| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Thermal Conductivity |
1.76
W/m-K @Temperature 80.0 °C |
12.2
BTU-in/hr-ft²-°F @Temperature 176 °F |
ASTM C518 |
|
Rogers Corporation TMM® TMM10 Ceramic Thermoset Polymer Composite
TMM® Thermoset microwave materials are ceramic thermoset polymer composites designed for high plate-thru-hole reliability stripline and microstrip applications. The electrical and mechanical prope..
|
|||
| Thermal Conductivity | 1.76 W/m-K | 12.2 BTU-in/hr-ft²-°F | COLORA |
|
Aptek 2210A/B Electrically conductive urethane adhesive
Electrically conductive urethane adhesive, silver-filled, flexible low modulus, low outgassingAPTEK 2210-A/B is a two component, silver-filled, urethane adhesive designed for application where flexi..
|
|||
| Thermal Conductivity | 1.76 W/m-K | 12.2 BTU-in/hr-ft²-°F | COLORA |
|
Aptek 2312-PMF Electrically conductive, low modulus adhesive
Premixed-frozen, electrically conductive, low modulus adhesiveAPTEK 2312-PMF is a one component, premixed-frozen, silver filled, electrically conductive soft paste adhesive. It is designed to bond m..
|
|||