| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time |
120
-
180
min <br>@Temperature 65.0 °C
|
2.00
-
3.00
hour <br>@Temperature 149 °F
|
|
|
Resinlab® EP1287 Filled, Flame Retardant Epoxy Syntactic Foam
Resinlab™ EP1287 is a two part filled, flame retardant epoxy syntactic foam. It utilizes glass microspheres to reduce cured density and improve machinability. This product will be self-extinguishin..
|
|||
| Cure Time |
120
-
240
min <br>@Temperature 65.0 °C
|
2.00
-
4.00
hour <br>@Temperature 149 °F
|
|
|
NextGen Adhesives P907-10 Optical Assembly Adhesive
Description: NGAC P907-10 is a low viscosity and optically clear adhesive system that is specifically formulated for bonding and potting applications involving optical components and assemblies.Adva..
|
|||
| Cure Time |
120
min <br>@Temperature 66.0 °C
|
2.00
hour <br>@Temperature 151 °F
|
|
|
Parker Chomerics CHO-BOND 360-208 Conductive Epoxy
Low cost, electrically conductive epoxy adhesive that combines the good adhesive characteristics as epoxy, and the superior electrical conductivity of silver. It is recommended as a thermo-setting E..
|
|||
| Cure Time |
120
min <br>@Temperature 65.0 °C
|
2.00
hour <br>@Temperature 149 °F
|
|
|
Resin Technology Group 1161 Oxy-Bond™ Two-Component Epoxy Adhesive
Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma..
|
|||
| Cure Time |
120
min <br>@Temperature 149 °C
|
2.00
hour <br>@Temperature 300 °F
|
plus 2-12 hrs at 350°F |
|
Master Bond EP17HT One component epoxy system for bonding, sealing, coating and casting
Product Description: Master Bond EP17HT is an one component, heat cured epoxy system for bonding, sealing, coating and encapsulating. It features good physical properties, electrical insulation prof..
|
|||
| Cure Time |
120
-
150
min <br>@Temperature 93.3 °C
|
2.00
-
2.50
hour <br>@Temperature 200 °F
|
|
|
Master Bond EP21AR Acid Resistant Two Component Epoxy
Master Bond EP21AR is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealant with outstanding acid as well as excellent overall chemical resistance. E..
|
|||
| Cure Time |
120
min <br>@Temperature 93.3 °C
|
2.00
hour <br>@Temperature 200 °F
|
|
|
Master Bond EP21FRSPLV Flame Resistant Two Component Epoxy
Master Bond Polymer System EP21FRSPLV is a two component, room temperature curable, flame resistant compound for potting, encapsulating and casting. EP21FRSPLV has a one to one mix ratio, by weight...
|
|||
| Cure Time |
120
-
180
min <br>@Temperature 93.3 °C
|
2.00
-
3.00
hour <br>@Temperature 200 °F
|
|
|
Master Bond EP41S-1HTND Non-Drip, High Performance Epoxy Adhesive
Description: Master Bond EP41S-1HTND is a two component epoxy resin system for high performance bonding, sealing and coating. It has a 100 to 30 mix ratio by weight and its viscosity is a smooth pas..
|
|||
| Cure Time |
120
-
240
min <br>@Temperature 65.0 °C
|
2.00
-
4.00
hour <br>@Temperature 149 °F
|
|
|
Tra-Con Tra-Bond 216D02 Thixotropic No-Sag Epoxy Adhesive
TRA-BOND 216D02 is a thixotropic, two part epoxy adhesive formulated specifically for applications where a nonsagging adhesive is required. TRA-BOND 216D02 works in concert with TRA-CAST 3135 to per..
|
|||
| Cure Time |
120
min <br>@Temperature 121 °C
|
2.00
hour <br>@Temperature 250 °F
|
80 psi |
|
Zyvex Performance Materials Arovex™ 250 Carbon Nanotube Strengthened Prepreg
Arovex® 250 Prepreg is a 180°F (82°C) to 280°F (138°C) curing carbon nanotube strengthened epoxy prepreg suitable for numerous composites applications. Normal curing takes place at 250°F (121°..
|
|||
| Cure Time |
120
min <br>@Temperature 60.0 °C
|
2.00
hour <br>@Temperature 140 °F
|
|
|
Tra-Con Tra-Duct 926H01
Information provided by Tra-Con Inc.
|
|||
| Cure Time |
120
min <br>@Temperature 93.3 °C
|
2.00
hour <br>@Temperature 200 °F
|
|
|
Master Bond EP31 High Shear and Peel Strength Room Temperature Curing Epoxy
Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4600 psi. In addition, u..
|
|||
| Cure Time |
120
min <br>@Temperature 25.0 °C
|
2.00
hour <br>@Temperature 77.0 °F
|
Tack Free |
|
Chesterton MRS S2 Metal Rebuilding System
An advanced ceramic composite for the resurfacing and protection of all metal surfaces. It is normally applied at a thickness of 250 microns (10 mils) per coat. Non-shrinking, 100% solids. MRS S2 is..
