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Polymer Property : Cure Time = 15.0 min Product List
Processing PropertiesTips: 30 items are displayed at most.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time |
15.0
min @Temperature 116 °C |
0.250
hour @Temperature 241 °F |
|
|
Parker Chomerics CHO-BOND 589-29 Conductive Epoxy
Low cost, highly conductive adhesive system which combines the strong adhesion characteristics of an epoxy with the superior conductivity of silver. CHO-BOND 589-29 adhesive meets the most exacting ..
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| Cure Time |
15.0
min @Temperature 125 °C |
0.250
hour @Temperature 257 °F |
|
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Parker Chomerics CHO-BOND 592 Conductive Epoxy
Highly conductive silver-filled epoxy adhesive which combines the best properties of metals and organics. This two-component system is unique in that it combines long pot life, good electrical condu..
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| Cure Time |
15.0
min @Temperature 23.0 °C |
0.250
hour @Temperature 73.4 °F |
M10 steel, handling strength |
|
Permabond HM160 Anaerobic Retaining Compound
Permabond® HM160 is a medium viscosity liquid adhesive that cures when confined between metal parts to form a tough, hard plastic. In the uncured, liquid state, the adhesive wets the metal surfaces..
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| Cure Time |
15.0
min @Temperature 25.0 °C |
0.250
hour @Temperature 77.0 °F |
De-mold Time |
|
Northstar Polymers MCG-1 OOO Scale Microcellular Gel Elastomer
MCG-1 is formulated for making extremely soft products. MCG-1 has unique structure for this class of material. The cured product will be slightly foamed and give a very soft touch, yet faster resp..
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| Cure Time |
15.0
-
20.0
min @Temperature 60.0 °C |
0.250
-
0.333
hour @Temperature 140 °F |
|
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Lord Adhesives Thermosetâ„¢ SC-102 Unfilled Silicone Encapsulant
Lord SC-102 is a "water-white" clear, two component, silicone encapsulating system. It has a very low viscosity and, when cured, a low Shore A hardness. Lord SC-102 is optically transparent with no ..
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| Cure Time |
15.0
min @Temperature 100 °C |
0.250
hour @Temperature 212 °F |
|
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Gwent Electronic Materials C2090428D4 Gold Ink
Gold Ink is a fritted system that has been designed as a screen printing ink for uses on Alumina. It is also suitable for firing onto other high temperature substrates. This product should be used ..
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| Cure Time |
15.0
min @Temperature 90.0 °C |
0.250
hour @Temperature 194 °F |
|
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Tra-Con Tra-Bond 526H02
Information provided by Tra-Con Inc.
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| Cure Time |
15.0
min @Temperature 90.0 °C |
0.250
hour @Temperature 194 °F |
1 drop applications |
|
Tra-Con Tra-Bond F118 Fiber Optic Epoxy Adhesive
TRA-BOND F118 is an impact resistant, fiber-optic adhesive designed for use in any optical connector. This two-part epoxy remains at a constant viscosity for a minimum of 30 minutes. This allows mor..
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| Cure Time |
15.0
min @Temperature 100 °C |
0.250
hour @Temperature 212 °F |
|
|
Tra-Con Tra-Bond JL01 High Viscosity High Temperature Fiber Optic Adhesive
TRA-BOND JL01 is a high viscosity, two-component epoxy formulation that is suggested for bonding fiber optic bundles, potting glass fibers, and terminating single or multi-channel fiber optic connec..
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| Cure Time |
15.0
min @Temperature 125 °C |
0.250
hour @Temperature 257 °F |
|
|
Tra-Con Tra-Bond Ablebond 868-7 Thixotropic Epoxy Adhesive
Ablebond 868-7 flexible epoxy adhesive is a thixotropic version of the 868-series. This nonsag adhesive provides strong bonds to a variety of surfaces.Information provided by Tra-Con Inc.
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| Cure Time |
15.0
min @Temperature 90.0 °C |
0.250
hour @Temperature 194 °F |
1 drop applications |
|
Tra-Con Tra-Bond F109 Fiber Optic Epoxy Adhesive
TRA-BOND F109 is specially designed to be used in fiber optic connectors where connections must be made in high humidity environments. This two part, low viscosity epoxy remains at a constant viscos..
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| Cure Time |
15.0
min @Temperature 150 °C |
0.250
hour @Temperature 302 °F |
Minimum Bond Line |
|
Epoxy Technology EPO-TEK® E3001-HV Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & ..
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| Cure Time |
15.0
min @Temperature 120 °C |
0.250
hour @Temperature 248 °F |
minimum |
|
Epoxy Technology EPO-TEK® OD2002 High Temperature Epoxy
Material Description: High Tg version of EPO-TEK®353ND with low modulus and good toughness. Replacement for EPO-TEK® 364. Complies with USP Class VI biocompatibility standards.Information Provid..
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| Cure Time |
15.0
-
30.0
min @Temperature 22.0 °C |
0.250
-
0.500
hour @Temperature 71.6 °F |
|
|
Dow Corning 3-4680 SILICONE GEL KIT
Two-part, transparent blue, fast RT or heat cure, low viscosity.Information provided by Dow Corning
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| Cure Time |
15.0
min @Temperature 177 °C |
0.250
hour @Temperature 350 °F |
Recommended Cure Cycle |
|
Arlon 30300R062 0.062" (1.57 mm) Uncured Silicone Rubber on Kodacel Carrier
Design/Construction: Interleave: Polyethylene Side 1: Uncured Silicone RubberCarrier: KodacelAppearance: Red silicone gum on polymer linersThis data represents typical values for the production mate..
