- HOME
- POLYMER SEARCH
- Polymer Property : Cure Time = 1.00 hour
Polymer Property : Cure Time = 1.00 hour Product List
Processing PropertiesTips: 30 items are displayed at most.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time |
60.0
min <br>@Temperature 23.8 °C
|
1.00
hour <br>@Temperature 74.8 °F
|
and 6 hours at 65.5°C |
|
Parker Chomerics CHO-SHIELD® 576 Platable Silver Epoxy Coating
Description: CHO-SHIELD® 576 coating is a two component, silver filled, highly conductive epoxy paint designed to provide EMI shielding when applied to a dielectric plastic substrate. This coating ..
|
|||
| Cure Time |
60.0
min <br>@Temperature 23.0 °C
|
1.00
hour <br>@Temperature 73.4 °F
|
Zinc, handling strength |
|
Permabond LH150 Anaerobic Threadsealant
Permabond® LH150 Pipe Sealant with PTFE is designed for sealing and locking tapered metal pipe threads and fittings. It is ideal for stainless steel and other passive metals. Instant sealing of up ..
|
|||
| Cure Time |
60.0
-
240
min <br>@Temperature 65.0 °C
|
1.00
-
4.00
hour <br>@Temperature 149 °F
|
|
|
Resin Technology Group TIGA 901 Room Temperature Curing Silver Conductive Epoxy
100 parts resin to 6 parts hardener. Cure 24 hours at 25°C, 1-4 hours at 65°C, 30-60 minutes at 125°C, or 30 minutes at 150°C.TIGA 901 is an electrically conductive, silver filled epoxy adhesiv..
|
|||
| Cure Time |
60.0
min <br>@Temperature 130 °C
|
1.00
hour <br>@Temperature 266 °F
|
box oven |
|
Gwent Electronic Materials C2100203D2 Silver Ink
This product is part of a range of Heat Curable Inks. These products are based on a unique curing process that results in the low temperature formation of a thermosetting polymer. This ink has exce..
|
|||
| Cure Time |
60.0
min <br>@Temperature 150 °C
|
1.00
hour <br>@Temperature 302 °F
|
Post Cure |
|
Shin-Etsu Silicones LIMSâ„¢ KE2004-20A/B Elastomer
Information Provided by Shin-Etsu Silicones of America, Inc.
|
|||
| Cure Time |
60.0
-
90.0
min <br>@Temperature 177 °C
|
1.00
-
1.50
hour <br>@Temperature 350 °F
|
|
|
Master Bond EP17HT-LO One component epoxy system for bonding, sealing, coating and casting
Product Description: Master Bond EP17HT-LO is a one component, heat cured epoxy system for bonding, sealing, coating and encapsulating. It features good physical properties, electrical insulation pr..
|
|||
| Cure Time |
60.0
-
120
min <br>@Temperature 93.3 °C
|
1.00
-
2.00
hour <br>@Temperature 200 °F
|
|
|
Master Bond EP30 Optically Clear, Low Viscosity Two Component Epoxy
Master Bond Polymer System EP30 is a low viscosity, two component epoxy system for high performance bonding, coating, sealing, potting and encapsulation. It readily cures at room temperature or more..
|
|||
| Cure Time |
60.0
-
120
min <br>@Temperature 93.3 °C
|
1.00
-
2.00
hour <br>@Temperature 200 °F
|
|
|
Master Bond EP30ANHT Two Part, Electrically Isolating Epoxy Adhesive
Description: Master Bond Polymer System EP30ANHT is a two part epoxy system with terrific thermal conductivity, while maintaining electrical insulation. One noteworthy property is its wide service t..
|
|||
| Cure Time |
60.0
min <br>@Temperature 65.6 - 93.3 °C
|
1.00
hour <br>@Temperature 150 - 200 °F
|
|
|
Master Bond EP51FL Toughened and Flexible Adhesive Compound
Master Bond EP51FL is a two component epoxy system for high performance bonding sealing and coating. It combines superior toughness with user friendly handling properties, along with unusually fast ..
