| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time |
720
-
1440
min <br>@Temperature 23.0 °C
|
12.0
-
24.0
hour <br>@Temperature 73.4 °F
|
|
|
Resin Technology Group 120-EX Oxy-Bond™ Two-Component Epoxy Adhesive
Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma..
|
|||
| Cure Time |
720
-
1080
min <br>@Temperature 25.0 °C
|
12.0
-
18.0
hour <br>@Temperature 77.0 °F
|
|
|
Resin Technology Group KONA 871 Low Cost Epoxy Resin
Mix ratio 100 to 25 by weight.Kona 871 is a low cost epoxy resin system developed for production casting, potting, encapsulating and coating applications where easy handling, good flowability and lo..
|
|||
| Cure Time |
720
min <br>@Temperature 25.0 °C
|
12.0
hour <br>@Temperature 77.0 °F
|
Permit Handling |
|
Lord Adhesives Aeroglaze® Z307 Absorptive Conductive Polyurethane
Aeroglaze® Z307 black absorptive conductive polyurethane coating is primarily for application to substrates used on spacecraft. These applications include those where coatings must exhibit low ou..
|
|||
| Cure Time |
720
min <br>@Temperature 23.9 °C
|
12.0
hour <br>@Temperature 75.0 °F
|
followed by 2 hrs at 150-200°F |
|
Master Bond EP21HTND High Temperature Resistant, Non-Drip Epoxy Compound
Description: Master Bond EP21HTND is a two component, room temperature curing epoxy adhesive, sealant and coating with a paste viscosity and non-drip application feature. Its features are easy handl..
|
|||
| Cure Time |
720
-
1440
min <br>@Temperature 23.9 °C
|
12.0
-
24.0
hour <br>@Temperature 75.0 °F
|
plus 2 hrs at 150-200°F |
|
Master Bond EP21NDFG Two component epoxy compound for high performance applications
Product Description: Master Bond EP21NDFG is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties, easy processing and a non-drip, paste-like consistency..
|
|||
| Cure Time |
720
-
1440
min <br>@Temperature 23.9 °C
|
12.0
-
24.0
hour <br>@Temperature 75.0 °F
|
plus 2 hrs at 150-200°F |
|
Master Bond EP21NDLO Low Outgassing, Room Temperature Curing Two Component Epoxy
Master Bond EP21ND-LO is a two component, room temperature curing epoxy system for bonding, sealing and coating featuring outstanding physical properties. EP21ND-LO has a convenient one to one mix r..
|
|||
| Cure Time |
720
min <br>@Temperature 23.9 °C
|
12.0
hour <br>@Temperature 75.0 °F
|
Followed by 2-3 hours at 150-200°F (Optimum Cure Schedule) |
|
Master Bond EP21TDC-2ND Two component, highly flexibilized, non-drip epoxy resin compound
Product Description: Master Bond EP21TDC-2ND is a two component highly flexible epoxy resin system for high performance bonding, sealing and coating with a non-drip consistency. It has a forgiving o..
|
|||
| Cure Time |
720
min <br>@Temperature 23.9 °C
|
12.0
hour <br>@Temperature 75.0 °F
|
Followed by 2-3 hours at 150-200°F (Optimum Cure Schedule) |
|
Master Bond EP21TDC-4ND Two component, highly flexibilized epoxy for bonding, sealing and coating
Product Description: Master Bond EP21TDC-4ND is a two component, very flexible epoxy system for high performance bonding, sealing and coating with a non-drip consistency. It has a one to four mix ra..
|
|||
| Cure Time |
720
min <br>@Temperature 23.0 °C
|
12.0
hour <br>@Temperature 73.4 °F
|
|
|
Master Bond EP24 Fast Curing Two Component Epoxy System
Master Bond Polymer Adhesive EP24 is a fast curing two component epoxy adhesive for general purpose bonding, sealing, and coating formulated to cure at room temperature with a one-to-one mix ratio, ..
