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- Polymer Property : Pot Life = 90 min
Polymer Property : Pot Life = 90 min Product List
Processing PropertiesTips: 30 items are displayed at most.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Pot Life | 90 - 120 min | 90 - 120 min | Mass: 100g; TM R050-19 |
|
Resinlab® EP1121-4 Adhesive / Casting Resin
Resinlab™ EP1121-4 is a highly filled, high viscosity black adhesive / casting resin designed for applications requiring a high degree of thermal conductivity, flexibility, and a low CTE. It gives ..
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| Pot Life | 90 min | 90 min | |
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Resin Technology Group 401 Oxy-Bond™ Electrically Conductive Epoxy Adhesive
Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma..
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| Pot Life | 90 min | 90 min | |
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Resin Technology Group 401 Oxy-Bond™ Electrically Conductive Epoxy Adhesive
Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma..
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| Pot Life | >= 90 min | >= 90 min | |
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Abatron 225 A/B Filled Potting Compound
(discontinued **)
Dielectric structural potting and embedding adhesive. Higher impact, green and most colors. 10/3 variable ratio.Information provided by Abatron.
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| Pot Life | 90 min | 90 min | |
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Huntsman HZ 340 Polyamide
Approx. H+ equivalent weight 113. Mix Ratio with GY 6010 is 120.Comments/Applications: Solvent free, water-based polyamide with good adhesion. For use in coatings for plaster, concrete, masonry, ..
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| Pot Life | 90 - 120 min | 90 - 120 min | Time before parts must be mated |
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Lord Adhesives 309 General Purpose, Non-Sag, Thixotropic Epoxy Adhesive
Lord Epoxy AdhesivesLord® Epoxy Adhesives create superior bonds for rubber, SMC, plastics and metals. Our epoxy adhesives are widely used in the automotive industry, over 10 million cars and ligh..
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| Pot Life | 90 - 150 min | 90 - 150 min | Time before parts must be mated |
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Lord Adhesives 312 General Purpose, Low Viscosity Epoxy Adhesive
Lord Epoxy AdhesivesLord® Epoxy Adhesives create superior bonds for rubber, SMC, plastics and metals. Our epoxy adhesives are widely used in the automotive industry, over 10 million cars and ligh..
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| Pot Life |
90
-
120
min <br>@Temperature 25.0 °C
|
90
-
120
min <br>@Temperature 77.0 °F
|
54g mass |
|
Lord Adhesives Fusor® 309-1D / 309-2D Epoxy Adhesive
Lord® 309 is a high performance, thixotropic, two-part epoxy adhesive that is used for applications that require gap filling or non-slumping characteristics on a vertical substrate. The cured adh..
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| Pot Life | 90 - 105 min | 90 - 105 min | |
|
ITW Plexus Plexusâ„¢ MA590 Methacrylate Adhesive
Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.All purpose, long open time product and bond lines up to 1" thickInformation provided by Illinois ..
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| Pot Life | >= 90 min | >= 90 min | 100 gram mass |
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Master Bond EP21ANHT Two Component, Room Temperature Curing Epoxy Adhesive
Product Description: Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that combines high thermal conductivity and electrical insulation ..
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| Pot Life | 90 - 120 min | 90 - 120 min | 100 gram mass |
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Master Bond EP21NDFG Two component epoxy compound for high performance applications
Product Description: Master Bond EP21NDFG is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties, easy processing and a non-drip, paste-like consistency..
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| Pot Life | 90 - 120 min | 90 - 120 min | 100 gram mass |
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Master Bond EP21NDLO Low Outgassing, Room Temperature Curing Two Component Epoxy
Master Bond EP21ND-LO is a two component, room temperature curing epoxy system for bonding, sealing and coating featuring outstanding physical properties. EP21ND-LO has a convenient one to one mix r..
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| Pot Life | >= 90 min | >= 90 min | 100 gram mass |
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Master Bond EP21TDC-4 Two Component, Highly Flexible Epoxy System
Master Bond Polymer System EP21TDC-4 is a two component, flexible epoxy resin system for high performance bonding, sealing and coating. It is formulated to cure at ambient temperatures or more quick..
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| Pot Life | 90 - 120 min | 90 - 120 min | 100 gram mass |
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Master Bond EP21TDCHTND Versatile, toughened two component epoxy for bonding, sealing and coating
Product Description: Master Bond EP21TDCHTND is a two component epoxy adhesive, sealant and coating featuring high performance, versatility and exceptional user friendliness. It has a very forgiving..
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| Pot Life | 90 - 120 min | 90 - 120 min | 100 gram mass |
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Master Bond EP21TPFL-1AO Two Part, Flexible, Lower Viscosity Epoxy Polysulfide System
Product Description: Master Bond EP21TPFL-1AO is a two component, low viscosity epoxy polysulfide for high performance bonding, sealing, coating and casting offering thermal conductivity, electrical..
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| Pot Life | 90 min | 90 min | 25 grams |
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Tra-Con Tra-Bond 2110 High Impact Epoxy Staking Compound
TRA-BOND 2110 is a thixotropic epoxy resin and hardener formulation developed for industrial adhesive, staking, laminating, repair and manufacturing applications where long pot-life, good wetting, n..
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| Pot Life | 90 min | 90 min | |
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Epoxy Technology EPO-TEK® 310M-2 Optically Clear, Flexible Epoxy
Material Description: A two component, optically clear, flexible epoxy adhesive designed for optical applications within semiconductor, fiber optic and medical industries. An alternative to EPO-TEK..
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| Pot Life | 90 min | 90 min | |
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Epoxy Technology EPO-TEK® 320-3 Optically Opaque Epoxy
Material Description: A two component, black-colored and optically opaque epoxy designed for optical, medical, and opto-electronic packaging of semiconductor devices and components. It is a modific..
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| Pot Life | 90 min | 90 min | |
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Epoxy Technology EPO-TEK® 731 Epoxy Adhesive
Material Description: A two component, thixotropic, room temperature-curing epoxy adhesive. It is an electrically and thermally insulating epoxy designed for general applications in semiconductor p..
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| Pot Life | 90 min | 90 min | |
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Epoxy Technology EPO-TEK® OE188 High Temperature Silica-Filled Epoxy
Product Description: EPO-TEK® OE188 is a low CTE, designed for semiconductor and fiber optic applications. Advantages & Application Notes: Paste-like viscosity allows for application by dispensing..
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| Pot Life |
90
min <br>@Temperature 25.0 °C
|
90
min <br>@Temperature 77.0 °F
|
500 g |
|
Abatron AboCast 8503-4/AboCure 8503-4 Colorless Epoxy
AboCast 8503-4/AboCure 8503-4 is a general purpose, moderate speed, colorless epoxy casting compound with low viscosity. It offers a convenient 2/1 ratio by volume and lends itself to casting of thi..
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| Pot Life | 90 min | 90 min | |
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BASF Master Builders Solutions ChemRex® CX Concrete Floor Primer - Epoxy
CX Concrete Floor Primer is a waterborne epoxy primer for concrete substrates. It is designed to manage and reduce moisture vapor emission (out-gassing) of concrete slabs by controlling the rate of..
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| Pot Life |
90
min <br>@Temperature 24.0 °C
|
90
min <br>@Temperature 75.2 °F
|
2 lb. mass |
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BCC Products BC 7009-1 Epoxy Casting
BC 7009-1 is an iron filled, low-cost mass casting system. Thicknesses up to two inches in non-conductive molds, and four inches in conductive molds can be achieved without foaming or yielding exces..
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| Pot Life |
90
min <br>@Temperature 25.0 °C
|
90
min <br>@Temperature 77.0 °F
|
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BCC Products BC 9040 T Silicone RTV Rubber
BC 9040T is a clear, addition/platinum cure, two-component, flowable compound that, regardless of thickness or confinement, cures at room temperature or by application heat. The cured rubber is high..
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| Pot Life | 90 min | 90 min | 10 grams |
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Tra-Con Tra-Duct 2929 Room Temperature Conductive Flexible Silver Epoxy Adhesive
TRA-DUCT 2929 is recommended for electronic bonding, coating and sealing applications that require high flexibility coupled with excellent electrical and mechanical properties. This two-part epoxy a..
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| Pot Life | 90 - 120 min | 90 - 120 min | Mass: 100g; TM R050-19 |
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Resinlab® EP1282 Clear Unfilled Electronic Grade Epoxy Encapsulant
Resinlab™ EP1282 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It is recognized under the Component Recognition Program of Underwriters Laborat..
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| Pot Life | 90 min | 90 min | |
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Loctite® Durabond® E-90FL Epoxy Adhesive
Epoxy AdhesivesLoctite offers a complete line of one-part and two-part epoxy and urethane adhesives for structural bonding, potting and encapsulating. The Loctite® Durabond® line contains 14 appli..
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| Pot Life | 90 - 120 min | 90 - 120 min | Mass: 100g; TM R050-19 |
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Resinlab® EP1282 Black Unfilled Electronic Grade Epoxy Encapsulant
Resinlab™ EP1282 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It is recognized under the Component Recognition Program of Underwriters Laborat..
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