|
|||
| Cure Time |
60.0
-
120
min <br>@Temperature 93.3 °C
|
1.00
-
2.00
hour <br>@Temperature 200 °F
|
|
|
Master Bond SteelMaster 43HT Stainless Steel Filled Two Component Epoxy System
Master Bond Steelmaster 43HT is a high performance, stainless steel filled two component epoxy resin system for the cost effective repair, maintenance, rebuilding, restoring and resealing of worn or..
|
|||
| Cure Time |
60.0
min <br>@Temperature 95.0 °C
|
1.00
hour <br>@Temperature 203 °F
|
|
|
Tra-Con Tra-Bond 724-20 Polyurethane Adhesive
TRA-BOND 724-20 polyurethane adhesive is designed for good adhesion, providing strong, resilient bonds to a wide variety of substrates including aluminum, solder, nylon, mylar and steel. TRA-BOND 72..
|
|||
| Cure Time |
60.0
-
240
min <br>@Temperature 65.0 °C
|
1.00
-
4.00
hour <br>@Temperature 149 °F
|
|
|
Tra-Con Tra-Cast F353 Optically Opaque Casting System
TRA-CAST F353 is an optically opaque, low viscosity, two-part epoxy system recommended for molding, potting, embedding, encapsulating, sealing and casting applications involving fiber optic, optical..
|
|||
| Cure Time |
60.0
min <br>@Temperature 65.0 °C
|
1.00
hour <br>@Temperature 149 °F
|
|
|
Trelleborg Emerson & Cuming Eccobond® 56C Two-Component Silver Filled Electrically Conductive Epoxy Adhesive
Emerson & Cuming 56C Eccobond® Two-Component Silver Filled Electrically Conductive Epoxy AdhesiveSilver filled, high electrical conductivity, epoxy adhesive. Excellent thermal conductivity. Require..
|
|||
| Cure Time |
60.0
min <br>@Temperature 65.0 °C
|
1.00
hour <br>@Temperature 149 °F
|
|
|
Trelleborg Emerson & Cuming Eccobond® 83C Two-Component Silver Filled Electrically Conductive Epoxy Adhesive
Emerson & Cuming 83C Eccobond® Two-Component Silver Filled Electrically Conductive Epoxy AdhesiveTwo component, silver filled, electrically conductive, epoxy adhesive. Smooth, creamy consistency. G..
|
|||
| Cure Time |
60.0
-
120
min <br>@Temperature 93.3 °C
|
1.00
-
2.00
hour <br>@Temperature 200 °F
|
|
|
Master Bond Supreme 11HT-LO Adhesive and Sealant Serviceable to +400°F
Description: Master Bond Polymer System Supreme 11HT-LO is an easy to use two part epoxy adhesive/sealant combining both high shear and high peel strengths along with a relatively fast cure at room ..
|
|||
| Cure Time |
60.0
-
240
min <br>@Temperature 65.0 °C
|
1.00
-
4.00
hour <br>@Temperature 149 °F
|
|
|
Tra-Con Tra-Bond 813J01 Silicone Encapsulant
TRA-BOND 813J01 is a silicone adhesive system formulated to provide excellent thermal conductivity. This unique product bonds well to difficult substrates. Typical applications include encapsulation..
|
|||
| Cure Time |
60.0
min <br>@Temperature 95.0 °C
|
1.00
hour <br>@Temperature 203 °F
|
|
|
Tra-Con Tra-Bond Ablebond 862-2 Room Temperature Cure Epoxy Adhesive
Ablebond 862-2 room temperature curing epoxy adhesive is designed for solder pad encapsulation or sealing the head/disk area in floppy disc assemblies. This resilient compound is suitable for bondin..
|
|||
| Cure Time |
60.0
min <br>@Temperature 65.0 °C
|
1.00
hour <br>@Temperature 149 °F
|
|
|
Epoxy Technology EPO-TEK® 301 Spectrally Transparent Epoxy
Product Description: EPO-TEK® 301 is a two component, room temperature curing epoxy featuring very low viscosity, and excellent optical-mechanical properties.Advantages & Application Notes: Semicon..
