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Polymer Property : Cure Time = 0.500 hour Product List
Processing PropertiesTips: 30 items are displayed at most.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time |
30.0
min @Temperature 150 °C |
0.500
hour @Temperature 302 °F |
Tack Free Time |
|
Parker Chomerics CHOFORM® 5550 Conductive Form-in-Place Gasket
Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material..
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|||
| Cure Time |
30.0
min @Temperature 93.3 °C |
0.500
hour @Temperature 200 °F |
De-mold Time |
|
Northstar Polymers MSS-A90A High Performance Polyurethane Cast Elastomer System 90A
This is a Ester/MDI base high-performance polyurethane casting system. This systems is recommended to applications in which the part requires high tensile strength, cut/tear resistance, dry-abrasio..
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| Cure Time |
30.0
min @Temperature 23.0 °C |
0.500
hour @Temperature 73.4 °F |
Brass, working strength |
|
Permabond F202 Anaerobic Retainer
The unique 'toughening' process incorporated into Permabond® F202 gives this anaerobic adhesive excellent resistance to peel and impact forces. Primarily designed for use on metal surfaces, it is a..
|
|||
| Cure Time |
30.0
min @Temperature 23.0 °C |
0.500
hour @Temperature 73.4 °F |
Brass, handling strength |
|
Permabond LH050 Anaerobic Threadsealant
Permabond® LH050 pipe sealant with PTFE is a general purpose pipe sealant that provides instant air pressure seal up to 1000 psi with limited hand tightening. After cure, the sealing capability is ..
|
|||
| Cure Time |
30.0
min @Temperature 23.0 °C |
0.500
hour @Temperature 73.4 °F |
Zinc, handling strength |
|
Permabond LM012 Anaerobic Threadsealant
Permabond® LM012 is an unfilled, medium viscosity anaerobic adhesive. Its major benefit as related to other pipe sealants is that it is an unfilled resin that is compatible with hydraulic fluids. I..
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|||
| Cure Time |
30.0
min @Temperature 25.0 °C |
0.500
hour @Temperature 77.0 °F |
Initial |
|
Lord Adhesives Thermosetâ„¢ UR-322 Two Component Urethane Potting Compound
Lord UR-322 is a two component, room temperature curing urethane potting compound. The cured elastomer is soft, flexible and has a very low modulus at temperatures down to -80°C. Cured UR-322 als..
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|||
| Cure Time |
30.0
min @Temperature 150 °C |
0.500
hour @Temperature 302 °F |
|
|
Gwent Electronic Materials C2020425D1 Curable Silver Range
This product is based on a unique curing process that results in the low temperature formation of a thermosetting conductive adhesive that combines good adhesion with excellent electrical properties..
|
|||
| Cure Time |
30.0
min @Temperature 60.0 °C |
0.500
hour @Temperature 140 °F |
|
|
Gwent Electronic Materials C2030812D3 Silver/Silver Chloride Paste
Silver/Silver Chloride Paste has a ratio of Silver to Silver Chloride of 60/40. Applications in medical diagnostics, environmentalScreen Printing Equipment: semi-automatic, manualScreen Types: polye..
|
|||
| Cure Time |
30.0
min @Temperature 60.0 °C |
0.500
hour @Temperature 140 °F |
|
|
Gwent Electronic Materials C2040308D2 Silver/Silver Chloride Paste
Silver/Silver Chloride Paste has a ratio of Silver to Silver Chloride of 40/60. The paste is in a ready to use form at a viscosity suitable for automatic or semi-automatic screen printing. The paste..
|
|||
| Cure Time |
30.0
min @Temperature 180 °C |
0.500
hour @Temperature 356 °F |
|
|
Gwent Electronic Materials C2041206P2 Gold Polymer Electrode Paste
Gold paste is a screen printable gold polymer paste designed as a working electrode in electrochemical biosensors. This is used as a working electrode in medical diagnostics, environmental sensor a..
|
|||
| Cure Time |
30.0
min @Temperature 80.0 °C |
0.500
hour @Temperature 176 °F |
|
|
Gwent Electronic Materials D2070412D3 Polymer Dielectric
Green colored screen printable polymer dielectric, suitable for defining electrode areas and forms a protective layer over the electrode tracking during immersion of the electrode. The formulation ..
|
|||
| Cure Time |
30.0
min @Temperature 120 °C |
0.500
hour @Temperature 248 °F |
|
|
Tra-Con Tra-Bond 642-1 Epoxy Adhesive
TRA-BOND 642-1 unfilled epoxy adhesive is designed to provide a long pot life and cure rapidly at elevated temperatures. Information provided by Tra-Con Inc.
|
|||
| Cure Time |
30.0
min @Temperature 120 °C |
0.500
hour @Temperature 248 °F |
|
|
Tra-Con Tra-Duct 921M01 Low Viscosity Long Pot Life Silver-Filled Epoxy
TRA-DUCT 921M01 is a two component, silver-filled electrically conductive epoxy adhesive designed for applications which require electrical conductivity and a long pot life at a relatively low heat ..
