Polymer Property : Pot Life = 1440 min Product List

Processing Properties

Tips: 30 items are displayed at most.

Processing Properties	Metric	English	Comments
Pot Life	1440 min	1440 min
NextGen Adhesives P907-30 Optical Assembly Adhesive Description: NGAC P907-30 is a high viscosity, controlled flow encapsulant designed for microelectronics applications requiring low shrinkage and high reliability performance.Advantages and Applicat..
Pot Life	1440 min	1440 min
Resin Technology Group 405 Oxy-Bond™ Electrically Conductive Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma..
Pot Life	>= 1440 min	>= 1440 min	Mass: 50g; TM R050-19
Resinlab® SEC1244 Silver Filled Epoxy Adhesive Resinlab™ SEC1244 is a silver filled, two component, elevated temperature curing epoxy adhesive. It provides excellent electrical conductivity useful in many electronic applications. It is a smooth..
Pot Life	1440 min	1440 min
Resin Technology Group TIGA 905 One-Part Silver Conductive Epoxy System Cure 6 minutes at 130°C or 3 minutes at 150°C.TIGA 905 is a stress-absorbing and electrically conductive, silver-filled epoxy adhesive recommended for solder replacement in microelectronic interco..
Pot Life	1440 - 2880 min <br>@Temperature 25.0 Â°C	1440 - 2880 min <br>@Temperature 77.0 Â°F
Lord Adhesives Thermosetâ„¢ EP-830 Ignition Coil Impregnating and Encapsulation Epoxy Lord EP-830 is a heat curing, two component epoxy formulation designed especially for use in automotive high voltage ignition coils where adhesion to segmented bobbins is critical. The combination o..
Pot Life	1440 min <br>@Temperature 25.0 Â°C	1440 min <br>@Temperature 77.0 Â°F
Lord Adhesives Thermosetâ„¢ ME-541 Underfill Encapsulant LORD Thermosetâ„¢ ME-541 encapsulant is an anhydride free, high purity, semi-conductor grade epoxy underfill product developed for the encapsulation of densely populated area array flip chip devi..
Pot Life	>= 1440 min	>= 1440 min	100 gram batch
Master Bond EP45HTMED Epoxy Resists Radiation and Steam Sterilization Description: Master Bond Polymer System EP45HTMED is a two component heat cured epoxy system for high performance structural bonding, sealing, coating and casting. It is especially designed for the ..
Pot Life	>= 1440 min	>= 1440 min	100 gram batch
Master Bond EP46HT-1 Epoxy For Serviceability Up To 600°F Description: Master Bond EP46HT-1 is a two component epoxy system for high performance structural bonding and sealing suitable for applications where resistance to temperatures from -100°F to +550°..
Pot Life	>= 1440 min	>= 1440 min	100 gram batch
Master Bond Ep46HT-2 Two Component, Heat Resistant Epoxy System Master Bond Polymer System EP46HT-2 is a two component epoxy system for bonding, sealing and casting applications where resistance to temperatures from -100°F to +500°F is required. It is 100% rea..
Pot Life	>= 1440 min	>= 1440 min	100 gram batch
Master Bond EP46HT-2Med Two Component Heat Resistant Biocompatible Epoxy System Master Bond Polymer System EP46HT-2MED is a two component medical grade epoxy system for high performance structural bonding and casting suitable for applications where resistance to temperatures fr..
Pot Life	1440 min	1440 min	(1 day)
Tra-Con Tra-Bond 2212 High Temperature Epoxy Adhesive TRA-BOND 2212 was developed for high temperature bonding, laminating, filament winding and potting applications where the combination of good physical and mechanical properties plus superior wetting..
Pot Life	1440 min <br>@Temperature 25.0 °C	1440 min <br>@Temperature 77.0 °F	(1 day), 0.6 grams
