Polymer Property : Thermal Conductivity = 0.400 W/m-K Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ft²-°F	ISO 52612
Murtfeldt Muralen® Black Antistatic Polyethylene, Conductive Muralen® is based on high molecular weight polyethylene (PE-HMW) and is ideally suited for use in applications that require the generally impressive material properties of polyethylene. Because of..
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ft²-°F	ISO 52612
Murtfeldt Original Material ”S”® Black Antistatic Polyethylene, Conductive Original Material ”S”® black has the same properties as Original Material ”S”® green/natural. In addition, it is also electrostatically conductive due to the addition of additives. Special Pro..
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ft²-°F	ISO 52612
Murtfeldt Original Material ”S”® Green Polyethylene Material ”S”® is based on virgin, ultrahigh molecular weight low pressure polyethylene and significantly exceeds the requirements of DIN 16972. In particular, Material ”S”® green has excellen..
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ft²-°F
Pyrotek Pyloric 100 High-Temperature Product for Cooking Ovens Pyrorock 100 is a refractory material used as a thermal transfer media in deck-type cooking ovens. Using our patented Isomag® process, mineral materials are combined with an inorganic binder. Thi..
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ft²-°F
Quadrant EPP Cestilene™ HD 1000 Polyethylene Data provided by Quadrant Engineering Plastic Products for polymers in their European product line.
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ft²-°F
Quadrant EPP TIVAR® 1000 antistatic PE-UHMW + carbon black (ISO Data) By incorporating an effective carbon black grade, TIVAR 1000 antistatic offers the electrostatic dissipative properties often required for PE-UHMW components operating at high line speeds and convey..
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ft²-°F
Quadrant EPP TIVAR® Cleanstat PE-UHMW + specific additives (ISO Data) TIVAR CleanStat is a PE-UHMW grade for use in food processing and pharmaceutical industries. It exhibits static dissipative properties and has a food contact compliant composition. Very good wear an..
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ft²-°F
Quadrant EPP TIVAR® Oil Filled PE-UHMW + oil (ISO Data) TIVAR Oil Filled is a self-lubricating PE-UHMW material in the real meaning of the word. Next to an enhanced wear resistance, the incorporated and evenly dispersed oil renders this material a consid..
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ft²-°F
Quadrant EPP TIVAR® SuperPlus PE-UHMW + specific additives (ISO Data) TIVAR SuperPlus is a wear optimised, partially cross-linked PE-UHMW material with extremely high degree of polymerisation for use in most demanding applications and environments. When used for drain..
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ft²-°F
Quadrant EPP TIVAR® TECH PE-UHMW + MoS2 (ISO Data) This PE-UHMW grade with extremely high degree of polymerisation contains molybdenum disulphide, resulting in a material with improved wear resistance and sliding properties over TIVAR 1000.
Thermal Conductivity	0.400 - 0.500 W/m-K	2.78 - 3.47 BTU-in/hr-ft²-°F	ASTM E1461
Raschig Group MELOPLAS® 150 MF Wood flour-reinforced MF molding compound in dark colors. High surface hardness, high mechanical strength, good electrical properties. Self-extinguishing (V-O/1,6 according to UL 94), UL-listed. Fr..
Thermal Conductivity	0.400 - 0.500 W/m-K	2.78 - 3.47 BTU-in/hr-ft²-°F	DIN 52 612
Raschig Group MELOPLAS® 2500 MF Cellulose-reinforced MF molding compound in white and colored shades. Very good electrical properties, high surface hardness, good abrasion- and UV-stability, very good resistance to chemicals - al..
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ft²-°F
Resinlab® EP950G Gray Aluminum Filled Rubber Modified Epoxy EP950G Gray is an aluminum filled one part rubber modified epoxy designed for bonding metal and other structural material subject to stress at elevated temperature. It is a medium paste-like viscosi..
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ft²-°F	ASTM E1530
Solvay Specialty Polymers KetaSpire® KT-820 SL30 Polyetheretherketone (PEEK)  (Unverified Data**) Ketaspire KT-820 SL30 is a polyetheretherketone (PEEK) compound designed to provide a balance of excellent mechanical properties, wear resistance and low coefficient of friction in both dry and exte..
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ftÂ²-Â°F	DIN 52612
Lehmann & Voss LUVOCOMÂ® 80/CF/12/TF/10/GY Polyacetal-copolymer, with carbon fiber and PTFE Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.Electrically conductive, suitable for continuous discharging of statically generated electricit..
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ftÂ²-Â°F	DIN 52612
Lehmann & Voss LUVOCOMÂ® 1/CF/10/GK/20/TF/5/BK Polyamide 66, with carbon fiber, glass spheres and PTFE, heat stabilized Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Improved friction and wear beh..