|
|||
| Cure Time |
30.0
min @Temperature 125 °C |
0.500
hour @Temperature 257 °F |
|
|
Tra-Con Tra-Bond Ablebond 868-7U Thixotropic Epoxy Adhesive
Ablebond 868-7UNF is the unfilled version of 868-7, a nonsagging, flexible epoxy adhesive. Information provided by Tra-Con Inc.
|
|||
| Cure Time |
30.0
min @Temperature 120 °C |
0.500
hour @Temperature 248 °F |
Minimum Bond Line |
|
Epoxy Technology EPO-TEK® 354 High Temperature Epoxy
Product Description: EPO-TEK® 354 is a two component, high Tg epoxy designed for semiconductor packaging in medical, fiber optic and optoelectronic assemblies. It is an electrically and thermally i..
|
|||
| Cure Time |
30.0
min @Temperature 100 °C |
0.500
hour @Temperature 212 °F |
minimum |
|
Epoxy Technology EPO-TEK® OD2002 High Temperature Epoxy
Material Description: High Tg version of EPO-TEK®353ND with low modulus and good toughness. Replacement for EPO-TEK® 364. Complies with USP Class VI biocompatibility standards.Information Provid..
|
|||
| Cure Time |
30.0
min @Temperature 80.0 °C |
0.500
hour @Temperature 176 °F |
Pre-Bake, Minimum Bond Line |
|
Epoxy Technology EPO-TEK® P1011 Electrically Conductive Modified Polyimide
Product Description: EPO-TEK® P-1011 is a single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronic and optoelectronic applications.Advantages & Appl..
|
|||
| Cure Time |
30.0
min @Temperature 80.0 °C |
0.500
hour @Temperature 176 °F |
Pre-Bake, Minimum Bond Line |
|
Epoxy Technology EPO-TEK® P1011S Electrically Conductive Modified Polyimide
Product Description: EPO-TEK® P1011S is a single component, modified polyimide, high temperature grade, silver-filled electrically and thermally conductive adhesive designed for semiconductor die-a..
|
|||
| Cure Time |
30.0
min @Temperature 150 °C |
0.500
hour @Temperature 302 °F |
|
|
Epoxyset Epoxibond EB-119SP Unfilled Epoxy Adhesive
A two-component, unfilled, high temperature epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc...
|
|||
| Cure Time |
30.0
min @Temperature 93.3 °C |
0.500
hour @Temperature 200 °F |
Step 1, preceeded by >30 min. air set |
|
Aremco Aremco-Seal™ 617 High Temperature Glass Coating
Glass-filled adhesive/sealer for use with porous ceramics and refractories to 1500 ºF (816 ºC).
|
|||
| Cure Time |
30.0
min @Temperature 150 °C |
0.500
hour @Temperature 302 °F |
Full Cure |
|
Parker Chomerics CHOFORM® 5560 Conductive Form-in-Place Gasket
Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material..
|
|||
| Cure Time |
30.0
min @Temperature 100 °C |
0.500
hour @Temperature 212 °F |
|
|
Tra-Con Tra-Bond 970-1N1 General Purpose Epoxy Adhesive
TRA-BOND 970-1N1 is a general purpose epoxy that exhibits sag resistance and excellent bond strength to a wide variety of substrates. Information provided by Tra-Con Inc.
|
|||
| Cure Time |
30.0
-
180
min @Temperature 50.0 - 100 °C |
0.500
-
3.00
hour @Temperature 122 - 212 °F |
Optional |
|
Abatron 8602-2 A/B Carbon-Filled Electrically Conductive Epoxy Compound
8602-2 A/B is a solventless carbon-epoxy system used as an adhesive and silk-screening material with anti-static and other lower-conductivity requirements.
|
|||
| Cure Time |
30.0
min @Temperature 23.0 °C |
0.500
hour @Temperature 73.4 °F |
Brass, working strength |
|
Permabond A1044 Anaerobic Threadsealant
Permabond® A1044 is a rapid curing sealant designed to lock and seal metal pipe connections, offering very good resistance to even the most aggressive chemicals. Permabond A1044 can be used to seal..
|
|||
| Cure Time |
30.0
min @Temperature 23.0 °C |
0.500
hour @Temperature 73.4 °F |
M10 steel, working strength |
|
Permabond A1046 Anaerobic Retainer
Permabond® A1046 is a rapid curing adhesive designed to provide permanent locking and sealing of metal parts such as bearings, gears, pulleys and threaded components. It exhibits high strength and ..
|
|||
| Cure Time |
<=
30.0
min @Temperature 23.0 °C |
<=
0.500
hour @Temperature 73.4 °F |
M10 steel, handling strength |
|
Permabond A136 Anaerobic Gasketmaker
Permabond® A136 is an anaerobic material designed for making 'formed in situ' gaskets between metal surfaces. It is capable of replacing a wide range of conventional gaskets thereby offering potent..
|
|||
| Cure Time |
30.0
min @Temperature 177 °C |
0.500
hour @Temperature 350 °F |
Recommended Cure Cycle |
|
Arlon 30850S085 0.085" Uncured, Unsupported Silicone Rubber on Release Carrier
Design/Construction:Side 1: Uncured, Unsupported Silicone RubberSubstrate: Kodacel CarrierInterleave: 0.003" PolyethyleneThis data represents typical values for the production material and should..
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