|
|||
| Cure Time |
60.0
min <br>@Temperature 65.0 °C
|
1.00
hour <br>@Temperature 149 °F
|
|
|
Epoxy Technology EPO-TEK® 305 Spectrally Transparent Epoxy
Product Description: EPO-TEK® 305 is a two component, semi-rigid, optical grade epoxy for semiconductor packaging of fiber optics, optoelectronics and medical devices. It is an electrically and th..
|
|||
| Cure Time |
60.0
min <br>@Temperature 16.0 °C
|
1.00
hour <br>@Temperature 60.8 °F
|
Light Load |
|
Chesterton ARC MX5 Rapid Curing Fine Particle Wear Compound
Description: An advanced ceramic reinforced composite for the emergency repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is applied at a th..
|
|||
| Cure Time |
60.0
-
180
min <br>@Temperature 100 °C
|
1.00
-
3.00
hour <br>@Temperature 212 °F
|
|
|
Abatron AboCoat 8501-2/AboCure 8501-2 Clear Epoxy Coating
AboCoat 8501-2 is a clear, light amber resin made of 85% solids. It has a viscosity of 21-23 poises and a weight of 9.3 lbs/gallon. AboCure 8501-2 is a clear, light amber converter made of 85% solid..
|
|||
| Cure Time |
60.0
-
180
min <br>@Temperature 82.222 - 98.889 °C
|
1.00
-
3.00
hour <br>@Temperature 180.00 - 210.00 °F
|
|
|
Abatron AboTar 8101-8 Solventless Tar-Epoxy Compound
AboTar 8101-8 is a 2-part tar-epoxy variable-ratio system. It is weather- and water-proof, flexible, and acid, alkali, and fuel resistant. It can be used neat or with sand or aggregates. Uses: Resu..
|
|||
| Cure Time |
60.0
min <br>@Temperature 93.3 °C
|
1.00
hour <br>@Temperature 200 °F
|
Step 1, preceeded by 1 hour air set |
|
Aremco HiE-Coat™ 840-M High Emissivity Coating, Inorganic-Ceramic Filled
Ceramic-based, black-pigmented coating for carbon and stainless steel to 2000 °F (1093°C).
|
|||
| Cure Time |
60.0
-
120
min <br>@Temperature 150 - 160 °C
|
1.00
-
2.00
hour <br>@Temperature 302 - 320 °F
|
|
|
Abatron AboCast 8103-14 One-Component Epoxy
AboCast 8103-14 is the lowest-viscosity one-component epoxy system with heavy-duty structural and dielectric properties. It is clear and has maximum wetting and penetration. Suggested Uses: Casting..
|
|||
| Cure Time |
60.0
min <br>@Temperature 60.0 °C
|
1.00
hour <br>@Temperature 140 °F
|
|
|
Resinlab® SEC1233 Silver Filled Epoxy Adhesive
Resinlab™ SEC1233 is a silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature. SEC1233 provides excellent electrical conductivit..
|
|||
| Cure Time |
60.0
min <br>@Temperature 60.0 °C
|
1.00
hour <br>@Temperature 140 °F
|
|
|
Resinlab® EP1306 Acrylic / Epoxy Hybrid Adhesive
EP1306 is a two part acrylic / epoxy hybrid adhesive utilizing a 50% weight loading of aluminum powder into both components. It cures quickly at room temperature to a tough, rigid polymer. It has go..
|
|||
| Cure Time |
60.0
min <br>@Temperature 177 °C
|
1.00
hour <br>@Temperature 351 °F
|
|
|
Henkel Hysol MA 562SFR Core Splice Adhesive
Modified epoxy foaming adhesive that may be cured at 250°F / 121°C or 350°F / 177°C. Flame-retardant, nonmetallic, medium tack, excellent slump resistance.
|
|||
Copyright © lookpolymers.com All Rights Reserved