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Polymer Property : Thermal Conductivity = 2.78 BTU-in/hr-ft²-°F Product List

Thermal Properties

Tips: 30 items are displayed at most.
Thermal Properties Metric English Comments
Thermal Conductivity 0.400 W/m-K
2.78 BTU-in/hr-ft²-°F
ISO 52612
Murtfeldt Material ”S”® 1000 Green Polyethylene
Material ”S”® 1000 is exclusively produced from ultra-high molecular weight polyethylene powder that is mixed with finely milled Original Material ”S”®. The fine milled material is compressio..
Thermal Conductivity 0.400 W/m-K
2.78 BTU-in/hr-ft²-°F
ISO 52612
Murtfeldt Muralen® Black Antistatic Polyethylene, Conductive
Muralen® is based on high molecular weight polyethylene (PE-HMW) and is ideally suited for use in applications that require the generally impressive material properties of polyethylene. Because of..
Thermal Conductivity 0.400 W/m-K
2.78 BTU-in/hr-ft²-°F
ISO 52612
Murtfeldt Muralen® Polyethylene
Muralen® is based on high molecular weight polyethylene (PE-HMW) and is ideally suited for use in applications that require the generally impressive material properties of polyethylene. Because of..
Thermal Conductivity 0.400 W/m-K
2.78 BTU-in/hr-ft²-°F
ISO 52612
Murtfeldt Original Material ”S”® Natural Polyethylene
Material ”S”® is based on virgin, ultrahigh molecular weight low pressure polyethylene and significantly exceeds the requirements of DIN 16972. In particular, Material ”S”® natural has excell..
Thermal Conductivity 0.400 W/m-K
2.78 BTU-in/hr-ft²-°F
ISO 52612
Murtfeldt Original Material ”S”® plus + FP Polyethylene
Original Material ”S”® plus+ FP [FS] is a technical plastic that completely meets the requirements of the food sector for the detectability of plastic foreign bodies in foods. “FP” stands for “..
Thermal Conductivity 0.400 W/m-K
2.78 BTU-in/hr-ft²-°F
DIN.52612
Omnia Plastica PE 500 - Polyethylene 500
Polyethylene with a molecular weight of ± 500,000. PE 500 is more rigid than the high molecular weight polyethylene and it is therefore more suitable for mechanical applications. The friction coeff..
Thermal Conductivity 0.400 W/m-K
2.78 BTU-in/hr-ft²-°F
Quadrant EPP TIVAR® 1000 EC PE-UHMW + specific additives (ISO Data)
TIVAR 1000 EC is a PE-UHMW grade containing specific additives rendering this material a lower surface resistivity than TIVAR 1000 antistatic, improving electrical conductivity and UV-resistance
Thermal Conductivity 0.400 - 0.600 W/m-K
2.78 - 4.16 BTU-in/hr-ft²-°F
ASTM E1461
Raschig Group DECAL® 666/8/2B Phenolic
Glass-fiber reinforced phenolic molding compound. Excellent heat resistance, low mould shrinkage and post-shrinkage, good chemical resistance and mechanical properties. This product meets the allowe..
Thermal Conductivity 0.400 - 0.600 W/m-K
2.78 - 4.16 BTU-in/hr-ft²-°F
ASTM E1461
Raschig Group EPOXIDUR® 3580 EP Epoxy
Glass-fiber reinforced and mineral filled epoxy molding compound. Good mechanical strength, very good electrical isolation properties even with thin wall thicknesses and high temperatures. This prod..
Thermal Conductivity 0.400 - 0.500 W/m-K
2.78 - 3.47 BTU-in/hr-ft²-°F
ASTM E1461
Raschig Group MELOPAS® 6605 MP Melamine
Cellulose reinforced Melamine molding compound. Very good electrical properties, excellent surface hardness, good mechanical strength and heat resistance, good wear and UV-stability, good gliding be..
Thermal Conductivity 0.400 - 0.500 W/m-K
2.78 - 3.47 BTU-in/hr-ft²-°F
ASTM E1461
Raschig Group MELOPLAS® 150 MF
Wood flour-reinforced MF molding compound in dark colors. High surface hardness, high mechanical strength, good electrical properties. Self-extinguishing (V-O/1,6 according to UL 94), UL-listed. Fr..
Thermal Conductivity 0.400 - 0.500 W/m-K
2.78 - 3.47 BTU-in/hr-ft²-°F
ASTM E1461
Raschig Group MELOPLAS® 152 MF
Cellulose-reinforced MF molding compound in white and colored shades. Very good electrical properties, high surface hardness, good abrasion- and UV-stability, very good resistance to chemicals - al..
Thermal Conductivity 0.400 - 0.600 W/m-K
2.78 - 4.16 BTU-in/hr-ft²-°F
Average value: 0.450 W/m-K Grade Count:5
Overview of materials for Acetal Copolymer, Carbon Fiber Filled
This property data is a summary of similar materials in the MatWeb database for the category "Acetal Copolymer, Carbon Fiber Filled". Each property range of values reported is minimum and maximum va..
