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- Polymer Property : Cure Time = 10100 min
Polymer Property : Cure Time = 10100 min Product List
Processing PropertiesTips: 30 items are displayed at most.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time |
10100
min <br>@Temperature 24.0 °C
|
168
hour <br>@Temperature 75.2 °F
|
produces lower electrical conductivity |
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Parker Chomerics CHO-BOND 592 Conductive Epoxy
Highly conductive silver-filled epoxy adhesive which combines the best properties of metals and organics. This two-component system is unique in that it combines long pot life, good electrical condu..
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| Cure Time |
10100
min <br>@Temperature 24.0 °C
|
168
hour <br>@Temperature 75.2 °F
|
|
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Parker Chomerics CHO-BOND® 592 Conductive Adhesive
Description: CHO-BOND® 500 Series Adhesive/Sealant Compounds; These pure silver-filled materials are used where tight tolerances require thin bond lines. Various cure cycles are available, and the ..
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| Cure Time |
10100
min <br>@Temperature 15.5 - 21.0 °C
|
168
hour <br>@Temperature 59.9 - 69.8 °F
|
40-60% RH |
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Parker Chomerics CHO-SHIELD® 4994 Conductive Flexible Coating
Description: CHO-SHIELD® 4994 is a smooth, highly conductive flexible silver-filled polyurethane coating designed for military/aerospace airframe applications. Both coatings provide superior adhesi..
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| Cure Time |
10100
min <br>@Temperature 23.8 °C
|
168
hour <br>@Temperature 74.8 °F
|
|
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Parker Chomerics CHO-SHIELD® 576 Platable Silver Epoxy Coating
Description: CHO-SHIELD® 576 coating is a two component, silver filled, highly conductive epoxy paint designed to provide EMI shielding when applied to a dielectric plastic substrate. This coating ..
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| Cure Time |
10100
min <br>@Temperature 23.0 °C
|
168
hour <br>@Temperature 73.4 °F
|
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Parker Chomerics CHO-SHIELD® 610 A/B Conductive Epoxy Paint
Highly Conductive Epoxy Paint. This is a two-component, silver plated, copper-filled, highly conductive epoxy paint. This coating was developed for application to non-conductive plastic substrates t..
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| Cure Time |
10100
min <br>@Temperature 24.0 °C
|
168
hour <br>@Temperature 75.2 °F
|
|
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Parker Chomerics CHO-SHIELD® 610 A/B Epoxy Conductive Coating
Description: CHO-SHIELD® 610 A/B is a highly conductive, two-component silver-plated-copper filled epoxy coating for application to non-conductive plastic substrates, particularly those subject to ..
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| Cure Time |
10100
min <br>@Temperature 24.0 °C
|
168
hour <br>@Temperature 75.2 °F
|
|
|
Parker Chomerics Tecknit® 0036 Two Part Flexible Adhesive-Sealant Silver-Glass Silicone
Description: TECKNIT 0036 is an electrically conductive, medium viscosity, RTV silicone adhesive-sealant. This silver-plated glass filled system is formulated with a special conductive material pro..
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| Cure Time |
10100
min <br>@Temperature 25.0 °C
|
168
hour <br>@Temperature 77.0 °F
|
50%; Full Cure |
|
Parker Chomerics Tecknit® 72-00151 Silver-Filled Flexible Resin Caulking System
Description: TECKNIT standard electrically conductive caulks consist of four one-component resin systems filled with silver plated glass or copper particles. These systems are formulated to provide ..
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| Cure Time |
10100
min <br>@Temperature 25.0 °C
|
168
hour <br>@Temperature 77.0 °F
|
50%; Full Cure |
|
Parker Chomerics Tecknit® 72-00152 Silver-Filled Flexible Resin Caulking System
Description: TECKNIT standard electrically conductive caulks consist of four one-component resin systems filled with silver plated glass or copper particles. These systems are formulated to provide ..
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| Cure Time |
10100
min <br>@Temperature 23.0 °C
|
168
hour <br>@Temperature 73.4 °F
|
|
|
Parker Chomerics THERM-A-FORM 1642 Cure-in-Place Potting and Underfill Material
Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics co..
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| Cure Time |
10100
min <br>@Temperature 25.0 °C
|
168
hour <br>@Temperature 77.0 °F
|
50%; Full Cure |
|
Parker Chomerics Tecknit TeckBond™-C Silver-Plated Copper-Filled Adhesive
Description: TECKBOND-C is a silicone rubber base filled with silver-plated copper particles to produce a highly conductive one-component adhesive sealant. The system is an RTV moisture-cured compou..
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| Cure Time |
10100
min <br>@Temperature 25.0 °C
|
168
hour <br>@Temperature 77.0 °F
|
50%; Full Cure |
|
Parker Chomerics Tecknit TeckBond™-NC Nickel Coated Graphite-Filled Adhesive
Description: TECKBOND-NC is a silicone rubber base filled with nickel coated graphite particles to produce a highly conductive one-component adhesive sealant. The system is an RTV moisture-cured com..
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| Cure Time |
10100
min <br>@Temperature 24.0 °C
|
168
hour <br>@Temperature 75.2 °F
|
|
|
Parker Chomerics CHO-BOND 1029 Conductive Adhesive
CHO-BOND® 1029 is a highly conductive silicone adhesive, intended for bonding Chomerics’ conductive silicone EMI gaskets to electrically conductive substrates. It is a two-component, siliver-plate..
