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Polymer Property : Cure Time = 120 min Product List
Processing PropertiesTips: 30 items are displayed at most.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time |
60.0
-
120
min @Temperature 65.0 °C |
1.00
-
2.00
hour @Temperature 149 °F |
|
|
Resinlab® EP1285HD-9 Highly Filled, Medium Viscosity Casting Resin
Resinlab™ EP1285 (Formerly Lab Product W021901 series) is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity and a low C..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 65.0 °C |
1.00
-
2.00
hour @Temperature 149 °F |
|
|
NextGen Adhesives G907-25 Optical Epoxy Adhesive
Description: NGAC G907-25 is a low viscosity and clear adhesive system that is specifically formulated for optical and laser applications.Advantages and Applications: The NGAC G907-25 provides high ..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 25.0 °C |
1.00
-
2.00
hour @Temperature 77.0 °F |
De-mold Time |
|
Northstar Polymers MPP-F07A Easy Hand-Mixable/Pourable Flexible Foam
This foam formulation is designed to make molded flexible foam parts/sheets/dies/blocks by hand-mixing with very basic tools such as a cup and stir stick. The components are low-viscosity stable li..
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|||
| Cure Time |
60.0
-
120
min @Temperature 93.3 - 98.9 °C |
1.00
-
2.00
hour @Temperature 200 - 210 °F |
first |
|
Master Bond EP112LS Two part, heat curing epoxy for potting, encapsulation, coating, sealing and impregnation
Master Bond EP112LS is a low viscosity two component epoxy resin system for potting, encapsulation, sealing, coating and impregnation. The mix ratio is an easy to use 100:80 by weight. EP112LS offer..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 93.3 °C |
1.00
-
2.00
hour @Temperature 200 °F |
|
|
Master Bond EP30 Optically Clear, Low Viscosity Two Component Epoxy
Master Bond Polymer System EP30 is a low viscosity, two component epoxy system for high performance bonding, coating, sealing, potting and encapsulation. It readily cures at room temperature or more..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 93.3 °C |
1.00
-
2.00
hour @Temperature 200 °F |
|
|
Master Bond EP30FL Low Viscosity, Flexibilized Two Component Epoxy
Master Bond Polymer System EP30FL is a low viscosity, flexibilized, two component epoxy resin system for high performance potting, casting, encapsulation as well as bonding and sealing. Master Bond ..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 93.3 °C |
1.00
-
2.00
hour @Temperature 200 °F |
|
|
Master Bond EP41S-1 Chemically Resistant Two Component Epoxy System
Master Bond Polymer System EP41S-1 is a two component epoxy resin system designed for durable, high performance
bonding, sealing, coating and encapsulating. It successfully withstands prolonged imm..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 93.3 °C |
1.00
-
2.00
hour @Temperature 200 °F |
|
|
Master Bond EP51FL-1 Rapid Curing Cryogenic Two Component Epoxy
Master Bond Polymer System EP51FL-1 is a two component highly flexible epoxy resin system for high performance bonding sealing and coating. Although most flexiblilized epoxy formulations are very sl..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 93.3 °C |
1.00
-
2.00
hour @Temperature 200 °F |
|
|
Master Bond EP76M-F Electrically Conductive, Two Part Epoxy
Description: Master Bond EP76M-F is a two component, nickel filled, electrically conductive epoxy system for high performance bonding, sealing, and coating formulated to cure at room temperature or ..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 93.3 °C |
1.00
-
2.00
hour @Temperature 200 °F |
|
|
Master Bond Supreme 11ANHT Fast Curing Epoxy Paste System
Description: Master Bond Polymer System SUPREME 11ANHT is a two component epoxy resin system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevat..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 125 °C |
1.00
-
2.00
hour @Temperature 257 °F |
|
|
Tra-Con Tra-Bond 933-2 Moisture Resistant Chip Encapsulant
TRA-BOND 933-2 one component, highly filled, electrically insulating epoxy encapsulant is designed for encapsulating microelectronic chips. This epoxy provides excellent environmental and mechanical..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 65.0 °C |
1.00
-
2.00
hour @Temperature 149 °F |
|
|
Tra-Con Tra-Bond F110 Optically Transparent Low Viscosity Epoxy Adhesive
TRA-BOND F110 is a rigid, optically clear adhesive with a very low viscosity. This room temperature curing system is an excellent choice for thin bond-line assembly and repair applications of prisms..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 65.0 °C |
1.00
-
2.00
hour @Temperature 149 °F |
|
|
Tra-Con Tra-Bond F113 High Impact Optically Clear Epoxy Adhesive
TRA-BOND F113 is an optically clear, low viscosity, high impact epoxy adhesive developed for bonding and small volume potting of plastic or glass optical fibers, lenses, and prisms, LED displays, an..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 65.0 °C |