Thermal Conductivity 0.400 - 0.600 W/m-K
2.78 - 4.16 BTU-in/hr-ft²-°F
ASTM E1461
Raschig Group RESINOL® 87120 EPF Phenolic
Glass-fiber reinforced phenolic molding compound. Excellent heat resistance, low mould shrinkage and post-shrinkage, good chemical resistance and very good mechanical properties. This product meets ..
Thermal Conductivity 0.400 W/m-K
<br>@Temperature 20.0 °C
2.78 BTU-in/hr-ft²-°F
<br>@Temperature 68.0 °F
DIN 52612
GEHR Plastics PE-UHMW-ELS Polyethylene &nbsp;(discontinued **)
Polyethylene offers resistance to almost all acids and bases, detergents and hot water. PE has good insulation properties and is easy to weld. The operating temperature of HDPE is from -58 °F to +1..
Thermal Conductivity 0.400 W/m-K
2.78 BTU-in/hr-ft²-°F
DIN 52612
Lehmann & Voss LUVOCOM® 1105-7920/RD PEEK, with glass fiber
Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.Chemical and hydrolysis resistance parts, non flammable.High dimension..
Thermal Conductivity 0.400 W/m-K
2.78 BTU-in/hr-ft²-°F
DIN 52612
Lehmann & Voss LUVOCOM® 1850/GF/30/TF/13/SI/2 PBT, with glass fiber, PTFE, lubricant modified
Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.Improved friction and wear behaviour. Emergency running property.High dimensionally stable prec..
Thermal Conductivity 0.400 W/m-K
2.78 BTU-in/hr-ft²-°F
DIN 52612
Lehmann & Voss LUVOCOM® 1105-0918/EM/BL PEEK, with glass fiber
Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.Chemical and hydrolysis resistance parts, non flammable.High dimension..
Thermal Conductivity 0.400 W/m-K
<br>@Temperature 100 °C
2.78 BTU-in/hr-ft²-°F
<br>@Temperature 212 °F
ASTM E1461
Plenco 2482 Phenolic, Granular, Transfer Molded
PLENCO 02482 is a general purpose, organic filled phenolic molding compound offering excellent mechanical strength while maintaining dielectric properties at elevated humidity levels. UL recognized ..
Thermal Conductivity 0.400 W/m-K
2.78 BTU-in/hr-ft²-°F
DIN 52612
Total 3802 Blue MDPE pipe, injection molding
FINATHENE® 3802 Blue is a polyethylene copolymer based on C6 hexene as co-monomer and is produced by a continuous low pressure slurry polymerization process. FINATHENE® 3802 Blue is a blue polyeth..
Thermal Conductivity 0.400 W/m-K
2.78 BTU-in/hr-ft²-°F
Trelleborg Emerson & Cuming Stycast® 2057FR/11 Two-Component Epoxy Flame Retardant Encapsulant
Features and Typical ApplicationsProvide flame resistance down to 1/8 of an inch. These products also offer various other features such as thermal shock protection, low viscosity, and thermal conduc..
Thermal Conductivity 0.400 W/m-K
<br>@Temperature 40.0 °C
2.78 BTU-in/hr-ft²-°F
<br>@Temperature 104 °F
ISO 8302
Ensinger TECASINT 4011 Polyimide, Yellow (PI)
TECASINT is a range of non-melting high temperature polyimides characterized by high strength over a wide range of temperatures, good long term thermal stability, minimal thermal expansion and excel..
Thermal Conductivity 0.400 W/m-K
2.78 BTU-in/hr-ft²-°F
Arlon AD450A Glass, PTFE and Ceramic
High Dielectric Constant for Circuit Militarization & Patch Antenna ApplicationsInformation provided by Arlon Materials for Electronics (MED).
Thermal Conductivity 0.400 W/m-K
2.78 BTU-in/hr-ft²-°F
Orbilan ORBILAN® PE 500 HMW-PE
Orbilan PE 500 plastic is used as cutting boards for the food industry and gastronomy, in refrigeration chambers as ram protection and for swing doors as well as at sports grounds for sheets or hand..
Thermal Conductivity 0.400 W/m-K
2.78 BTU-in/hr-ft²-°F
ASTM E1530
Saint-Gobain Furon®, Kapton® K275 Tape
Description: A 1 mil thermally conductive Kapton® film, coated on both sides with 2 mils of thermally-conductive pressure-sensitive adhesive. Recommended uses: Excellent for use in small, compact e..
Thermal Conductivity 0.400 - 0.600 W/m-K
2.78 - 4.16 BTU-in/hr-ft²-°F
Average value: 0.470 W/m-K Grade Count:10
Overview of materials for Melamine-Phenolic Copolymer
This property data is a summary of similar materials in the MatWeb database for the category "Melamine-Phenolic Copolymer". Each property range of values reported is minimum and maximum values of ap..
Thermal Conductivity 0.400 W/m-K
<br>@Temperature 80.0 °C
2.78 BTU-in/hr-ft²-°F
<br>@Temperature 176 °F
Z Direction; ASTM C518
Rogers Corporation 2929 Bondply Unreinforced, Hydrocarbon based Thin Film Adhesive System
Low dielectric constant and loss tangentIdeal for multi-layer bondingCompatible with traditional processing methodsCompatible with a broad range of material types including PTFE compositesReliable t..
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