|
|||
| Cure Time |
120
min <br>@Temperature 25.0 °C
|
2.00
hour <br>@Temperature 77.0 °F
|
Full Chemical |
|
Chesterton MRS 5 Metal Rebuilding System
MRS 5 is an advanced composite formulated for emergency repair and patching of metal components subject to light abrasive and corrosive conditions. It can be used to seal leaks and patch holes as we..
|
|||
| Cure Time |
120
min <br>@Temperature 232 °C
|
2.00
hour <br>@Temperature 450 °F
|
Recommended Postcure Cycle |
|
Arlon 48576R005 0.0055" (0.140 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate
Design/Construction:Side 1: Cured RubberSide 2: Uncured RubberThis data represents typical values for the production material. The data should not be used to write, or in place of, material specific..
|
|||
| Cure Time |
120
min <br>@Temperature 204 °C
|
2.00
hour <br>@Temperature 400 °F
|
Recommended Postcure Cycle |
|
Arlon 55578R036 0.036" (0.914 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate
Design/Construction: Interleave: PolyethyleneSide 2, Layer 2: Uncured Silicone Rubber Side 2, Layer 1: Cured Silicone Rubber Substrate: Style 162 Fiberglass Side 1: Cured Silicone Rubber Appearance:..
|
|||
| Cure Time |
120
min <br>@Temperature 204 °C
|
2.00
hour <br>@Temperature 400 °F
|
Recommended Postcure Cycle |
|
Arlon 55579R043 0.043" (1.09 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate
Design/Construction:Side 1: Uncured layer on top of a cured layer on one side Appearance: Red silicone gum and rubber on fiberglass clothThis data Represents typical values for the production materi..
|
|||
| Cure Time |
120
min <br>@Temperature 79.4 °C
|
2.00
hour <br>@Temperature 175 °F
|
Step 1 of recommended 2 step cure |
|
Aremco Aremco-Bond™ 2340 High Temperature Epoxide Potting Compound
High Temperature, Low Viscosity, Low Expansion, High Glass Transition Temperature & Chemical Resistance
|
|||
| Cure Time |
120
min <br>@Temperature 93.3 °C
|
2.00
hour <br>@Temperature 200 °F
|
Recommended Cure |
|
Aremco Aremco-Bond™ 657 High Performance Epoxide
Stainless Steel-Filled, High Corrosion Resistance.
|
|||
| Cure Time |
120
min <br>@Temperature 93.3 °C
|
2.00
hour <br>@Temperature 200 °F
|
Step 1, preceeded by 1-4 hour air set |
|
Aremco Ceramabond™ 618-N High Temperature Ceramic Adhesive/Paste, Silica Filled
Aremco's ceramic adhesives are easy to use, one- and two-component systems which air dry in 1-2 hrs and are ready for use following a 200 to 700 °F cure. These materials are mostly water-based and..
|
|||
| Cure Time |
120
min <br>@Temperature 260 °C
|
2.00
hour <br>@Temperature 500 °F
|
Step 2 |
|
Aremco Ceramabond™ 632 High Temperature Ceramic Adhesive/Paste, Mica Filled
Aremco's ceramic adhesives are easy to use, one- and two-component systems which air dry in 1-2 hrs and are ready for use following a 200 to 700 °F cure. These materials are mostly water-based and..
|
|||
| Cure Time |
120
min <br>@Temperature 93.3 °C
|
2.00
hour <br>@Temperature 200 °F
|
Step 1, preceeded by 1-4 hour air set |
|
Aremco Ceramabond™ 835-MB High Temperature Ceramic Adhesive/Paste, Alumina Filled
Aremco's ceramic adhesives are easy to use, one- and two-component systems which air dry in 1-2 hrs and are ready for use following a 200 to 700 °F cure. These materials are mostly water-based and..
|
|||
| Cure Time |
120
min <br>@Temperature 204 °C
|
2.00
hour <br>@Temperature 400 °F
|
Recommended Post Cure Cycle |
|
Arlon 41940C020 0.015" Uncured, Unsupported Silicone Rubber on Release Carrier
Design/Construction:Interleave: 0.003" PolyethyleneSide 1: Uncured, Unsupported Silicone RubberSubstrate: Holland Cloth CarrierThis data represents typical values for the production material and ..
|
|||
| Cure Time |
120
min <br>@Temperature 204 °C
|
2.00
hour <br>@Temperature 400 °F
|
Recommended Postcure Cycle |
|
Arlon R34880T020 0.020" (0.508 mm) Uncatalyzed, Unsupported rubber on a Mylar Carrier
Design/Construction:Side 1: Uncatalyzed, Unsupported rubber on a Mylar Carrier This data Represents typical values for the production material. The data should not be used to write, or in place of, ..
|
|||
| Cure Time |
120
min <br>@Temperature 204 °C
|
2.00
hour <br>@Temperature 400 °F
|
Recommended Postcure Cycle |
|
Arlon R35366X020 0.020" (0.508 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate
Design/Construction:Interleave: Polyethylene Side 2: Uncured Silicone RubberSubstrate: Style 7628 Fiberglass Side 1: Cured Silicone Rubber Appearance: Gray gum on glass fiber fabricThis data represe..
|
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