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| Cure Time |
15.0
min @Temperature 177 °C |
0.250
hour @Temperature 350 °F |
Recommended Cure Cycle |
|
Arlon 41570R020 0.020" Uncured, Unsupported Silicone Rubber on Release Carrier
Design/Construction:Interleave: 0.003" PolyethyleneSide 1: Uncured, Unsupported Silicone RubberSubstrate: Holland Cloth CarrierThis data represents typical values for the production material and ..
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| Cure Time |
15.0
min @Temperature 177 °C |
0.250
hour @Temperature 350 °F |
Recommended Cure Cycle |
|
Arlon 55578XA030 0.032" (0.813 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate
Design/Construction: Interleave: PolyethyleneSide 2, Layer 2: Uncured Silicone Rubber Side 2, Layer 1: Cured Silicone Rubber Substrate: 162 Style Fiberglass Side 1: Cured Silicone Rubber (Skim Coat)..
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| Cure Time |
15.0
min @Temperature 177 °C |
0.250
hour @Temperature 350 °F |
Recommended Cure Cycle |
|
Arlon 55578XD028 0.028" (0.711 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate
Design/Construction:Side 1: Cured Silicone RubberSide 2: Cured/Uncured Layers Appearance: Gray silicone gum and/or rubber on fiberglass clothThis data Represents typical values for the production ma..
|
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| Cure Time |
15.0
min @Temperature 177 °C |
0.250
hour @Temperature 350 °F |
Recommended Cure Cycle |
|
Arlon 55579R043W 0.043" (1.09 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate
Design/Construction:Side 1: Uncured layer on top of a cured layer on one side This data Represents typical values for the production material. The data should not be used to write, or in place of, m..
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| Cure Time |
15.0
-
30.0
min @Temperature 150 °C |
0.250
-
0.500
hour @Temperature 302 °F |
|
|
ACC QGel 315 QSI Quantum Silicones General Purpose Silicone Gel
QGel 315 is a clear, very soft, tough moderately cross-linked silicone polymer. Silicone gels are used to provide protection from vibration and thermal or mechanical shock. Silicone gels also provid..
|
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| Cure Time |
15.0
min @Temperature 200 °C |
0.250
hour @Temperature 392 °F |
|
|
ACC QLE 1050 QSI Quantum Silicones 30 Durometer Clear, Addition Cure, 1-part Elastomer for Coating
QLE 1050 is a 100% silicone solids elastomer designed for use as a conformal coating, but can also be used for cloth coating applications. Key Features: 100% solids Transparent, ideal for pigmentat..
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| Cure Time |
15.0
min @Temperature 177 °C |
0.250
hour @Temperature 350 °F |
Recommended Cure Cycle |
|
Arlon 47091R012 0.012" (0.305 mm) Uncured Rubber with Fiberglass Substrate
Design/Construction:Side 1: Uncured RubberSide 2: Uncured RubberAppearance: Red silicone gum on polymer linerThis data represents typical values for the production material. The data should not be u..
|
|||
| Cure Time |
15.0
min @Temperature 177 °C |
0.250
hour @Temperature 350 °F |
Recommended Cure Cycle |
|
Arlon 51344R020 0.020" (0.508 mm) Semi-Cured Silicone Rubber with Fiberglass Substrate
Design/Construction:Side 1: Semi-Cured Silicone Rubber Appearance: Red silicone gum on fiberglass clothThis data Represents typical values for the production material. The data should not be used to..
|
|||
| Cure Time |
15.0
min @Temperature 177 °C |
0.250
hour @Temperature 350 °F |
Recommended Cure Cycle |
|
Arlon R33089X028 0.029" (0.737 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate
Design/Construction:Side 1: Cured Silicone RubberSide 2: Cured/Uncured Layers This data Represents typical values for the production material. The data should not be used to write, or in place of, m..
|
|||
| Cure Time |
15.0
min @Temperature 177 °C |
0.250
hour @Temperature 350 °F |
Recommended Cure Cycle |
|
Arlon 45561R007 0.007"(0.178 mm) Uncured Rubber with Fiberglass Substrate
Design/Construction:Side 1: Uncured RubberSide 2: Uncured RubberAppearance: Red silicone gum on fiberglass fabricThis data represents typical values for the production material. The data should not ..
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|||
| Cure Time |
15.0
min @Temperature 23.0 °C |
0.250
hour @Temperature 73.4 °F |
Brass, working strength |
|
Permabond A1046 Anaerobic Retainer
Permabond® A1046 is a rapid curing adhesive designed to provide permanent locking and sealing of metal parts such as bearings, gears, pulleys and threaded components. It exhibits high strength and ..
|
|||
| Cure Time |
15.0
min @Temperature 23.0 °C |
0.250
hour @Temperature 73.4 °F |
M10 steel, handling strength |
|
Permabond A118 Anaerobic Retainer
Permabond® A118 is an anaerobic adhesive designed to provide permanent locking and sealing of metal parts such as bearings, gears, studs and other threaded components. It exhibits high strength, ex..
|
|||
| Cure Time |
15.0
min @Temperature 177 °C |
0.250
hour @Temperature 350 °F |
Recommended Cure Cycle |
|
Arlon 48571R006 0.0055" (0.140 mm) Uncured Silicone Rubber with Fiberglass Substrate
Design/Construction:Side 1: Uncured RubberSide 2: Uncured RubberThis data represents typical values for the production material. The data should not be used to write, or in place of, material specif..
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