Polymer Property : Cure Time = 1.50 hour Product List

Processing Properties

Tips: 30 items are displayed at most.

Processing Properties	Metric	English	Comments
Cure Time	90.0 min @Temperature 150 Â°C	1.50 hour @Temperature 302 Â°F
Lord Adhesives Thermosetâ„¢ ME-541 Underfill Encapsulant LORD Thermosetâ„¢ ME-541 encapsulant is an anhydride free, high purity, semi-conductor grade epoxy underfill product developed for the encapsulation of densely populated area array flip chip devi..
Cure Time	90.0 min @Temperature 121 Â°C	1.50 hour @Temperature 250 Â°F
Henkel Hysol MA 562S Core Splice Adhesive Modified epoxy foaming adhesive that may be cured at 250Â°F / 121Â°C or 350Â°F / 177Â°C. Nonmetallic, medium tack, excellent slump resistance.
Cure Time	90.0 min @Temperature 121 Â°C	1.50 hour @Temperature 250 Â°F
Henkel Hysol MA 557 Core Splice Adhesive Modified epoxy foaming adhesive that may be cured at 250Â°F / 121Â°C or 350Â°F / 177Â°C. Designed to seal, splice or reinforce honeycomb materials. Excellent slump resistance, medium tack, n..
Cure Time	90.0 min @Temperature 121 Â°C	1.50 hour @Temperature 250 Â°F
Henkel Hysol PL 777-1FR Film Adhesive Flame retardant, nonmetallic modified epoxy film adhesiveApplications: Metal and Honeycomb Bonding
Cure Time	90.0 min @Temperature 121 Â°C	1.50 hour @Temperature 250 Â°F
Henkel Hysol PL 795-1 Film Adhesive Tougher version of Hysol PL 795. Excellent flow characteristics. Excellent tack and handling characteristics. Improved elevated temperature performance. Can be used for both surfacing film and light..
Cure Time	90.0 - 120 min @Temperature 149 °C	1.50 - 2.00 hour @Temperature 300 °F
Master Bond EP17HT One component epoxy system for bonding, sealing, coating and casting Product Description: Master Bond EP17HT is an one component, heat cured epoxy system for bonding, sealing, coating and encapsulating. It features good physical properties, electrical insulation prof..
Cure Time	90.0 - 120 min @Temperature 149 °C	1.50 - 2.00 hour @Temperature 300 °F
Master Bond EP17HT-LO One component epoxy system for bonding, sealing, coating and casting Product Description: Master Bond EP17HT-LO is a one component, heat cured epoxy system for bonding, sealing, coating and encapsulating. It features good physical properties, electrical insulation pr..
Cure Time	90.0 min @Temperature 95.0 °C	1.50 hour @Temperature 203 °F
Tra-Con Tra-Bond 293-1M General Purpose Instrument Epoxy Adhesive TRA-BOND 293-1M general purpose epoxy adhesive is designed to provide strong, resilient bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper and brass. The 293-se..
Cure Time	90.0 min @Temperature 100 °C	1.50 hour @Temperature 212 °F
Tra-Con Tra-Bond 293-21 General Purpose Epoxy Adhesive TRA-BOND 293-21 general purpose epoxy adhesive is designed to provide strong, resilient bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper, and brass. The 293 s..
Cure Time	90.0 min @Temperature 120 °C	1.50 hour @Temperature 248 °F
Trelleborg Emerson & Cuming Eccobond® 2780-45 One-Component High Temperature Performance Epoxy Adhesive Emerson & Cuming 2780-45 Eccobond® One-Component High Temperature Performance Epoxy AdhesiveFilled, pourable, high temperature resistant, epoxy adhesive. Long term resistance to boiling glycol. Exc..
Cure Time	90.0 min @Temperature 43.0 °C	1.50 hour @Temperature 109 °F	Light Load
Chesterton ARC 897 Fine Grade Sliding Wear Compound Description: ARC 897 is an advanced ceramic reinforced composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is applied at a t..
Cure Time	90.0 min @Temperature 32.0 °C	1.50 hour @Temperature 89.6 °F	Foot Traffic