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| Cure Time |
10100
min <br>@Temperature 24.0 °C
|
168
hour <br>@Temperature 75.2 °F
|
|
|
Parker Chomerics CHO-BOND 2165 Polyurethane Sealant
Conductive sealant is a stabilized copper filled, two component polyurethane. It has excellent electrical and physical properties for aerospace and military applications. CHO-BOND® 2165 sealant is ..
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| Cure Time |
10100
min <br>@Temperature 25.0 °C
|
168
hour <br>@Temperature 77.0 °F
|
UR312 |
|
Lord Adhesives Thermosetâ„¢ UR312 / UR324 Urethane Encapsulating Gel
UR312 A/B and UR324 A/B are the same components used at different mix ratios, therefore, giving different properties.LORD UR312 and UR324 are two-component, room temperature curing urethane gels. Th..
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| Cure Time |
10100
min <br>@Temperature 25.0 °C
|
168
hour <br>@Temperature 77.0 °F
|
UR324 |
|
Lord Adhesives Thermosetâ„¢ UR312 / UR324 Urethane Encapsulating Gel
UR312 A/B and UR324 A/B are the same components used at different mix ratios, therefore, giving different properties.LORD UR312 and UR324 are two-component, room temperature curing urethane gels. Th..
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| Cure Time |
10100
min <br>@Temperature 25.0 °C
|
168
hour <br>@Temperature 77.0 °F
|
|
|
Tra-Con Tra-Bond 240-2 Polyurethane Adhesive
TRA-BOND 240-2 polyurethane adhesive is a low outgassing polyurethane adhesive which meets the requirements of NASA specification SP-R-0022. Information provided by Tra-Con Inc.
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| Cure Time |
10100
min <br>@Temperature 24.0 °C
|
168
hour <br>@Temperature 75.2 °F
|
|
|
Tra-Con Tra-Bond 9392 Flexible Potting Epoxy Adhesive
TRA-BOND 9392 is a low viscosity, two-part polyurethane formulation recommended for potting and molding where flexibility and temperature resistance are required. TRA-BOND 9349 is a room temperature..
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| Cure Time |
10100
min <br>@Thickness 10.5 mm
|
168
hour <br>@Thickness 0.413 in
|
room temp |
|
Loctite® 5920™ RTV Silicone Sealant
LOCTITE® 5920™ is a moisture-curing, non-corrosive silicone. The thixotropic nature of LOCTITE® 5920™ reduces the migration of liquid product after application to the substrate. It has been desi..
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| Cure Time |
10100
min <br>@Temperature 25.0 °C
|
168
hour <br>@Temperature 77.0 °F
|
Full Chemical |
|
Chesterton ARC 791 Composite
Description: A quartz reinforced composite designed to resurface and restore concrete surfaces, to protect new concrete, and to repair concrete damaged by chemical and physical abuse. ARC 791 has ex..
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| Cure Time |
10100
min <br>@Temperature 32.0 °C
|
168
hour <br>@Temperature 89.6 °F
|
Chemical Resistance |
|
Chesterton ARC 982 100% Novolac acid resistant coating
Description: An advanced polymer composite formulated to protect equipment from extreme chemical attack and corrosion. A low viscosity composite that is applied by brush, squeegee, or a plural compo..
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| Cure Time |
10100
min <br>@Temperature 16.0 °C
|
168
hour <br>@Temperature 60.8 °F
|
Full Mechanical/Chemical |
|
Chesterton ARC MXHT High temperature severe wear compound
Description: An advanced ceramic composite for the protection of all metal surfaces subjected to severe erosion, abrasion and chemical attack at elevated temperatures. It is applied at a thickness o..
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| Cure Time |
10100
min <br>@Temperature 25.0 °C
|
168
hour <br>@Temperature 77.0 °F
|
Full Chemical |
|
Chesterton ARC PW Potable Water Coating
Description: ARC PW is a 100% solids lining certified for NSF/ANSI 61 potable water, cold water service. It is recommended to be applied by brush, roll or spray at 500-750 microns (20-30 mils) total..
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| Cure Time |
10100
min <br>@Temperature 25.0 °C
|
168
hour <br>@Temperature 77.0 °F
|
Full Chemical |
|
Chesterton ARC S1 General purpose coating
Description: An advanced polymer composite formulated to protect metal surfaces from corrosion and chmical attack. It is normally applied at a thickness of 250 microns (10 mils) per coat. Non-shrink..
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| Cure Time |
10100
min <br>@Temperature 24.0 °C
|
168
hour <br>@Temperature 75.2 °F
|
|
|
Parker Chomerics CHO-SHIELD® 596 A/B Silver-Epoxy Coating
Silver-Epoxy Coating. This is a two-component, silver bearing, highly conductive epoxy paint designed to provide EMI shielding when applied to a dielectric substrate. It is also useful for coating f..
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| Cure Time |
10100
min <br>@Temperature 23.9 °C
|
168
hour <br>@Temperature 75.0 °F
|
|
|
Parker Chomerics CHO-SHIELD® 598 A/B Silver-Epoxy Coating
Silver-Epoxy Coating. This coating is a two-component, silver bearing, highly conductive epoxy paint designed to provide EMI shielding when applied to a plastic, non-conductive substrate. Used as a ..
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