|
|||
| Cure Time |
720
min <br>@Temperature 23.9 °C
|
12.0
hour <br>@Temperature 75.0 °F
|
followed by 2 hours at 150-200°F |
|
Master Bond EP30HT-LO NASA Low Outgassing, Optically Clear Coating
Description: Master Bond EP30HT-LO is a moderate viscosity, two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a four to one mix ratio..
|
|||
| Cure Time |
720
-
1440
min <br>@Temperature 23.9 °C
|
12.0
-
24.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond EP51FL Toughened and Flexible Adhesive Compound
Master Bond EP51FL is a two component epoxy system for high performance bonding sealing and coating. It combines superior toughness with user friendly handling properties, along with unusually fast ..
|
|||
| Cure Time |
720
min <br>@Temperature 82.2 °C
|
12.0
hour <br>@Temperature 180 °F
|
|
|
Zyvex Performance Materials Arovex™ 250 Carbon Nanotube Strengthened Prepreg
Arovex® 250 Prepreg is a 180°F (82°C) to 280°F (138°C) curing carbon nanotube strengthened epoxy prepreg suitable for numerous composites applications. Normal curing takes place at 250°F (121°..
|
|||
| Cure Time |
720
min <br>@Temperature 82.2 °C
|
12.0
hour <br>@Temperature 180 °F
|
|
|
Zyvex Performance Materials Arovex™ HT 250 Nano-Engineered Composite Prepreg System
Arovex® HT 250 Prepreg is a 180°F (82°C) to 280°F (138°C) curing carbon nanotube strengthened epoxy prepreg suitable for numerous composites applications. Normal curing takes place at 250°F (1..
|
|||
| Cure Time |
720
min <br>@Temperature 50.0 °C
|
12.0
hour <br>@Temperature 122 °F
|
|
|
Tra-Con Tra-Duct 29121 Snap Cure Conductive Silver Epoxy Adhesive
TRA-DUCT 29121 is 100% solids, two component silver filled epoxy designed for chip bonding in microelectronic and optoelectronic applications. TRA-DUCT 29121 is a soft, smooth paste. This two-part f..
|
|||
| Cure Time |
720
-
1440
min <br>@Temperature 23.0 °C
|
12.0
-
24.0
hour <br>@Temperature 73.4 °F
|
|
|
Master Bond EP27 Low Temperature Curing Two Component Epoxy
Master Bond Polymer System EP27 is a unique two component
epoxy formulation offers relatively fast cures at temperatures as low as 40°F and below, with curing times much shorter than currently exis..
|
|||
| Cure Time |
720
min <br>@Temperature 65.6 - 93.3 °C
|
12.0
hour <br>@Temperature 150 - 200 °F
|
followed by 2-3 hrs at 150°-200°F |
|
Master Bond EP42HT-2FG Two Component Epoxy Adhesive for Food Applications
Master Bond Polymer System EP42HT-2FG is a room temperature setting, two component epoxy adhesive, sealant and coating specially formulated for food applications. It has been independently tested an..
|
|||
| Cure Time |
720
min <br>@Temperature 25.0 °C
|
12.0
hour <br>@Temperature 77.0 °F
|
Light Load |
|
Chesterton ARC 855 Abrasion Control Liquid
Description: An advanced ceramic composite formulated to protect equipment from aggressive chemical attack, corrosion, and erosion. The product is a low viscosity composite that is easily applied by..
|
|||
| Cure Time |
720
min <br>@Temperature 43.0 °C
|
12.0
hour <br>@Temperature 109 °F
|
Full Load |
|
Chesterton ARC 858 Abrasion resistant rebuilding and faring composite
An advanced ceramic composite for the repair and protection of all metal surfaces subjected to erosion, corrosion and chemical attack. It is normally applied at a thickness of 0.15 mm (60 mils) or m..
|
|||
| Cure Time |
720
min <br>@Temperature 43.0 °C
|
12.0
hour <br>@Temperature 109 °F
|
Full Load |
|
Chesterton ARC 897 Fine Grade Sliding Wear Compound
Description: ARC 897 is an advanced ceramic reinforced composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is applied at a t..
|
|||
| Cure Time |
720
min <br>@Temperature 43.0 °C
|
12.0
hour <br>@Temperature 109 °F
|
Full Load |
|
Chesterton ARC BX2 Contractor Grade Fine Sliding Wear Compound
Description: ARC BX2 is an advanced contractor grade ceramic reinforced composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It ..