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ftÂ²-Â°F	DIN 52612
Lehmann & Voss LUVOCOMÂ® 1105-0923/GY2 PEEK, with glass fiber Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.High dimensionally stable precision parts, high continuous use tempera..
Thermal Conductivity	0.400 W/m-K <br>@Temperature 100 °C	2.78 BTU-in/hr-ft²-°F <br>@Temperature 212 °F	ASTM E1461
Plenco 7100 Phenolic, Nodular, Injection Molded PLENCO 07100 is an organic fiber reinforced phenolic molding compound, with improved mechanical strength properties and an industrial finish. 07100 is densified for easy handling and good pourabilit..
Thermal Conductivity	0.400 W/m-K <br>@Temperature 121 °C	2.78 BTU-in/hr-ft²-°F <br>@Temperature 250 °F
Tra-Con Tra-Bond Ablebond 933-1.5 Moisture Resistant Encapsulant TRA-BOND 933-1.5 electrically insulating epoxy encapsulant is formulated to provide a smooth crown over the device of wire bonds. This encapsulant provides protection from thermal and mechanical sho..
Thermal Conductivity	0.400 W/m-K <br>@Temperature 100 °C	2.78 BTU-in/hr-ft²-°F <br>@Temperature 212 °F	ASTM E1461
Plenco 2571 Phenolic, Granular, Injection Molded PLENCO 02571 is a general purpose, organic filled phenolic molding compound offering optimum cure characteristics while maintaining excellent mechanical and electrical properties. UL recognized unde..
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ft²-°F	DIN 52612
Total Xsene® XS10 B HDPE, pipe, injection molding FINATHENE® XS10 B is a high density polyethylene based on C6 hexene as co-monomer and is produced by the Fina Double Loop Technology™. FINATHENE® XS10 B is a high performance black compound speci..
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ft²-°F	Product Property; ASTM E 1530
Arlon Thermabond® 48991A010 0.010" (0.254 mm) Uncured Silicone Rubber with Fiberglass Substrate Description: Generation IIa Thermabond® NP electrically insulating electronic adhesive. Bonds without primer.Design/Construction: Liner: PolyethyleneSide 1: Uncured Silicone RubberSubstrate: Style ..
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ft²-°F	DIN 52612
BASF Ultramid® B3UG4 BK 23215 20% Glass Filled PA66 FR (Dry) Description: Halogen-free and phosphorus free flame retardant injection-molding grade with outstanding free-flow properties, good electrical properties and low smoke density; resistant to glow wire..
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ft²-°F
Orbilan ORBILAN® PE 500 HMW-PE Orbilan PE 500 plastic is used as cutting boards for the food industry and gastronomy, in refrigeration chambers as ram protection and for swing doors as well as at sports grounds for sheets or hand..
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ft²-°F	Average value: 0.400 W/m-K Grade Count:7
Overview of materials for High Density Polyethylene (HDPE), Pipe Grade This property data is a summary of similar materials in the MatWeb database for the category "High Density Polyethylene (HDPE), Pipe Grade". Each property range of values reported is minimum and max..
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ft²-°F
Trelleborg Emerson & Cuming Stycast® XT-1169 Two-Component Epoxy High Service Temp Encapsulant Features and Typical ApplicationsAbility to withstand high temperatures, thermal shock, and chemical exposure. These products are designed for heat generating electronic devices which operate in har..
Thermal Conductivity	0.400 - 0.600 W/m-K	2.78 - 4.16 BTU-in/hr-ft²-°F	ASTM E1461
Raschig Group DECAL® 152CL Phenolic Glass-fiber and mineral reinforced phenolic molding compound. Excellent heat resistance, low mould shrinkage and post-shrinkage, good chemical resistance and mechanical properties. This product meet..
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ft²-°F	Silicone Property; ASTM E 1530
Arlon R36601A010 0.010" (0.254 mm) Uncured Silicone Rubber with Fiberglass Substrate Description: Generation II Thermabond® NP electrically insulating electronic adhesive. Bonds without primer.Design/Construction: Liner 1: Polyethylene Side 1: Uncured Silicone Rubber Substrate: Sty..
Thermal Conductivity	0.400 W/m-K <br>@Temperature 80.0 °C	2.78 BTU-in/hr-ft²-°F <br>@Temperature 176 °F	Z Direction; ASTM C518
Rogers Corporation 2929 Bondply Unreinforced, Hydrocarbon based Thin Film Adhesive System Low dielectric constant and loss tangentIdeal for multi-layer bondingCompatible with traditional processing methodsCompatible with a broad range of material types including PTFE compositesReliable t..