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Polymer Property : Thermal Conductivity = 0.500 W/m-K Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Thermal Conductivity | 0.500 W/m-K @Temperature 80.0 °C |
3.47 BTU-in/hr-ft²-°F @Temperature 176 °F |
ASTM C518 |
| Rogers Corporation RO4535 Ceramic-Filled, Glass-Reinforced Hydrocarbon Laminate The RO4500™ Series Cost Performance Antenna Grade Laminates are ceramic-filled, glass-reinforced hydrocarbon based materials that provides the controlled dielectric constant, low loss performance a.. |
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| Thermal Conductivity | 0.500 - 0.600 W/m-K | 3.47 - 4.16 BTU-in/hr-ft²-°F | ASTM E1461 |
| Raschig Group MELOPAS® 156 MF Melamine Glass fiber reinforced Melamine molding compound. This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives 2002/95 (RoHS), 200.. |
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| Thermal Conductivity | 0.500 - 0.600 W/m-K | 3.47 - 4.16 BTU-in/hr-ft²-°F | ASTM E1461 |
| Raschig Group RALUPOL® 2200 UP Polyester Organically filled polyester molding compound. Low post-shrinkage, good electrical values and mechanical properties, high surface quality and good color stability (non-yellowing). This product meets.. |
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| Thermal Conductivity | 0.500 W/m-K | 3.47 BTU-in/hr-ft²-°F | |
| Resinlab® EP1295 Black Medium Viscosity, Halogen Free, Flame Retardant Epoxy Casting Resin Resinlab™ EP1295 Black is a medium viscosity, halogen free, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (.. |
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| Thermal Conductivity | 0.500 W/m-K | 3.47 BTU-in/hr-ft²-°F | |
| Resinlab® EP1340 Medium Viscosity, Flame Retardant Epoxy Casting Resin System Resinlab™ EP1340 is a medium viscosity, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034) for U.. |
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| Thermal Conductivity | 0.500 W/m-K @Temperature 80.0 °C |
3.47 BTU-in/hr-ft²-°F @Temperature 176 °F |
ASTM C518 |
| Rogers Corporation RO3035 Ceramic-Filled PTFE Composite, High Frequency Circuit Material Features and Benefits:Low dielectric lossExcellent mechanical properties versus temperature - reliable stripline and multi-layer board constructions.Uniform mechanical properties- ideal for multi-la.. |
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| Thermal Conductivity | 0.500 - 0.700 W/m-K | 3.47 - 4.86 BTU-in/hr-ft²-°F | ASTM E1461 |
| Raschig Group 3572 Epoxy Glass-fiber reinforced epoxy molding compound. Good mechanical strength and electrical strength, enhanced elasticity for ensuring good sealing under extreme heat and/or humidity, good chemical resis.. |
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| Thermal Conductivity | 0.500 - 0.600 W/m-K | 3.47 - 4.16 BTU-in/hr-ft²-°F | ASTM E1461 |
| Raschig Group RALUPOL® 8601 UP Glass-fiber reinforced polyester molding compound. Mold shrinkage similar to phenolic moulding compounds, low post-shrinkage, good electrical values, excellent heat resistance, good mechanical stren.. |
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| Thermal Conductivity | 0.500 W/m-K | 3.47 BTU-in/hr-ft²-°F | |
| Permabond ES569 Epoxy Resin PERMABOND® ES569 is a single-part heat cured epoxy adhesive with excellent adhesion to metal surfaces as well as composite materials. The high bond strength of this adhesive allows it to replace me.. |
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| Thermal Conductivity | 0.500 W/m-K | 3.47 BTU-in/hr-ft²-°F | HOT-DISK || 60x60x3 mm |
| Lehmann & Voss LUVOCOM® 1106-7843 Polyether imide, with glass fiber, PTFE, lubricant modified, easy flowing Applications: Improved friction and wear behaviour. Emergency running property.Strong, stiff parts.Dynamic stressed parts at high movement velocity.Information provided by Lehmann & Voss & Co.KG |
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| Thermal Conductivity | 0.500 W/m-K | 3.47 BTU-in/hr-ft²-°F | DIN 52612 |
| Lehmann & Voss LUVOCOM® 3/CF/30/EG Polyamide 6, with carbon fiber, extrusion grade Applications: Automotive industry, textile machinery, apparatus- and precision engineering.High-strength and stiff parts; low coefficient of expansion.dynamic stressElectrically conductive, suitable.. |
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| Thermal Conductivity | 0.500 W/m-K | 3.47 BTU-in/hr-ft²-°F | DIN 52612 |
