Polymer Property : Cure Time = 1440 min Product List

Processing Properties

Tips: 30 items are displayed at most.

Processing Properties	Metric	English	Comments
Cure Time	1440 min <br>@Temperature 25.0 °C	24.0 hour <br>@Temperature 77.0 °F
NextGen Adhesives P907-26 Optical Assembly Adhesive Description: NGAC P907-26 is a low viscosity and room temperature curing adhesive specifically formulated for optical applications where clarity is critical.Advantages and Applications: Uses include..
Cure Time	1440 - 2160 min <br>@Temperature 25.0 °C	24.0 - 36.0 hour <br>@Temperature 77.0 °F	Complete Cure Cycle
Northstar Polymers MPP-A47A Liquid Castable Polyurethane MPP-A47A is a room-temperature-cure liquid castable polyurethane system. This ether-base polyurethane system is used in applications such as mold-making, prototyping, production of cast parts, pott..
Cure Time	1440 min <br>@Temperature 23.0 °C	24.0 hour <br>@Temperature 73.4 °F	Zinc, full strength
Permabond HM118 Anaerobic Threadlocker Permabond® HM118 Threadlocker is an excellent general-purpose threadlocker and sealant. It is used for locking bolts, nuts and screws that require permanent assembly. Cure is fast and reliable on s..
Cure Time	1440 min <br>@Temperature 23.0 °C	24.0 hour <br>@Temperature 73.4 °F	M10 steel, full strength
Permabond HM128 Anaerobic Threadlocker Permabond® HM128 Threadlocker is a high strength adhesive for permanent assembly. It is typically used for preventing vibration loosening of bolts, studs and cap screws. Full cure to a cross-linked..
Cure Time	1440 min <br>@Temperature 23.0 °C	24.0 hour <br>@Temperature 73.4 °F	M10 steel, full strength
Permabond HM161 Anaerobic Retaining Compound Permabond® HM161 is a single component liquid that cures only when in contact with metal parts and oxygen is excluded. The liquid adhesive fills the “air space’ between parts and upon cure unitiz..
Cure Time	1440 min <br>@Temperature 23.0 °C	24.0 hour <br>@Temperature 73.4 °F	M10 steel, full strength
Permabond HM162 Anaerobic Retainer Permabond® HM162 is a medium viscosity retaining compound that cures when confined between metal parts to form an extremely tough bond. It is best suited for cylindrical parts and where high temper..
Cure Time	1440 min <br>@Temperature 24.0 °C	24.0 hour <br>@Temperature 75.2 °F
Parker Chomerics CHO-BOND 360-20 Conductive Epoxy Low cost, electrically conductive epoxy adhesive that combines the good adhesive characteristics as epoxy, and the superior electrical conductivity of silver. It is recommended as a thermo-setting E..
Cure Time	1440 - 2880 min <br>@Temperature 23.0 °C	24.0 - 48.0 hour <br>@Temperature 73.4 °F
Master Bond EP21 Room Temperature Curing Epoxy System Room temperature curing epoxy adhesive Master Bond EP21 has outstanding physical properties and durability. Its variable mix ratio feature allows you to adjust the type of cure to get either a more ..
Cure Time	1440 - 2160 min <br>@Temperature 23.9 °C	24.0 - 36.0 hour <br>@Temperature 75.0 °F
Master Bond EP21TDCS Two Component Silver Conductive Epoxy Adhesive Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidl..
Cure Time	1440 min <br>@Temperature 25.0 °C	24.0 hour <br>@Temperature 77.0 °F
Tra-Con Tra-Bond 5126 Medium Viscosity Aerospace-Grade Epoxy Adhesive TRA-BOND 5126 AEROSPACE-GRADE EPOXY ADHESIVE is a two-part, clear (amber), medium viscosity, aerospace-grade epoxy adhesive system recommended for bonding a wide variety of materials for structural ..
Cure Time	1440 min <br>@Temperature 25.0 °C	24.0 hour <br>@Temperature 77.0 °F
Tra-Con Tra-Bond F112 Fiber Optic Epoxy Adhesive TRA-BOND F112 is a long pot life, impact resistant, fiber-optic adhesive. This two-part, low viscosity epoxy has the distinct advantage of remaining below 3000 cps for a minimum of 40 minutes. This ..
Cure Time	1440 min <br>@Temperature 25.0 °C	24.0 hour <br>@Temperature 77.0 °F
Tra-Con Tra-Cast 3108 General Purpose Epoxy Casting Compound TRA-CAST 3108 is a low viscosity two-part formulation recommended for underfill and encapsulating applications where the combination of good mechanical thermal and electrical properties are required..