Chesterton ARC 988 Composite Description: A high performance, quartz reinforced composite designed to resurface and restore concrete surfaces, to protect new concrete, and to repair concrete damaged by severe chemical and physi..
Cure Time	90.0 min @Temperature 43.0 °C	1.50 hour @Temperature 109 °F	Light Load
Chesterton ARC BX2 Contractor Grade Fine Sliding Wear Compound Description: ARC BX2 is an advanced contractor grade ceramic reinforced composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It ..
Cure Time	90.0 min @Temperature 21.0 °C	1.50 hour @Temperature 69.8 °F	Foot Traffic
Chesterton ARC NVE SYSTEM Vinyl Ester Lining Description: ARC NVE is a high performance, quartz reinforced, three-component, modified novolac vinyl ester lining capable of being applied to horizontal and vertical surfaces. The NVE system kit i..
Cure Time	90.0 min @Temperature 80.0 °C	1.50 hour @Temperature 176 °F	Minimum Bond Line
Epoxy Technology EPO-TEK® H20E-8 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-8 is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a higher viscos..
Cure Time	90.0 min @Temperature 285 °C	1.50 hour @Temperature 545 °F	Post-Cure, Minimum Bond Line
Epoxy Technology EPO-TEK® P1011S Electrically Conductive Modified Polyimide Product Description: EPO-TEK® P1011S is a single component, modified polyimide, high temperature grade, silver-filled electrically and thermally conductive adhesive designed for semiconductor die-a..
Cure Time	90.0 min @Temperature 165 °C	1.50 hour @Temperature 329 °F	Minimum Bond Line
Epoxy Technology EPO-TEK® E3035 Electrically Conductive Adhesive Product Description: EPO-TEK® E3035 is a single component, silver-filled epoxy for hybrid die and component attach.Advantages & Application Notes: Performs exceptionally well as a die attach for sm..
Cure Time	90.0 min @Temperature 80.0 °C	1.50 hour @Temperature 176 °F
Atom Adhesives AA-BOND G298 Epoxy Adhesive AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Appearance: Resin: Brown, Hardener: Dark Bro..
Cure Time	90.0 min @Temperature 180 °C	1.50 hour @Temperature 356 °F
Atom Adhesives AA-DUCT CG2 Epoxy Adhesive AA-DUCT CG2 is a single component epoxy, formulated with silver coated ceramic that results in lower material costs without adversely sacrificing the properties obtained with a pure silver formulati..
Cure Time	90.0 min @Temperature 121 °C	1.50 hour @Temperature 250 °F
Henkel Hysol PL 795 Film Adhesive Epoxy film adhesive designed for composite bonding applications. May cure at 250°F / 121°C or 350°F / 177°C, with service temperatures up to 350°F / 177°C. Ideal for co-cure or secondary bondi..
Cure Time	90.0 min @Temperature 21.0 °C	1.50 hour @Temperature 69.8 °F	Foot Traffic
Chesterton ARC NVE VC Vinyl Ester Sealer Description: ARC NVE VC (Veil Coat) is a two-component, modified epoxy novolac vinyl ester sealer coat formulated for application by brush, roller or spray at 0.15-0.25 mm (0.07-0.010”) wet film th..
Cure Time	90.0 min @Temperature 43.0 °C	1.50 hour @Temperature 109 °F	Light Load
Chesterton MRS 58 Metal Rebuilding System An advanced ceramic composite for the repair and protection of all metal surfaces subjected to erosion, corrosion and chemical attack. It is normally applied at a thickness of 1.5 mm (60 mils) or mo..
Cure Time	90.0 min @Temperature 121 °C	1.50 hour @Temperature 250 °F
Henkel Hysol PL 460 Core Splice Adhesive Foaming epoxy adhesive in paste form for easy extrusion through packaged cartridges. Expands and cures at temperatures from 250°F / 121°C to 350°F / 177°C. Qualified to Boeing BMS 5-90, Type IV...