| Processing Properties | Metric | English | Comments |
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| Processing Temperature | 25.0 °C | 77.0 °F | Curing Agent Temperature |
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Northstar Polymers MSS-A85C Ester Base Polyurethane
This high performance polyester system is one of a family of polymer systems developed by Northstar Polymers for demanding work environments. Urethane elastomers molded with this system exhibit hig..
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| Processing Temperature | 25.0 - 125 °C | 77.0 - 257 °F | Average value: 36.2 °C Grade Count:53 |
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Overview of materials for Silicone, RTV, Adhesive/Sealant Grade
This property data is a summary of similar materials in the MatWeb database for the category "Silicone, RTV, Adhesive/Sealant Grade". Each property range of values reported is minimum and maximum va..
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| Processing Temperature | 25.0 °C | 77.0 °F | Curing time: 16 hours; Postcure: 2 hours/100°C (212°F) |
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Abatron AboCast 8-7/Abocure 8-7 Epoxy
(discontinued **)
2-part solvent-free dielectric epoxy casting compound.Processing: 100/50 ratio (pbw); Gel time, 1 lb. (2.2 kg): 125 minutes; cures in 16 hours at 25°C (77°F); postcure: 2 hours at 100°C (212°F)...
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| Processing Temperature | 25.0 °C | 77.0 °F | Curing time: 16 hours; Postcure: 2 hours/100°C (212°F) |
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Abatron AboCast 8-13/Abocure 8-13 Epoxy
(discontinued **)
2-part, clear, solvent-free dielectric epoxy casting compound.Processing: 100/12.80 ratio (pbw); Gel time, 100 g (3.5 oz.): 53 minutes; cures in 16 hours at 25°C (77°F); postcure: 2 hours at 100°..
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| Processing Temperature | 25.0 °C | 77.0 °F | Curing time: 2 weeks |
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Abatron AboCast 8-17/Abocure 8-17 Epoxy
(discontinued **)
2-part, clear, solvent-free dielectric epoxy casting compound.Processing: 100/35.00 ratio (pbw); Gel time, 100 g (3.5 oz.): 123 minutes; cures in 2 weeks at 25°C (77°F).Applications: solventless c..
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| Processing Temperature | 25.0 °C | 77.0 °F | Curing time: 2 weeks |
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Abatron AboCast 8-18/Abocure 8-18 Epoxy
(discontinued **)
2-part, clear, solvent-free dielectric epoxy casting compound.Processing: 100/32.00 ratio (pbw); Gel time, 100 g (3.5 oz.): 120 minutes; cures in 2 weeks at 25°C (77°F).Applications: solventless c..
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| Processing Temperature | 25.0 °C | 77.0 °F | Cure Schedule: 7 days @ 25°C |
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Huntsman HY 3440 Phenalkamine Hardener
Approx. H+ equivalent weight 80. Mix Ratio with GY 6010 is 30.Comments/Applications: Low temperature cure coatings with excellent corrosion and moisture resistance. Cure can go down to 0°C. F..
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| Processing Temperature | 25.0 °C | 77.0 °F | Cure Schedule: 7 days @ 25°C |
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Huntsman HZ 3441 OU-66 Phenalkamine Hardener
Approx. H+ equivalent weight 190. Mix Ratio with GY 6010 is 50.Comments/Applications: Low temperature cure coatings with excellent corrosion and moisture resistance. Cure can go down to 0°C. ..
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| Processing Temperature | 25.0 - 80.0 °C | 77.0 - 176 °F | Hardening Temperature |
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Möller Medical PolySkin 78 M NanoCoating
Decorative coating in "metallic look," hardening at room temperature up to 80°C.Information provided by Möller Medical, Member of CENTROTEC Group
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| Processing Temperature | 25.0 °C | 77.0 °F | |
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Momentive Performance Materials RTV112 White Adhesive Sealant, General Purpose Pourable
One-part acetoxy cure. Acetoxy cure silicones are the most commonly used type of RTV materials and are considered GE Silicones' general purpose product line. Typical uses: Thin-section protective ..
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| Processing Temperature | 25.0 °C | 77.0 °F | |
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Momentive Performance Materials RTV123 Black Adhesive Sealant, General Purpose Paste
One-part modified alkoxy cure. Modified alkoxy materials cure at room temperature and will outgas a small amount of ammonia and some alcohol during cure. Typical uses: General purpose for bonding ..
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| Processing Temperature | 25.0 °C | 77.0 °F | |
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Momentive Performance Materials RTV157 Gray Adhesive Sealant, High Strength Paste
One-part cure. Typical uses: High strength adhesive; use for gasketing, aircraft maintenance, and electrical insulation.Data provided by the manufacturer, GE Silicones.GE Silicones became a part of..
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| Processing Temperature | 25.0 °C | 77.0 °F | Cure time 24 hrs. |
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Momentive Performance Materials RTV21 Pink General Purpose Potting/Encapsulating Compound
Two-part condensation cure. Two-part condensation cure silicones RTVs are designed to cute at room temperature, and can be applied at temperature up to one inch (2.5 cm). These are very tough mate..
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| Processing Temperature | 25.0 °C | 77.0 °F | Cure time 24 hrs. |
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Momentive Performance Materials RTV41 White General Purpose Potting/Encapsulating Compound
Two-part condensation cure. Two-part condensation cure silicones RTVs are designed to cute at room temperature, and can be applied at temperature up to one inch (2.5 cm). These are very tough mate..