Cure Time	1440 - 2880 min <br>@Temperature 23.0 °C	24.0 - 48.0 hour <br>@Temperature 73.4 °F
Master Bond EP34 Room Temperature Curing Two Component Epoxy System Master Bond Polymer System EP34 is a unique room temperature curing two component epoxy compound for high temperature potting and encapsulating applications. Adhesion to metals, glass, ceramics, woo..
Cure Time	1440 min <br>@Temperature 25.0 °C	24.0 hour <br>@Temperature 77.0 °F
Tra-Con Tra-Bond 2101 General Purpose Epoxy Adhesive TRA-BOND 2101 is a medium viscosity epoxy formulation recommended for laminating, bonding, repair and other adhesive applications where the combination of its superior structural, mechanical and ele..
Cure Time	1440 min <br>@Temperature 25.0 °C	24.0 hour <br>@Temperature 77.0 °F
Tra-Con Tra-Duct 2902 Room Temperature Conductive Silver Epoxy Adhesive TRA-DUCT 2902 is an electrically conducting silver-filled epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical prop..
Cure Time	1440 min <br>@Temperature 16.0 °C	24.0 hour <br>@Temperature 60.8 °F	Light Load
Chesterton ARC CS4 low-viscosity, 100% solids, barrier coating Description: An advanced composite formulated to protect concrete surfaces from harsh chemical attack. It is normally applied at a thickness of 250-375 microns (10-15 mils) per coat in a 2 coat syst..
Cure Time	1440 min <br>@Temperature 32.0 °C	24.0 hour <br>@Temperature 89.6 °F	Overcoat End
Chesterton ARC S1 General purpose coating Description: An advanced polymer composite formulated to protect metal surfaces from corrosion and chmical attack. It is normally applied at a thickness of 250 microns (10 mils) per coat. Non-shrink..
Cure Time	1440 min <br>@Temperature 10.0 °C	24.0 hour <br>@Temperature 50.0 °F	Light Load
Chesterton ARC SD4i High temperature ceramic reinforced erosion resistant coating Description: An advanced ceramic composite for resurfacing and protection of metal surfaces in immersion service. It is normally applied in a thickness range of 250-370 microns (10-15 mils) per coat..
Cure Time	1440 min <br>@Temperature 23.0 °C	24.0 hour <br>@Temperature 73.4 °F
Epoxy Technology EPO-TEK® 305 Spectrally Transparent Epoxy Product Description: EPO-TEK® 305 is a two component, semi-rigid, optical grade epoxy for semiconductor packaging of fiber optics, optoelectronics and medical devices. It is an electrically and th..
Cure Time	1440 min <br>@Temperature 25.0 °C	24.0 hour <br>@Temperature 77.0 °F
Epoxyset Epoxibond EB-135 Unfilled Epoxy Adhesive A two-component, unfilled epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries. EB-135 has excellent bond strength to various substrat..
Cure Time	1440 min <br>@Temperature 25.0 °C	24.0 hour <br>@Temperature 77.0 °F
Epoxyset Epoxibond EB-301 Low Expansion Epoxy Adhesive EB-301 is a highly filled, low expansion, epoxy adhesive. This low out-gassing adhesive exhibits excellent wettability without preheating metal bonding surfaces and has a good dimensional stability ..
Cure Time	>= 1440 min <br>@Temperature 22.0 - 30.0 °C	>= 24.0 hour <br>@Temperature 71.6 - 86.0 °F
Abatron AboWeld 8201-14/AboCure 8201-14 Carbon-Filled Electrically Conductive Epoxy Compound AboWeld 8201-14/AboCure 8201-14 is an easy-to-use and very conductive carbon-epoxy paste. As the size of the conductive particles is relatively coarse, this product is used primarily as a thick adhe..
Cure Time	1440 min <br>@Temperature 25.0 °C	24.0 hour <br>@Temperature 77.0 °F
Atom Adhesives AA-BOND 2104 Epoxy Adhesive AA-BOND 2104 is a thixotropic epoxy system recommended for critical electronics, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-s..
Cure Time	1440 min <br>@Temperature 25.0 °C	24.0 hour <br>@Temperature 77.0 °F
Atom Adhesives AA-BOND FDA8 Epoxy Adhesive AA-BOND FDA8 EPOXY ADHESIVE is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and ..
Cure Time	1440 - 4320 min <br>@Temperature 25.0 °C	24.0 - 72.0 hour <br>@Temperature 77.0 °F
Tra-Con Tra-Bond 516H01 Low Viscosity Room Temperature Cure Adhesive TRA-BOND 516H01 is a room temperature curing, low viscosity adhesive formulated for terminating ALL TYPES of fiber optic connectors, including Pre-Mixed and Frozen applications. It has also been use..