Polymer Property : Thermal Conductivity = 3.82 BTU-in/hr-ft²-°F Product List

Thermal Properties

Tips: 30 items are displayed at most.

Thermal Properties	Metric	English	Comments
Thermal Conductivity	0.550 W/m-K	3.82 BTU-in/hr-ft²-°F
Permabond ES550 Epoxy Resin PERMABOND ES550 is a single-part epoxy paste which is slump-resistant (does not flow) during cure. The adhesive is toughened for maximum impact resistance, along with excellent peel and shear streng..
Thermal Conductivity	0.550 W/m-K	3.82 BTU-in/hr-ft²-°F
Permabond ES558 Epoxy Resin PERMABOND ES558 is a single-part epoxy paste which flows like solder when heated during curing. The adhesive is toughened for maximum impact resistance, along with excellent peel and shear strength...
Thermal Conductivity	0.550 W/m-K	3.82 BTU-in/hr-ft²-°F
Permabond ES562 Epoxy Resin PERMABOND® ES562 is a single-part epoxy adhesive which flows like solder when heated during curing. The adhesive has excellent adhesion to metal surfaces and composites. The high bond strength of t..
Thermal Conductivity	0.550 W/m-K	3.82 BTU-in/hr-ft²-°F
Permabond ET536 Epoxy Resin PERMABOND ET536 is a two-part, 1:1 mixable epoxy adhesive with good adhesion to a variety of substrates such as wood, metal, ceramics and some plastics and composites. Permabond ET536 forms tough bo..
Thermal Conductivity	0.550 W/m-K @Temperature 23.0 °C	3.82 BTU-in/hr-ft²-°F @Temperature 73.4 °F	ISO/CD 22007-4
Victrex® PEEK 90GL60 Polyetheretherketone, 60% Glass Fibre Reinforced Product Description:High performance thermoplastic material, 60% glass fibre reinforced Polyetheretherketone (PEEK), semi crystalline, granules for injection moulding, standard flow, FDA food contac..
Thermal Conductivity	0.550 W/m-K	3.82 BTU-in/hr-ft²-°F
Permabond ET538 Epoxy Resin PERMABOND ET538 is a structural, room temperature curing epoxy adhesive that has excellent adhesion to a wide variety of surfaces such as wood, metal, ceramics and many plastic and composite materia..
Thermal Conductivity	0.550 - 29.0 W/m-K	3.82 - 201 BTU-in/hr-ft²-°F	Average value: 2.78 W/m-K Grade Count:72
Overview of materials for Epoxy, Electrically Conductive This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Electrically Conductive". Each property range of values reported is minimum and maximum values of..
Thermal Conductivity	0.550 - 0.550 W/m-K @Temperature 100 - 100 °C	3.82 - 3.82 BTU-in/hr-ft²-°F @Temperature 212 - 212 °F	Average value: 0.550 W/m-K Grade Count:1
Overview of materials for Phenolic, Resole, Mineral/Flock Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Resole, Mineral/Flock Filled". Each property range of values reported is minimum and maximum v..
Thermal Conductivity	0.550 W/m-K	3.82 BTU-in/hr-ftÂ²-Â°F	DIN 52612
Lehmann & Voss LUVOCOMÂ® 1105-0699 PEEK, with carbon fiber, PTFE, lubricant modified Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.High-strength and high-stiff parts; low coefficient of expansion.Improved friction and wea..
Thermal Conductivity	0.550 W/m-K	3.82 BTU-in/hr-ftÂ²-Â°F	DIN 52612
Lehmann & Voss LUVOCOMÂ® 1105-0699-1 PEEK, with carbon fiber, PTFE, lubricant modified Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.High-strength and high-stiff parts; low coefficient of expansion.Improved friction and wea..
Thermal Conductivity	0.550 W/m-K	3.82 BTU-in/hr-ftÂ²-Â°F	ASTM F433
Sumitomo Bakelite North America RXÂ® 640 Fiberglass Reinforced Phenolic Resole RXÂ 640 is a fiberglass reinforced, ammonia-free, phenolic resole compound, with good dimensional stability and good strength at elevated temperatures. Meets ASTM D-5948 Type GPI-5.Information supp..
Thermal Conductivity	0.550 W/m-K @Temperature 100 °C	3.82 BTU-in/hr-ft²-°F @Temperature 212 °F	ASTM E1461
Plenco 4527 Phenolic, Granular, Injection Molded PLENCO 04527 is a heat resistant, mineral and flock filled phenolic molding compound, offering excellent mechanical strength, and resistance to cracking in a wet-dry environment. UL recognized under..
Thermal Conductivity	0.550 W/m-K	3.82 BTU-in/hr-ft²-°F
Trelleborg Emerson & Cuming Stycast® 2651-40/23LV Two-Component General Purpose Encapsulant Features and Typical Applications: Designed as general purpose encapsulants, these products offer a wide range of features including thermal conductivity, mechanical shock and impact resistance, as ..
Thermal Conductivity	0.550 W/m-K @Temperature 100 °C	3.82 BTU-in/hr-ft²-°F @Temperature 212 °F	ASTM E1461
Plenco 6343 Phenolic, Granular, Compression Molded PLENCO 06343 is a mica reinforced phenolic molding compound, offering for a low power factor, low electrical losses, and good electrical properties after long exposures to high humidity. UL recogniz..
Thermal Conductivity	0.550 W/m-K	3.82 BTU-in/hr-ft²-°F
Trelleborg Emerson & Cuming Stycast® 2651-40FR/9 Two-Component Epoxy Flame Retardant Encapsulant Features and Typical ApplicationsProvide flame resistance down to 1/8 of an inch. These products also offer various other features such as thermal shock protection, low viscosity, and thermal conduc..
Thermal Conductivity	0.550 W/m-K	3.82 BTU-in/hr-ft²-°F
Epoxy Technology EPO-TEK® H31LV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H31LV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electron..
Thermal Conductivity	0.550 W/m-K	3.82 BTU-in/hr-ft²-°F
Dow Corning 340 Heat Sink Compound White, non-flowing, highly filled compound, good thermal conductivity.Information provided by Dow Corning
Thermal Conductivity	0.550 W/m-K	3.82 BTU-in/hr-ft²-°F	ASTM 1530-93
Premix Premi-Glas® 1285VE 1285 VE Glass Reinforced Vinyl Ester SMC  (discontinued **) Description: Premi-Glas® 1285 VE is a glass reinforced vinyl ester sheet molding compound designed for automotive under the hood applications. Key features and benefits: Designed for compression mo..