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| Processing Temperature | 25.0 °C | 77.0 °F | Cure time 2 hours. |
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Momentive Performance Materials RTV627 Dark Gray General Purpose Potting/Encapsulating Compound
Two-part addition cure. Two-part addition cure RTV silicones can be cured very quickly with the use of high heat. Addition cure products have no cure by-products and can be used to unlimited depth..
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| Processing Temperature | 25.0 °C | 77.0 °F | |
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Momentive Performance Materials RTV6802 White Adhesive Sealant, Industrial Plastic Adhesive
One-part modified alkoxy cure. Modified alkoxy materials cure at room temperature and will outgas a small amount of ammonia and some alcohol during cure. Typical uses: Primerless adhesion to many ..
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| Processing Temperature | 25.0 °C | 77.0 °F | Cure time 24 hrs. |
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Momentive Performance Materials RTV8112 White General Purpose Potting/Encapsulating Compound
Two-part condensation cure. Two-part condensation cure silicones RTVs are designed to cute at room temperature, and can be applied at temperature up to one inch (2.5 cm). These are very tough mate..
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| Processing Temperature | 25.0 °C | 77.0 °F | |
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Momentive Performance Materials IS802 White Adhesive Sealant, General Purpose Paste
One-part acetoxy cure. Acetoxy cure silicones are the most commonly used type of RTV materials and are considered GE Silicones' general purpose product line. Typical uses: Use for general purpose,..
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| Processing Temperature | 25.0 °C | 77.0 °F | |
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Momentive Performance Materials IS806 Red Adhesive Sealant, General Purpose Paste
One-part alkoxy cure. Typical uses: High-heat applications; encapsulate and seal heating elements.Data provided by the manufacturer, GE Silicones.GE Silicones became a part of Momentive Performance..
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| Processing Temperature | 25.0 °C | 77.0 °F | |
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Momentive Performance Materials RTV159 Red Adhesive Sealant, High Strength Paste
One-part alkoxy cure. Typical uses: High-heat applications; encapsulate and seal heating elements.Data provided by the manufacturer, GE Silicones.GE Silicones became a part of Momentive Performance..
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| Processing Temperature | 25.0 °C | 77.0 °F | Cure time 24 hrs. |
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Momentive Performance Materials RTV560 Red Extreme High Temperature Potting/Encapsulating Compound
Two-part condensation cure. Two-part condensation cure silicones RTVs are designed to cute at room temperature, and can be applied at temperature up to one inch (2.5 cm). These are very tough mate..
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| Processing Temperature | 25.0 °C | 77.0 °F | Cure time 5 min. |
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Momentive Performance Materials RTV6126 Clear Potting/Encapsulating Gel
Two-part addition cure. Two-part addition cure RTV silicones can be cured very quickly with the use of high heat. Addition cure products have no cure by-products and can be used to unlimited depth..
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| Processing Temperature | 25.0 °C | 77.0 °F | Cure time 4 hours. |
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Momentive Performance Materials RTV615 Clear General Purpose Potting/Encapsulating Compound
Two-part addition cure. Two-part addition cure RTV silicones can be cured very quickly with the use of high heat. Addition cure products have no cure by-products and can be used to unlimited depth..
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| Processing Temperature | 25.0 °C | 77.0 °F | Cure time 1 hour. |
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Momentive Performance Materials RTV6156 Clear Potting/Encapsulating Gel
Two-part addition cure. Two-part addition cure RTV silicones can be cured very quickly with the use of high heat. Addition cure products have no cure by-products and can be used to unlimited depth..
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| Processing Temperature | 25.0 °C | 77.0 °F | Cure time 15 min. |
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Momentive Performance Materials RTV6196 Clear Potting/Encapsulating Gel
Two-part addition cure. Two-part addition cure RTV silicones can be cured very quickly with the use of high heat. Addition cure products have no cure by-products and can be used to unlimited depth..
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| Processing Temperature | 25.0 °C | 77.0 °F | Cure time 4 hours. |
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Momentive Performance Materials RTV656 Clear Extreme Low Temperature Potting/Encapsulating Compound
Two-part addition cure. Two-part addition cure RTV silicones can be cured very quickly with the use of high heat. Addition cure products have no cure by-products and can be used to unlimited depth..
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| Processing Temperature | 25.0 °C | 77.0 °F | |
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Abatron AboCast/AboCure 8109-11
All-purpose, structural dielectric resin. Better thermal and chemical properties than 8109-8, but requires heat cure. Melts at 70-80°C and remains liquid (supercooled) for many hours at RT.Process..
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| Processing Temperature | 25.0 °C | 77.0 °F | Cure 168 hrs |
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Aptek 2214-A/B Low modulus urethane ESD coating/adhesive
Space Grade, Low modulus urethane ESD coating/adhesiveAPTEK is a carbon-filled, thixotropic, two component, electrically conductive, flexible urethane coating/adhesive designed to dissipate an elect..
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| Processing Temperature | 25.0 °C | 77.0 °F | Cure 7 days |
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Aptek 2506-A/B Room temperature curing, low modulus urethane conformal coating
Room temperature curing, low modulus urethane conformal coatingAPTEK 2506-A/B is an unfilled, two component, electrically insulating, transparent, flexible urethane coating system designed for the e..
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