|
|||
| Cure Time |
720
min <br>@Temperature 16.0 °C
|
12.0
hour <br>@Temperature 60.8 °F
|
Foot Traffic |
|
Chesterton ARC CS4 low-viscosity, 100% solids, barrier coating
Description: An advanced composite formulated to protect concrete surfaces from harsh chemical attack. It is normally applied at a thickness of 250-375 microns (10-15 mils) per coat in a 2 coat syst..
|
|||
| Cure Time |
720
min <br>@Temperature 32.0 °C
|
12.0
hour <br>@Temperature 89.6 °F
|
Light Load |
|
Chesterton ARC S1 General purpose coating
Description: An advanced polymer composite formulated to protect metal surfaces from corrosion and chmical attack. It is normally applied at a thickness of 250 microns (10 mils) per coat. Non-shrink..
|
|||
| Cure Time |
720
-
960
min <br>@Temperature 60.0 °C
|
12.0
-
16.0
hour <br>@Temperature 140 °F
|
|
|
Cytec EN-2550 (Conap) Potting and Encapsulation Adhesive
Polyurethane Potting and Encapsulating SystemsConathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many s..
|
|||
| Cure Time |
720
min <br>@Temperature 32.0 °C
|
12.0
hour <br>@Temperature 89.6 °F
|
Overcoat End |
|
Chesterton ARC HT-S High Temperature Corrosion Resistant Coating
Description: ARC HT-S is a high temperature corrosion resistant coating for continuous operating conditions at elevated temperatures. It is easily applied by brush or roller and can be sprayed with ..
|
|||
| Cure Time |
720
min <br>@Temperature 43.0 °C
|
12.0
hour <br>@Temperature 109 °F
|
Full Load |
|
Chesterton ARC MX2 High Wear Fine Particle Wear Compound
Description: An advanced ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion and chemical attack. It is applied at a thickness of 3 mm (1/8”..
|
|||
| Cure Time |
720
min <br>@Temperature -6.70 °C
|
12.0
hour <br>@Temperature 19.9 °F
|
Tack-Free Time |
|
3M AC-250 A-1/6 Aerospace Sealant
3M Aerospace Sealant AC-250 A-1/6 is a two-part, low temperature curing polysulfide, quick repair sealant for integral fuel tank and fuselage sealing applications. The mixed compound is a pourable l..
|
|||
| Cure Time |
720
-
1440
min <br>@Temperature 23.0 °C
|
12.0
-
24.0
hour <br>@Temperature 73.4 °F
|
Recommended Cure |
|
Aremco Aremco-Bond™ 2220 High Performance Epoxide
Ceramic-Filled, High Chemical Resistance, Machinable. For Repairing Deeply-Corroded Parts.
|
|||
| Cure Time |
720
-
1080
min <br>@Temperature 24.0 °C
|
12.0
-
18.0
hour <br>@Temperature 75.2 °F
|
|
|
BCC Products BC 7053 Epoxy Casting
BC 7053 is an iron filled epoxy casting system. This system is a high iron content material that provides unsurpassed wear resistance. BC7053 was designed for use in constructing core boxes, holding..
|
|||
| Cure Time |
720
-
960
min <br>@Temperature 24.0 °C
|
12.0
-
16.0
hour <br>@Temperature 75.2 °F
|
demold time |
|
BCC Products DP-11-83 Urethane Adhesive-Slo
DP-11-83 is a low viscosity, quick setting, easy to use adhesive and/or casting material. This product was designed to bond together the MB1200 foam board to create desired dimensions in length, wid..
|
|||
| Cure Time |
720
min <br>@Temperature 43.0 °C
|
12.0
hour <br>@Temperature 109 °F
|
Full Load |
|
Chesterton MRS 58 Metal Rebuilding System
An advanced ceramic composite for the repair and protection of all metal surfaces subjected to erosion, corrosion and chemical attack. It is normally applied at a thickness of 1.5 mm (60 mils) or mo..
|
|||