
SABIC Innovative Plastics Lexan® 920A PC Low viscosity injection moldable, flame retardant PC. Exceptional surface appearance. Clear, tints and opaque colors.
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	ASTM C177
SABIC Innovative Plastics Lexan® 943AR PC (Asia Pacific) Medium viscosity, superior flame retardance. UV-Stabilized. Clear, tints and opaque colors.
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	ASTM C177
SABIC Innovative Plastics Lexan® 950 PC Opaque colors, high viscosity, superior flame retardance.
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
Permabond HH120 Anaerobic Threadlocker Permabond® HH120 Threadlocker is an excellent general purpose threadlocker and sealant. It is used for locking bolts, nuts and screws that require permanent assembly. Its high viscosity allows for ..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
Permabond LH197 Anaerobic Gasketmaker Permabond® LH197 is an anaerobic material designed for making “formed in situ” gaskets between metal surfaces. It is highly flexible, making it ideal for dissimilar surfaces where differential th..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	ASTM C177
SABIC Innovative Plastics Lexan® HPS1R PC (Asia Pacific) High flow polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 or USP Class VI). EtO, e-beam and gamma sterilizable. Contains..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	ASTM C177
SABIC Innovative Plastics Lexan® ML6076 PC Passes FAR 25.853: 60 seconds at 30 mil.
Thermal Conductivity	0.190 - 0.250 W/m-K	1.32 - 1.74 BTU-in/hr-ft²-°F	Average value: 0.238 W/m-K Grade Count:11
Overview of materials for Fluorinated Ethylene Propylene (FEP), Molded/Extruded This property data is a summary of similar materials in the MatWeb database for the category "Fluorinated Ethylene Propylene (FEP), Molded/Extruded". Each property range of values reported is minimu..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ftÂ²-Â°F
Momentive Performance Materials RTV6703 One-Component,Â Modified Alkoxy Adhesive Sealant, Black RTV6700 Series sealants are neutral cure, one-component, ready to use silicone adhesive sealants that cure to tough resilient silicone rubber on exposure to atmospheric moisture at room temperature...
Thermal Conductivity	0.190 W/m-K @Temperature 40.0 Â°C	1.32 BTU-in/hr-ftÂ²-Â°F @Temperature 104 Â°F	ASTM C177
Solvay Specialty Polymers SolefÂ® 11010 Polyvinylidene Fluoride (PVDF) SolefÂ® 11010 PVDF is a medium-viscosity flexible PVDF copolymer resin and is typically processed by extrusion.Features: Copolymer; Good Flexibility; Medium ViscosityAdditional Properties: Crystal..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ftÂ²-Â°F	ISO 8302
SABIC Innovative Plastics XenoyÂ® 6370 PBT+PC (Europe-Africa-Middle East) XENOY 6370 is an impact modified semi-crystalline thermoplastic. blend with 30% glass fibre reinforcement offering toughness and ductility.
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ftÂ²-Â°F	ISO 8302
SABIC Innovative Plastics XenoyÂ® CL402U PBT+PC (Europe-Africa-Middle East) XENOY CL402U has been specially developed for extrusion blowmoulding applications, where higher melt strength is desired. XENOY CL402U is a high impact material combined with good UV resistance perf..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
Trelleborg Emerson & Cuming Stycast® 1090/11 Two-Component General Purpose Encapsulant Features and Typical Applications: Designed as general purpose encapsulants, these products offer a wide range of features including thermal conductivity, mechanical shock and impact resistance, as ..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
Eastman Eastar DN003 PCTG Copolyester ISO data as provided by the manufacturer, Eastman Chemical
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	ASTM C177
Eastman Eastar MN004 Copolyester Eastar Copolyesters are brilliantly clear polymers that have excellent impact strength, chemical resistance, dimensional stability, and low shrinkage rates. Eastar MN004 contains a mold release.Appl..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
Dow SiLK™ I 1070 Semiconductor Dielectric Resin SiLK™ I 1070 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 1070 is compatible wi..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
Dow SiLK™ I 1500 Semiconductor Dielectric Resin SiLK™ I 1500 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 1500 is compatible wi..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
Dow SiLK™ I 550 Semiconductor Dielectric Resin SiLK™ I 550 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 550 is compatible with..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
CMT Materials HYTAC® WFT High Temperature, Ultra-Smooth PTFE Impregnated HYTAC-WFT combines the higher temperature, smooth surface properties of HYTAC-WF with PTFE impregnation for low stick surface capability and excellent material distribution. The result is a syntact..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
Dow SiLK™ I 260 Semiconductor Dielectric Resin SiLK™ I 260 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 260 is compatible with..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
Dow SiLK™ I300 140 Semiconductor Dielectric Resin SiLK™ I300 140 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I300 140 is compatibl..
Thermal Conductivity	0.190 - 0.220 W/m-K	1.32 - 1.53 BTU-in/hr-ft²-°F	ASTM C177
Solvay Specialty Polymers Hylar® MP20 PVDF Polyvinylidene Fluoride  (discontinued **) Data provided by the manufacturer.Hylar® polymers have the characteristic stability of fluoropolymers combined with a unique polarity that influences its solubility and electrical properties. In a..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
Permabond MH052 Anaerobic Threadsealant Permabond® MH052 is ideal for the sealing of threaded joints. It is approved for use with natural gas and LPG for working pressure up to 20 bar (290 psi) and also for gaseous oxygen up to 10 bar (1..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
Permabond A126 Anaerobic Retainer Permabond® A126 is a high-strength anaerobic adhesive for permanent assembly of coaxial assemblies or threaded metal components. The exceptionally low viscosity of this product makes it ideal for u..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	ASTM C177
SABIC Innovative Plastics Lexan® 950 PC (Asia Pacific) Opaque colors, high viscosity, superior flame retardance.