1.00
-
2.00
hour @Temperature 149 °F |
|
|
Trelleborg Emerson & Cuming Eccobond® 1309 General Purpose Catalyst
Emerson & Cuming 1309 Eccobond® General Purpose CatalystFaster curing version of 9. Very fast room temperature curing, low viscosity, general purpose. Short working life. Imparts excellent chemical..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 65.0 °C |
1.00
-
2.00
hour @Temperature 149 °F |
|
|
Trelleborg Emerson & Cuming Eccobond® 24 LV General Purpose Catalyst
Emerson & Cuming 24 LV Eccobond® General Purpose CatalystFaster curing, shorter working life version of 23 LV. Recommended for small mass castings due to higher exotherm. Cure Type: Room Temp or He..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 65.0 °C |
1.00
-
2.00
hour @Temperature 149 °F |
|
|
Trelleborg Emerson & Cuming Eccobond® 43 Heat Cure Catalyst
Emerson & Cuming 43 Eccobond® Heat Cure CatalystRoom temperature gelling version of 28. Excellent for low stress potting and bonding. Will post cure in actual use. Combines the benefits of both 9 a..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 65.0 °C |
1.00
-
2.00
hour @Temperature 149 °F |
|
|
Trelleborg Emerson & Cuming Eccobond® 9 General Purpose Catalyst
Emerson & Cuming 9 Eccobond® General Purpose CatalystGeneral purpose, low viscosity. Imparts good physical strength and chemical resistance to cured castings. Recommended for most general purpose a..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 93.3 °C |
1.00
-
2.00
hour @Temperature 200 °F |
|
|
Master Bond EP21TDCSLO Two Component Silver Conductive Epoxy Adhesive
Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rap..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 93.3 °C |
1.00
-
2.00
hour @Temperature 200 °F |
|
|
Master Bond EP30HT High Temperature Resistant Two Component Epoxy System
Master Bond Polymer Adhesive EP30HT is a medium viscosity, two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, w..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 93.3 °C |
1.00
-
2.00
hour @Temperature 200 °F |
|
|
Master Bond EP33ND Epoxy Paste Resists Harsh Chemicals
Description: Master Bond EP33ND is a two part, room temperature curing epoxy system used for bonding, sealing and coating featuring high temperature resistance, good dimensional stability and very g..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 93.3 °C |
1.00
-
2.00
hour @Temperature 200 °F |
|
|
Master Bond EP34 Room Temperature Curing Two Component Epoxy System
Master Bond Polymer System EP34 is a unique room temperature curing two component epoxy compound for high temperature potting and encapsulating applications. Adhesion to metals, glass, ceramics, woo..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 65.0 °C |
1.00
-
2.00
hour @Temperature 149 °F |
2nd step |
|
Abatron AboCast 8502-5/AboCure 8502-5 Colorless, Low-Exotherm Epoxy Casting Compound
AboCast 8502-5/AboCure 8502-5 is a rigid, colorless, low-exotherm epoxy casting compound for spherical masses up to 500 grams. It is a 2-component structural and dielectric liquid system with extrem..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 65.0 °C |
1.00
-
2.00
hour @Temperature 149 °F |
|
|
Atom Adhesives AA-BOND F113 Epoxy Adhesive
AA-BOND F113 is an Optically Clear, low viscosity , High impact epoxy adhesives developed for bonding and small volume potting of plastic or glass optical fibers, lenses and prisms, LED displays, an..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 150 - 160 °C |
1.00
-
2.00
hour @Temperature 302 - 320 °F |
|
|
Abatron AboCast 8103-13 One-Component Epoxy
AboCast 8103-13 is the low-viscosity one-component clear epoxy system with deep impregnation that offers high performance at relatively high temperatures. It is best for thin-wall casting. Suggested..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 150 - 160 °C |
1.00
-
2.00
hour @Temperature 302 - 320 °F |
|
|
Abatron AboCast 8504-1 One-Component Epoxy
AboCast 8504-1 is a clear, all-purpose one-component epoxy system, with an optimum balance of properties for most casting, adhesive, impregnation, and coating applications.
|
|||
| Cure Time |
60.0
-
120
min @Temperature 24.0 °C |
1.00
-
2.00
hour @Temperature 75.2 °F |
demold time |
|
BCC Products BC 8165 Urethane Casting
BC 8165 is a low viscosity, rapid setting, rigid urethane compound. This system will cure quickly to a hard, tough, impact resistant casting. BC 8165 is non-sensitive to moisture after cure and wil..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 65.0 °C |
1.00
-
2.00
hour @Temperature 149 °F |
|
|
Atom Adhesives AA-BOND F110 Epoxy Adhesive
AA-BOND F110 is a rigid, optically clear adhesive with a very low viscosity. AA-BOND F110 is room temperature system an excellent choice for thin bond-line assembly and repair applications of prisms..
|
|||
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