Polymer Property : Pot Life = 240 min Product List

Processing Properties

Tips: 30 items are displayed at most.

Processing Properties	Metric	English	Comments
Pot Life	240 min	240 min
Resin Technology Group 408 Oxy-Bond™ Electrically Conductive Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma..
Pot Life	240 min	240 min
Resin Technology Group 408 Oxy-Bond™ Electrically Conductive Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma..
Pot Life	240 min @Temperature 25.0 °C	240 min @Temperature 77.0 °F
Resin Technology Group TIGA 908 Gold Bonder - Low Stress Silver Conductive 100 parts resin to 6 parts hardener.TIGA 908 is a low stress, conductive silver filled epoxy adhesive. It is recommended for bonding, and sealing electronic applications which require bonding to gol..
Pot Life	240 min @Temperature 25.0 Â°C	240 min @Temperature 77.0 Â°F
Lord Adhesives AeroglazeÂ® 9741 Epoxy Primer/Tie-Coat AeroglazeÂ® 9741 is a two-part epoxy primer designed for use on aluminum, metal, and prepared composite surfaces. Aeroglaze 9741 primer/tie-coat is applied to scuff-sanded urethane top coats and e..
Pot Life	240 min @Temperature 25.0 Â°C	240 min @Temperature 77.0 Â°F
Lord Adhesives AeroglazeÂ® 9744 Epoxy Primer/Tie-Coat AeroglazeÂ® 9744 is a two-part epoxy primer designed for use on aluminum, metal, and prepared composite surfaces. Aeroglaze 9744 primer/tie-coat is applied to scuff-sanded urethane top coats and e..
Pot Life	240 min @Temperature 25.0 °C	240 min @Temperature 77.0 °F
Tra-Con Tra-Bond 221M02 Information provided by Tra-Con Inc.
Pot Life	240 min	240 min
Tra-Con Tra-Bond F123 Color Keyed High Temperature Epoxy Adhesive TRA-BOND F123 is a fast cure, low viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating sin..
Pot Life	240 min	240 min
Tra-Con Tra-Cast FS407 Low Viscosity High Temperature Epoxy Casting System TRA-CAST FS407 is a low viscosity, solvent-free epoxy casting system recommended for rigid industrial laminating, electrical potting and transformer or coil embedding applications that require the e..
Pot Life	240 min	240 min
Tra-Con Tra-Duct 2958 Snap Cure Conductive Silver Epoxy Adhesive TRA-DUCT 2958 is a two-part, smooth paste of specially refined and processed epoxy and silver components, recommended for electronic, microelectronic and die-attach bonding and sealing applications ..
Pot Life	>= 240 min @Temperature 25.0 °C	>= 240 min @Temperature 77.0 °F	100 grams
Trelleborg Emerson & Cuming Eccobond® 11 Heat Cure Catalyst Emerson & Cuming 11 Eccobond® Heat Cure CatalystGeneral purpose, low viscosity, elevated temperature curing. Long working life. Yields cured coatings with excellent chemical resistance. Subject to ..
Pot Life	240 min	240 min
Tra-Con Tra-Bond 526M03 Fast Cure Epoxy Adhesive TRA-BOND 526M03 is a fast cure, high viscosity, two-component epoxy formulation. It develops strong, tough, mechanically stable bonds to a wide variety of fiber optic and optical materials that incl..
Pot Life	240 min	240 min
Tra-Con Tra-Duct 2924 Conductive Silver Epoxy Adhesive TRA-DUCT 2924 is a two part electrically conductive composition developed for low shrinkage, low resistivity bonding applications where good electrical and physical properties over a wide temperatur..
Pot Life	240 - 360 min @Temperature 25.0 °C	240 - 360 min @Temperature 77.0 °F
Cytec Conathane® CC-1155 (Conap) Polyurethane Two-component Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i..
Pot Life	240 min	240 min
Epoxy Technology EPO-TEK® 360T High Temperature Epoxy Material Description: A two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications. It is a thixotropic..
Pot Life	240 min	240 min
Epoxy Technology EPO-TEK® 375 High Temperature Epoxy Product Description: EPO-TEK®375 is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. Also available in a single component frozen sy..
Pot Life	240 min	240 min
Epoxy Technology EPO-TEK® E4110 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E4110 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other..
Pot Life	240 min	240 min
Epoxy Technology EPO-TEK® EJ2189 Electrically Conductive Epoxy Product Description: EPO-TEK® EJ2189 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although othe..
Pot Life	240 min	240 min
Epoxy Technology EPO-TEK® EJ2189-LV Electrically Conductive Epoxy Low Viscosity, two component room temp curing conductive epoxyInformation Provided by Epoxy Technology
Pot Life	240 min	240 min
Epoxy Technology EPO-TEK® EV2002 Silver-filled, electrically conductive, flexible epoxy Material Description: Silver-filled, electrically conductive, flexible epoxyInformation Provided by Epoxy Technology
Pot Life	240 min	240 min
Epoxy Technology EPO-TEK® OE101 Two Component Epoxy Material Description: A two component epoxy designed for low stress applications in fiber optic packaging, opto-electronics and semiconductors. It is a lower modulus version of EPO-TEK® 353ND.Inf..
Pot Life	240 min	240 min
Epoxyset Epoxiohm EO-21M-5 Electrically Conductive Epoxy Adhesive EO-21M-5 is an electrically conductive & thermally conductive, silver filled epoxy adhesive. This two component system is designed to be cured at room temperature or the cure can be accelerated by e..
Pot Life	240 min	240 min
Epoxyset Epoxiohm EO-30M-1 Electrically Conductive Epoxy Adhesive EO-30M-1 is a two part, semi-rigid, silver filled, epoxy adhesive. EO-30M-1 exhibits superior adhesion to a wide variety of substrates including most metals, ceramics, glass and plastics.Information..
Pot Life	240 min @Temperature 75.0 °C	240 min @Temperature 167 °F
ACC EP WQS EPI Engineered Polymers Water Base Quick Set Epoxy EP WQS Water Base Quick Set, “Powered by Reactamine® Technology”, is a two component 60% solids, no VOC, self-leveling modified epoxy. This versatile new generation epoxy displays low blush, fast..
Pot Life	>= 240 min @Temperature 23.0 °C	>= 240 min @Temperature 73.4 °F	100 g mass
Aremco Aremco-Bond™ 2340 High Temperature Epoxide Potting Compound High Temperature, Low Viscosity, Low Expansion, High Glass Transition Temperature & Chemical Resistance
Pot Life	240 min @Temperature 25.0 °C	240 min @Temperature 77.0 °F	100 gm mass
Aremco Aremco-Bond™ 631 High Performance Epoxide Clear-Amber, 1:1, Good Bond Strength and Corrosion Resistance.Also available filled with aluminum oxide (Alumina) or pigments.
Pot Life	240 min	240 min	500 g
Abatron AboCast 50-11/AboCure 50-1 Epoxy Information provided by Abatron, Inc.Processing: Shelf life: 12+ months (unmixed). 100/35 ratio. Pot life: 500 g, 240 min. at 25°C(77°F). Exothermic Peak 190°C (375°F). Hardens in 2-24 hours..
Pot Life	>= 240 min @Temperature 24.0 °C	>= 240 min @Temperature 75.2 °F	2 lb. mass
BCC Products BC 7062-3H Epoxy Casting BC 7062 are aluminum filled, low viscosity epoxy mass casting resins. These room temperature cure systems allow the user choice thicknesses of 1/8 inch to a maximum of 6 inches without foaming or yi..
Pot Life	240 min	240 min
Aremco Aremco-Bond™ 598 Conductive Epoxy Adhesive  (discontinued **) Electrically and thermally conductive, nickel-filled, single part system. Low viscosity, inorganic coating for applications to 1000 ºF (540 °C).