Polymer Property : Pot Life = 60 min Product List

Processing Properties

Tips: 30 items are displayed at most.

Processing Properties	Metric	English	Comments
Pot Life	60 - 90 min	60 - 90 min	Mass: 50g; TM R050-19
Resinlab® EP1121 Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP1121 Clear is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I..
Pot Life	60 - 120 min	60 - 120 min	Mass: 100g
Resinlab® EP324E Clear Two Part Epoxy Casting Resin Resinlab™ EP 324E Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wettin..
Pot Life	>= 60 min	>= 60 min
Abatron 85082 A/B Filled Potting Compound  (discontinued **) Black and colors casting, adhesive, potting, embedding, and coating system. 1/1 variable ratio.Information provided by Abatron.
Pot Life	>= 60 min	>= 60 min
Abatron CARBEPOXLL A/B Filled Potting Compound  (discontinued **) Carbide filled dielectric, structural, and castable. 8/1 ratio.Information provided by Abatron.
Pot Life	60 min	60 min
NextGen Adhesives G907-08 Epoxy Adhesive Description: NGAC G907-08 is a low viscosity, electrically insulating, heat cured and 2-part adhesive systems designed for applications where temperature and chemical resistance is critical. The NGA..
Pot Life	60 min	60 min
Parker Chomerics CHO-BOND 360-20 Conductive Epoxy Low cost, electrically conductive epoxy adhesive that combines the good adhesive characteristics as epoxy, and the superior electrical conductivity of silver. It is recommended as a thermo-setting E..
Pot Life	60 min	60 min
Henkel Hysol EA 9377 Paste Adhesive System Moldable plastic shim, excellent microcracking resistance under thermal cycling. High compressive strength.Application: Liquid Shim
Pot Life	60 - 75 min	60 - 75 min	100 grams
Master Bond EP21LVMed Two Component, Low Viscosity USP Class VI Epoxy Master Bond EP21LVMed is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily at room tempera..
Pot Life	60 - 75 min	60 - 75 min	200 gram mass
Master Bond EP21TDCN Two Component Nickel Conductive Epoxy Adhesive Product Description: Master Bond Polymer System EP21TDCN is a two component, nickel filled, electrically conductive, adhesive for high performance bonding, formulated to cure at room temperature or ..
Pot Life	60 min	60 min	25 grams
Tra-Con Tra-Bond 2143G Medium Viscosity Polyamide Epoxy Adhesive TRA-BOND 2143G is a medium viscosity adhesive recommended for industrial bonding and sealing applications where toughness, impact resistance, and superior mechanical properties are required. This tw..
Pot Life	60 min	60 min
Tra-Con Tra-Bond 2170 Flexible Plastic Bonder TRA-BOND 2170 is a flexible thixotropic bonding adhesive designed for bonding all types of plastics including nylon, PVC, polyethylene, acrylic, lexan, polypropylene, kapton or almost any thermoplas..
Pot Life	60 min	60 min
Tra-Con Tra-Duct 916H04 Room Temperature Cure, Conductive Silver Epoxy Adhesive TRA-DUCT 916H04 is an electrically conducting silver-filled epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical pr..
Pot Life	60 - 75 min	60 - 75 min	100 gram batch
Master Bond EP30LV Optically Clear, Low Viscosity Epoxy Adhesive Description: Master Bond Polymer System EP30LV is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or mo..
Pot Life	60 - 90 min	60 - 90 min	100 gram mass
Master Bond Supreme 33 High Temperature Resistant, Structural Adhesive Description: Master Bond Polymer System Supreme 33 is a unique, room temperature curing, toughened epoxy adhesive/sealant, offering high temperature resistance. This innovative system offers high bo..
Pot Life	60 - 90 min	60 - 90 min
Master Bond Supreme 33CLV Two Component, Room Temperature Curing Toughened Epoxy Master Bond Polymer System Supreme 33CLV is a special, room temperature curing, toughened epoxy adhesive/sealant, featuring exceptionally high temperature resistance. This innovative system has outs..
Pot Life	60 min	60 min	100 grams
Tra-Con Tra-Bond 2110 High Impact Epoxy Staking Compound TRA-BOND 2110 is a thixotropic epoxy resin and hardener formulation developed for industrial adhesive, staking, laminating, repair and manufacturing applications where long pot-life, good wetting, n..
Pot Life	60 min	60 min
Tra-Con Tra-Bond Ablebond 724-1 Polyurethane Adhesive Ablebond 724-1 premixed and frozen, polyurethane adhesive is designed for good adhesion, providing strong resilient bonds to a wide variety of substrates.Information provided by Tra-Con Inc.
Pot Life	60 min	60 min	25 grams
Tra-Con Tra-Bond FS437 Low Viscosity High Impact Epoxy Adhesive TRA-BOND FS437 is a two-part, low viscosity material formulated for optical applications which require excellent wicking, visible color and high strength. This material has been used successfully fo..
Pot Life	60 min	60 min
Tra-Con Tra-Duct 2902 Room Temperature Conductive Silver Epoxy Adhesive TRA-DUCT 2902 is an electrically conducting silver-filled epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical prop..
Pot Life	60 min	60 min
Epoxy Technology EPO-TEK® 305 Spectrally Transparent Epoxy Product Description: EPO-TEK® 305 is a two component, semi-rigid, optical grade epoxy for semiconductor packaging of fiber optics, optoelectronics and medical devices. It is an electrically and th..
Pot Life	60 min	60 min
Abatron AboWeld 8104-12 Polysulfide-Epoxy Sealant and Caulk AboWeld 8104-12 is a 2-part, 100% solids, liquid or filled polysulfide-epoxy. It is available in many colors. It is often used with sand and gravel to mix grouts for filling and resurfacing. It is p..
Pot Life	60 - 120 min	60 - 120 min
Aremco Ceramacast™ 675 High Temperature Potting & Casting Material Aluminum Nitride Fine grain aluminum nitride castable with high thermal conductivity
Pot Life	60 min	60 min
Abatron Metalfix-L™ Aluminum-Filled, Structural Adhesive Putty; Liquid Metalfix-L™ is a fluid-pourable version of MetalFix-P™. For patterns, molds, prototypes, casting, and all applications where a castable, fluid, MetalFix-P™ is needed. Excellent for tooling. Techn..
Pot Life	60 min	60 min	Mass: 5g; TM R050-19
Resinlab® SEC1233 Silver Filled Epoxy Adhesive Resinlab™ SEC1233 is a silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature. SEC1233 provides excellent electrical conductivit..
Pot Life	60 min	60 min
Henkel Hysol EA 9313 Paste Adhesive System Very low viscosity adhesive yielding tough, flexible bonds. Injectable.
Pot Life	60 min	60 min
Henkel Hysol EA 9330 Paste Adhesive System Easy mix adhesive with high peel strength and excellent environmental durability.Applications: Structural Repair Composite Bonding
Pot Life	60 - 90 min	60 - 90 min	100 gram batch
Master Bond EP33LV Epoxy Has Dimensional Stability and Machinability Description: Master Bond EP33LV is a two part, room temperature curing epoxy system used for bonding, sealing and coating featuring high temperature resistance, good dimensional stability and very g..