| Lehmann & Voss LUVOCOM® 6/CF/30 Polyamide 12, with carbon fiber Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.Strong, stiff parts.Especially suitable at dynamic stress situations.Electrically conductive, s.. |
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| Thermal Conductivity | >= 0.500 W/m-K | >= 3.47 BTU-in/hr-ft²-°F | DIN 52612 |
| Fluorseals PTFE Unfilled Information provided by TEKU GmbH Fluorkunststoffe, a distributor of Fluorseals materials. |
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| Thermal Conductivity | 0.500 W/m-K | 3.47 BTU-in/hr-ft²-°F | DIN 52612 |
| Lehmann & Voss LUVOCOM® 1/XCF/20 Polyamide 66, with carbon fiber, heat stabilized Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Reduced moment of inertia comp.. |
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| Thermal Conductivity | 0.500 W/m-K | 3.47 BTU-in/hr-ft²-°F | DIN 52612 |
| Lehmann & Voss LUVOCOM® 1/XCF/25 Polyamide 66, with carbon fiber, heat stabilized Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Reduced moment of inertia comp.. |
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| Thermal Conductivity | 0.500 W/m-K @Temperature 100 °C |
3.47 BTU-in/hr-ft²-°F @Temperature 212 °F |
ASTM E1461 |
| Plenco 4309 Phenolic, Nodular, Injection Molded PLENCO 04309 is a heat resistant, glass reinforced phenolic molding compound offering improved mechanical strength and electrical strength properties. UL recognized under component file E40654. 0430.. |
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| Thermal Conductivity | 0.500 W/m-K @Temperature 100 °C |
3.47 BTU-in/hr-ft²-°F @Temperature 212 °F |
ASTM E1461 |
| Plenco 4311 Phenolic, Granular, Compression Molded PLENCO 04311 is a heat resistant, mineral filled phenolic molding compound offering excellent processability, mechanical strength, and improved cold powder pourability characteristics. UL recognized.. |
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| Thermal Conductivity | 0.500 W/m-K | 3.47 BTU-in/hr-ft²-°F | MIL STD 883D |
| CoorsTek Epoxy Seal 923 (ES-923) B-staged epoxy lids ES-923 is designed for applications requiring a rapid epoxy cure cycle (10 minutes at 160° C). This accelerated seal cycle results in only a modest reduction in moisture resistance and seal strengt.. |
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| Thermal Conductivity | 0.500 W/m-K | 3.47 BTU-in/hr-ft²-°F | through plane; ASTM E1461 |
| DSM Stanyl® TC154 PA46 FR(17) Thermal conductive material, Flame Retardant, Heat Stabilized |
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| Thermal Conductivity | 0.500 W/m-K | 3.47 BTU-in/hr-ft²-°F | ASTM E1461 |
| Arlon AD300C Commercial Microwave and RF Laminate Material Excellent Thermal Coefficient of Dielectric Constant (TCEr = -25 ppm/°C)Excellent PIM performanceHigh Thermal Conductivity ideal for Higher Power DesignsReduced Coefficient of Thermal Expansion in .. |
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| Thermal Conductivity | 0.500 - 0.600 W/m-K | 3.47 - 4.16 BTU-in/hr-ft²-°F | ASTM E1461 |
| Raschig Group MELOPLAS® 180 MF Wood flour-reinforced, phenol-modified MF molding compound (MPF) in dark colors. High surface hardness, good mechanical strength and electrical properties, good heat resistance. Self-extinguishing .. |
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| Thermal Conductivity | 0.500 W/m-K | 3.47 BTU-in/hr-ft²-°F | DIN 52612 |
| Lehmann & Voss LUVOCOM® 1105-7251 PEEK, with glass fiber Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.High dimensionally stable precision parts, high continuous use tempera.. |
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| Thermal Conductivity | 0.500 W/m-K | 3.47 BTU-in/hr-ft²-°F | ASTM C177 |
| Solvay Specialty Polymers Ixef® 2010/X914 Polyarylamide, 40% Filler, DAM
(discontinued **) The IXEF compounds are a family of semi-crystalline polyarylamide thermoplastics reinforced with glass fibers and/or mineral fillers for injection molding.Data provided by the manufacturer, Solvay A.. |
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| Thermal Conductivity | 0.500 W/m-K | 3.47 BTU-in/hr-ft²-°F | |
| Resinlab® EP1190 Flame Retardant Epoxy Casting Resin Resinlab™ EP1190 is a medium viscosity, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034, Proje.. |
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| Thermal Conductivity | 0.500 W/m-K | 3.47 BTU-in/hr-ft²-°F | |
| Resinlab® EP1240RC Flame Retardant Epoxy Casting Resin Resinlab™ EP1240RC is a medium viscosity, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034, Pro.. |
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