Tra-Con Tra-Bond 526W01 Microelectronics Grade Encapsulant TRA-BOND 526W01 is a one component micro-electronics grade controlled flow encapsulant designed to protect wire bonds and bare die. TRA-BOND 526W01 has a low coefficient of thermal expansion and low..
Pot Life	1440 min	1440 min	(1 day)
Tra-Con Tra-Duct 29121 Snap Cure Conductive Silver Epoxy Adhesive TRA-DUCT 29121 is 100% solids, two component silver filled epoxy designed for chip bonding in microelectronic and optoelectronic applications. TRA-DUCT 29121 is a soft, smooth paste. This two-part f..
Pot Life	>= 1440 min <br>@Temperature 25.0 °C	>= 1440 min <br>@Temperature 77.0 °F	100 grams
Trelleborg Emerson & Cuming Eccobond® 17 M 1 Heat Cure Catalyst Emerson & Cuming 17 M 1 Eccobond® Heat Cure CatalystVery high temperature resistance, highest temperature strength, lowest shrink. Non-crystallizing. Long working life. Imparts excellent chemical r..
Pot Life	1440 min	1440 min
Dow Corning HM-2510 CLEAR ASSEMBLY SEALANT A reactive Hot Melt silicone sealant that has immediate strength and crosslinks into a neutral cure RTV sealantInformation provided by Dow Corning
Pot Life	1440 min	1440 min
Dow Corning SILASTIC® 9280/30 KIT PARTS A&B 40 Durometer, 2-part, 1 to 1 mix, translucent Liquid Silicone Rubber.Information provided by Dow Corning
Pot Life	1440 min	1440 min
Dow Corning SILASTIC® 94-595-HC SILICONE RUBBER PART A&B 30 Durometer, 2-part, 1 to 1 mix, translucent, Injection Moulding grade, Liquid Silicone Rubber.Information provided by Dow Corning
Pot Life	1440 min	1440 min
Dow Corning SILASTIC® 94-599-HC SILICONE RUBBER PART A&B 47 Durometer, 2-part, 1 to 1 mix, translucent, molding grade, Liquid Silicone Rubber.Information provided by Dow Corning
Pot Life	1440 min	1440 min
Dow Corning SILASTIC® LSR 9682-50 PARTS A&B 50 Durometer, 2-part, 1 to 1 mix, clear Liquid Silicone RubberInformation provided by Dow Corning
Pot Life	1440 min	1440 min
Dow Corning SILASTIC® LSR 9791-70 A&B KIT 70 Durometer, 2-part, 1 to 1 mix, translucent, molding grade, Liquid Silicone Rubber.Information provided by Dow Corning
Pot Life	1440 min	1440 min
Epoxy Technology EPO-TEK® 337H Graphite-Filled, High Temperature Epoxy Product Description: EPO-TEK® 377H is a two component, high Tg, graphite filled epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic ind..
Pot Life	1440 min	1440 min
Epoxy Technology EPO-TEK® 377 High Temperature Epoxy Product Description: EPO TEK®377 is a two component, high Tg, fiber optic grade epoxy adhesive. It is well suited for semiconductor, medical and optical applications.Advantages & Application Notes:..
Pot Life	1440 min	1440 min
Epoxy Technology EPO-TEK® E2001-HV Electrically Conductive, Silver-Filled Epoxy Product Description: EPO-TEK® E2001-HV Is a snap cure, two component, silver-filled die attach adhesive for semiconductor plastic IC packaging.Advantages & Application Notes:Snap cure adhesive or f..
Pot Life	1440 min	1440 min
Epoxy Technology EPO-TEK® E3001 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & ..
Pot Life	1440 min	1440 min
Epoxy Technology EPO-TEK® T7139 Glob Top Epoxy Product Description: EPO-TEK® T7139 is a two component, electrically insulating, encapsulating epoxy designed for semiconductor glob top applications and package assembly.Advantages & Application N..
Pot Life	1440 min	1440 min
Dow Corning 3625 A&B KIT A 2 part solventless liquid silicone rubber that is both hard and heat stable. Shows particularly good adhesion to polyamide as well as glass and has a flexible low friction and non-blocking surface..
Pot Life	1440 min <br>@Temperature 23.0 °C	1440 min <br>@Temperature 73.4 °F
Loctite® 3889 Rapid Cure Isotropic Epoxy Adhesive Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona..