Polymer Property : Cure Time = 0.0833 hour Product List

Processing Properties

Tips: 30 items are displayed at most.

Processing Properties	Metric	English	Comments
Cure Time	5.00 - 10.0 min @Temperature 150 °C	0.0833 - 0.167 hour @Temperature 302 °F
Resinlab® EP1320 Heat Cure Epoxy Conformal Coating Resinlab™ EP1320 and EP1320LV are one part heat cure epoxy conformal coatings. They can also be used as a small mass potting compounds, structural adhesives, or insulating polymer systems where the..
Cure Time	5.00 - 10.0 min @Temperature 150 °C	0.0833 - 0.167 hour @Temperature 302 °F
Resinlab® EP1320LV Heat Cure Epoxy Conformal Coating Resinlab™ EP1320 and EP1320LV are one part heat cure epoxy conformal coatings. They can also be used as a small mass potting compounds, structural adhesives, or insulating polymer systems where the..
Cure Time	5.00 - 10.0 min @Temperature 150 °C	0.0833 - 0.167 hour @Temperature 302 °F
Resinlab® EP1325 Thixotropic, Heat Curing Epoxy Adhesive Resinlab™ EP1325 and EP1325LV are one part thixotropic, heat curing epoxy adhesives. They can also be used as a small mass potting compounds, staking or damming adhesives, or polymer systems where ..
Cure Time	5.00 min @Temperature 150 Â°C	0.0833 hour @Temperature 302 Â°F	Press Cure
Shin-Etsu Silicones LIMSâ„¢ KEG2000-60A/B Elastomer KEG2000-60 is a liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. Its viscosity is low enough to allow easy pum..
Cure Time	5.00 min @Temperature 150 Â°C	0.0833 hour @Temperature 302 Â°F	Press Cure
Shin-Etsu Silicones LIMSâ„¢ KEG2002-50A/B Elastomer Information Provided by Shin-Etsu Silicones of America, Inc.
Cure Time	5.00 min @Temperature 150 °C	0.0833 hour @Temperature 302 °F
Tra-Con Tra-Duct 925M01 Low Ion Snap Cure Silver-Filled Epoxy TRA-DUCT 925M01 is a low ion snap cure silver-filled epoxy. TRA-DUCT 925M01 develops strong, durable, void free electrically and thermally conducting bonds. The product can be screen printed, stenci..
Cure Time	5.00 min @Temperature 85.0 °C	0.0833 hour @Temperature 185 °F
Loctite® 3180 Deep Potting Polyurethane PottersLoctite® Potting materials are used on electronic device housings to enhance mechanical strength, provide electrical insulation and enhance vibration and shock resistance of assemblies. For ..
Cure Time	5.00 min @Temperature 120 °C	0.0833 hour @Temperature 248 °F	Minimum Bond Line
Epoxy Technology EPO-TEK® 330 Low Viscosity, Optical Epoxy Product Description: EPO-TEK® 330 is a two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications.Advan..
Cure Time	5.00 min @Temperature 120 °C	0.0833 hour @Temperature 248 °F	Minimum Bond Line
Epoxy Technology EPO-TEK® 353ND-T High Temperature Thixotropic Epoxy Product Description: EPO TEK® 353ND-T is a two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance. Advantages & Application Notes: Suitable for fiber op..
Cure Time	5.00 min @Temperature 120 °C	0.0833 hour @Temperature 248 °F	Minimum Bond Line
Epoxy Technology EPO-TEK® 353ND-T5 High Temperature Thixotropic Epoxy Product Description: EPO-TEK® 353ND-T5 is an intermediate viscosity version of EPO-TEK® 353ND and EPO-TEK® 353ND-T. It was designed for high temperature applications in fiber optics, electronics ..
Cure Time	5.00 min @Temperature 150 °C	0.0833 hour @Temperature 302 °F	Minimum Bond Line
Epoxy Technology EPO-TEK® H22 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages.Advantages & Application Notes: A smooth, ..
Cure Time	5.00 min @Temperature 75.0 °C	0.0833 hour @Temperature 167 °F
Dow Corning 3-4207 DIELECTRIC TOUGH GEL KIT Two-part, translucent green, fast RT or heat cure, tough, primerless chemical adhesion, UV indicator, and UL 94 V-1 flammability classification.Information provided by Dow Corning
Cure Time	5.00 min @Temperature 100 °C	0.0833 hour @Temperature 212 °F
Atom Adhesives AA-BOND F123BK Epoxy Adhesive AA-BOND F123BK is a low viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating single or mul..
Cure Time	5.00 min @Temperature 125 °C	0.0833 hour @Temperature 257 °F
Atom Adhesives AA-BOND F253 Epoxy Adhesive AA-BOND F253 is a low viscosity, high temperature, two-part epoxy formulation that changes color during the curing process to indicate cure status.Appearance: Unmixed-Light Yellow; Mixed – Greenish..
Cure Time	5.00 min @Temperature 125 °C	0.0833 hour @Temperature 257 °F
Henkel Frekote 55-NC Mold Release Agent A non-CFC release agent designed to provide multiple releases with no contaminating transfer. This semi permanent release system chemically bonds to the mold surface to form a microthin film that is..