Polymer Property : Cure Time = 1.00 hour Product List

Processing Properties

Tips: 30 items are displayed at most.

Processing Properties	Metric	English	Comments
Cure Time	30.0 - 60.0 min @Temperature 120 °C	0.500 - 1.00 hour @Temperature 248 °F
Resinlab® EP1285HD-12 Highly Filled, Medium Viscosity Casting Resin Resinlab™ EP1285 (Formerly Lab Product W021901 series) is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity and a low C..
Cure Time	40.2 - 60.0 min @Temperature 43.3 °C	0.670 - 1.00 hour @Temperature 110 °F	De-mold Time
Northstar Polymers MPP-R02C Semi-rigid Polyurethane Foam Formulation MPP-R02C is semi-rigid foam formulations for molded foam products. It is closed-cell light foam with some structural integrity. Unlike rigid polyurethane foams, the physical properties of a cured pr..
Cure Time	30.0 - 60.0 min @Temperature 23.0 °C	0.500 - 1.00 hour @Temperature 73.4 °F	brass, fixture time
Permabond LH056 Anaerobic Threadsealant Permabond LH056 is a thread sealant designed for use in sealing metal pipes and fittings in sprinkler systems which may also contain CPVC piping. Permabond LH056 prevents leaks even on pipes that ar..
Cure Time	30.0 - 60.0 min @Temperature 125 °C	0.500 - 1.00 hour @Temperature 257 °F
Resin Technology Group TIGA 901 Room Temperature Curing Silver Conductive Epoxy 100 parts resin to 6 parts hardener. Cure 24 hours at 25°C, 1-4 hours at 65°C, 30-60 minutes at 125°C, or 30 minutes at 150°C.TIGA 901 is an electrically conductive, silver filled epoxy adhesiv..
Cure Time	30.0 - 60.0 min @Temperature 93.3 °C	0.500 - 1.00 hour @Temperature 200 °F	1 hour at 250°F and 2-3 hours at 300°F, plus a post cure of 1-2 hours at 350°F
Master Bond EP45HTND-2 Chemically Resistant, Non-Drip Epoxy Description: Master Bond EP45HTND-2 is a two component epoxy system for high performance bonding, sealing and coating. It is used for applications requiring solid temperature resistance and capable ..
Cure Time	1.20 - 60.0 min @Temperature 22.0 °C	0.0200 - 1.00 hour @Temperature 71.6 °F
Dow Corning 3-4222 DIELECTRIC FIRM GEL KIT Two-part, translucent green, firm, fast RT or heat cure, and primerless chemical adhesion.Information provided by Dow Corning
Cure Time	30.0 - 60.0 min @Temperature 80.0 - 120 °C	0.500 - 1.00 hour @Temperature 176 - 248 °F
Abatron AboCast 8005-6/AboCure 8005-6 Epoxy AboCast 8005-6 is a tan, viscous filled liquid resin with a weight of approximately 11 lbs/gallon. AboCure 8005-6 is an amber, viscous liquid converter with a weight of approximately 10 lbs/gallon. ..
Cure Time	45.0 - 60.0 min @Temperature 100 °C	0.750 - 1.00 hour @Temperature 212 °F
ACC QGel 315 QSI Quantum Silicones General Purpose Silicone Gel QGel 315 is a clear, very soft, tough moderately cross-linked silicone polymer. Silicone gels are used to provide protection from vibration and thermal or mechanical shock. Silicone gels also provid..
Cure Time	20.0 - 60.0 min @Temperature 24.0 °C	0.333 - 1.00 hour @Temperature 75.2 °F	demold time
BCC Products Proto-Kast BC 8163 Urethane Casting BC 8163 is a very low viscosity, rapid setting, rigid urethane compound. This system will cure quickly to a hard, tough, impact resistant casting. BC 8163 is non-sensitive to moisture after cure and..
Cure Time	45.0 - 60.0 min @Temperature 149 °C	0.750 - 1.00 hour @Temperature 300 °F
Master Bond Supreme 10HTFL One Part Epoxy Cures at 250°F Description: Master Bond Polymer System Supreme 10HTFL features a blend of physical properties including outstanding peel strength, very high shear strength and a wide service temperature range of 4..