Polymer Property : Thermal Conductivity = 1.32 BTU-in/hr-ft²-°F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	ASTM C177
SABIC Innovative Plastics Lexan® 124 PC UL rated HB as of 10/97. 200 series recommended when V-2 rating required. 17.5 MFR, for small, intricate parts. FDA food contact compliant in limited colors.Effective January 15th, 2007 this grade..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	ASTM C177
SABIC Innovative Plastics Lexan® 131R PC (Asia Pacific) Nonhalogenated. 3.5 MFR.
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	ASTM C177
SABIC Innovative Plastics Lexan® 134R PC Nonhalogenated. 3.5 MFR. Internal mold release. FDA food contact compliant in limited colors.
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	ASTM C177
SABIC Innovative Plastics Lexan® 940ASR PC More robust design of standard 900 series flame retardant grade. Internal mold release.
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	ASTM C177
SABIC Innovative Plastics Lexan® 943ASR PC (Asia Pacific) More robust design of standard 900 series flame retardant grade. Internal mold release. UV-stabilized.
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	ASTM C177
SABIC Innovative Plastics Lexan® FXE154 PC FDA compliant (color limited) PC. 2.5 MFR. Potable water/extrusion blowmoldable. ILLUMINATE special effects (fluorescent/edge glow colors).
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	ASTM C177
SABIC Innovative Plastics Lexan® HP4R PC (Asia Pacific) Medium flow polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 or USP Class VI). EtO and steam sterilizable. Contains a hig..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
Permabond F202 Anaerobic Retainer The unique 'toughening' process incorporated into Permabond® F202 gives this anaerobic adhesive excellent resistance to peel and impact forces. Primarily designed for use on metal surfaces, it is a..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
Permabond HH167 Anaerobic Retainer Permabond® HH167 is a high viscosity gap filling silver paste, which can be used for repairing metal machinery parts. It is ideal for repairing worn shafts, broken threads, damaged keyways and spli..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
Permabond HL126 Anaerobic Threadlocker PERMABOND® HL126 Threadlocker is a water thin product for locking pre-assembled parts through wicking action. PERMABOND® HL126 Threadlocker prevents vibration loosening. Because of the low viscosi..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
Permabond LM012 Anaerobic Threadsealant Permabond® LM012 is an unfilled, medium viscosity anaerobic adhesive. Its major benefit as related to other pipe sealants is that it is an unfilled resin that is compatible with hydraulic fluids. I..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	ASTM C177
SABIC Innovative Plastics Lexan® HPS1R PC Med/high flow polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 or USP Class VI). EtO, e-beam and gamma sterilizable. Cont..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	ASTM C177
SABIC Innovative Plastics Lexan® 953A PC (Asia Pacific) Clear, tints and opaque colors, high viscosity, flame retardant with exceptional surface. UV-stabilized.
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ftÂ²-Â°F
Momentive Performance Materials RTV6126 Clear Potting/Encapsulating Gel Two-part addition cure. Two-part addition cure RTV silicones can be cured very quickly with the use of high heat. Addition cure products have no cure by-products and can be used to unlimited depth..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ftÂ²-Â°F
Momentive Performance Materials RTV615 Clear General Purpose Potting/Encapsulating Compound Two-part addition cure. Two-part addition cure RTV silicones can be cured very quickly with the use of high heat. Addition cure products have no cure by-products and can be used to unlimited depth..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ftÂ²-Â°F	ASTM C177
SABIC Innovative Plastics ULTEM HU1004 PEI (Europe-Africa-Middle East) High Temperature, Transparent, Polyetherimide Blend with Improved Ductility and Enhanced Hydrostability. Healthcare management of change, biocompatible (ISO 10993 or USP Class VI) and FDA and EUFC f..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
Eastman Drystar 0113 Copolyester This product-line is designed to meet the needs of converters seeking value-added solutions to their drying requirements of copolyesters. Eastman’s copolyesters are highly valued for their excellen..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
Eastman Eastar DN004 PCTG Copolyester ISO data as provided by the manufacturer, Eastman Chemical
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	ASTM C177
Eastman Neostar FN007 Elastomer Neostar FN007 elastomer is the third in Eastman’s series of tough, clear, durable copolyester ethers. Though originally designed for use in the profile and automotive markets, this innovative copol..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
Hippe PMMA Components made of PMMA are brilliantly transparent. Outstanding aging stability and weathering resistance. Good surface hardness. Abrasion-resistant. Physiologically safe. High strength. Easi..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
Dow SiLK™ I 360 Semiconductor Dielectric Resin SiLK™ I 360 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 360 is compatible with..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
Dow SiLK™ I 820 Semiconductor Dielectric Resin SiLK™ I 820 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 820 is compatible with..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
Dow SiLK™ I300 280 Semiconductor Dielectric Resin SiLK™ I300 280 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I300 280 is compatibl..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
Dow SiLK™ I300 560 Semiconductor Dielectric Resin SiLK™ I300 560 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I300 560 is compatibl..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
CMT Materials HYTAC® WF High Strength High Clarity 450°F Epoxy Syntactic HYTAC-WF is an excellent high temperature epoxy syntactic material that provides improved clarity when forming APET and other clear polymers plus reduces sticking of difficult to process polymers su..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
CENTROPLAST CENTROFLON Polyvinylidene fluoride This material has very good chemical and temperature resistance, with good slip characteristics. Its applications include pump wheels, flanges, valve bodies, and laboratory equipment.Information pr..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	ASTM C177
SABIC Innovative Plastics Lexan® HP4NR PC Medium flow polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 or USP Class VI). EtO and steam sterilizable. Contains no m..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	Average value: 0.190 W/m-K Grade Count:6
Overview of materials for Acrylic, Cast This property data is a summary of similar materials in the MatWeb database for the category "Acrylic, Cast". Each property range of values reported is minimum and maximum values of appropriate MatW..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
Permabond A131 Anaerobic Threadsealant Permabond® A131 is an anaerobic adhesive designed to seal threaded metal pipe connections carrying a wide variety of gases and liquids, including potable water. Suitable for use on both parallel an..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	ASTM C177
SABIC Innovative Plastics Lexan® HP4NR PC (Europe-Africa-Middle East) Medium flow polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 or USP Class VI). EtO and steam sterilizable. Contains no m..