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Polymer Property : Cure Time = 180 min Product List
Processing PropertiesTips: 30 items are displayed at most.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time |
180
-
240
min <br>@Temperature 25.0 °C
|
3.00
-
4.00
hour <br>@Temperature 77.0 °F
|
handling time |
|
Permabond ET5401 Epoxy Resin
PERMABOND® ET5401 is a two-part, 2:1 mixable, semi-flexible toughened no slump epoxy adhesive with good adhesion to a variety of substrates such as wood, metal, ceramics and some plastics and compo..
|
|||
| Cure Time |
180
min <br>@Temperature 23.0 °C
|
3.00
hour <br>@Temperature 73.4 °F
|
Zinc, working strength |
|
Permabond HM163 Anaerobic Retainer
Permabond® HM163 is a medium viscosity, thixotropic anaerobic retaining compound that cures when confined between metal parts to form a tough bond. It has been specifically formulated to provide a ..
|
|||
| Cure Time |
180
-
360
min <br>@Temperature 23.0 °C
|
3.00
-
6.00
hour <br>@Temperature 73.4 °F
|
Brass, working strength |
|
Permabond LH050 Anaerobic Threadsealant
Permabond® LH050 pipe sealant with PTFE is a general purpose pipe sealant that provides instant air pressure seal up to 1000 psi with limited hand tightening. After cure, the sealing capability is ..
|
|||
| Cure Time |
180
min <br>@Temperature 23.0 °C
|
3.00
hour <br>@Temperature 73.4 °F
|
Stainless steel, handling strength |
|
Permabond LH150 Anaerobic Threadsealant
Permabond® LH150 Pipe Sealant with PTFE is designed for sealing and locking tapered metal pipe threads and fittings. It is ideal for stainless steel and other passive metals. Instant sealing of up ..
|
|||
| Cure Time |
180
-
360
min <br>@Temperature 23.0 °C
|
3.00
-
6.00
hour <br>@Temperature 73.4 °F
|
M10 steel, working strength |
|
Permabond LH150 Anaerobic Threadsealant
Permabond® LH150 Pipe Sealant with PTFE is designed for sealing and locking tapered metal pipe threads and fittings. It is ideal for stainless steel and other passive metals. Instant sealing of up ..
|
|||
| Cure Time |
180
min <br>@Temperature 23.0 °C
|
3.00
hour <br>@Temperature 73.4 °F
|
Aluminum, handling strength |
|
Permabond MH199 Anaerobic Gasketmaker
Permabond® MH199 is an anaerobic material designed for making “formed in situ” gaskets between metal surfaces. It is capable of replacing a wide range of conventional gaskets, thereby offering po..
|
|||
| Cure Time |
180
min <br>@Temperature 100 °C
|
3.00
hour <br>@Temperature 212 °F
|
|
|
Momentive Performance Materials TSE3221 Flowable, Heat Cured One Component Silicone Adhesive
TSE 3221 is a one-component, flowable, heat curing adhesive which is translucent in color and offers primerless adhesion to a wide variety of substrates. This product requires an elevated temperatur..
|
|||
| Cure Time |
180
min <br>@Temperature 25.0 °C
|
3.00
hour <br>@Temperature 77.0 °F
|
|
|
Henkel Frekote Aqualine C-800 Mold Release Agent
A water-based, zero VOC, mold release designed for releasing composite materials. This product offers easy application and higher number of releases which causes lower product usage and less operato..
|
|||
| Cure Time |
180
-
240
min <br>@Temperature 121 °C
|
3.00
-
4.00
hour <br>@Temperature 250 °F
|
second, Post Curing 350°F |
|
Master Bond EP112LS Two part, heat curing epoxy for potting, encapsulation, coating, sealing and impregnation
Master Bond EP112LS is a low viscosity two component epoxy resin system for potting, encapsulation, sealing, coating and impregnation. The mix ratio is an easy to use 100:80 by weight. EP112LS offer..
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|||
| Cure Time |
180
-
240
min <br>@Temperature 121 - 149 °C
|
3.00
-
4.00
hour <br>@Temperature 250 - 300 °F
|
|
|
Master Bond Ep46HT-2 Two Component, Heat Resistant Epoxy System
Master Bond Polymer System EP46HT-2 is a two component epoxy system for bonding, sealing and casting applications where resistance to temperatures from -100°F to +500°F is required. It is 100% rea..
|
|||
| Cure Time |
180
-
240
min <br>@Temperature 121 - 149 °C
|
3.00
-
4.00
hour <br>@Temperature 250 - 300 °F
|
|
|
Master Bond EP46HT-2Med Two Component Heat Resistant Biocompatible Epoxy System
Master Bond Polymer System EP46HT-2MED is a two component medical grade epoxy system for high performance structural bonding and casting suitable for applications where resistance to temperatures fr..
|
|||
| Cure Time |
180
min <br>@Temperature 70.0 °C
|
3.00
hour <br>@Temperature 158 °F
|
|
|
Tra-Con Tra-Bond 9349K Room Temperature Cure Flexible Epoxy Adhesive
TRA-BOND 9349K epoxy adhesive is a flexible, two part, room temperature curing system with high peel and sheer strengths. TRA-BOND 9349K is excellent for bonding many metals and woods, most plastics..
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| Cure Time |
180
min <br>@Temperature 65.0 °C
|
3.00
hour <br>@Temperature 149 °F
|
|
|
Trelleborg Emerson & Cuming Eccobond® 57C Two-Component Silver Filled Electrically Conductive Epoxy Adhesive
Emerson & Cuming 57C Eccobond® Two-Component Silver Filled Electrically Conductive Epoxy AdhesiveSilver filled, electrically conductive, room temperature curing, epoxy adhesive. Good thermal conduc..
|
|||
| Cure Time |
180
min <br>@Temperature 93.3 °C
|
3.00
hour <br>@Temperature 200 °F
|
|
|
Master Bond EP21LSCL-1 Two Component, Room Temperature Curing Epoxy Resin
Product Description: Master Bond Polymer System EP21LSCL-1 is a two component, low viscosity epoxy resin system featuring optical clarity as well as non-yellowing properties. This system can be used..
|
|||
| Cure Time |
180
-
300
min <br>@Temperature 23.9 °C
|
3.00
-
5.00
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond EP21LSCL-1 Two Component, Room Temperature Curing Epoxy Resin
Product Description: Master Bond Polymer System EP21LSCL-1 is a two component, low viscosity epoxy resin system featuring optical clarity as well as non-yellowing properties. This system can be used..
|
|||
| Cure Time |
180
-
240
min <br>@Temperature 65.6 - 93.3 °C
|
3.00
-
4.00
hour <br>@Temperature 150 - 200 °F
|
|
|
Master Bond EP42HT-2FG Two Component Epoxy Adhesive for Food Applications
Master Bond Polymer System EP42HT-2FG is a room temperature setting, two component epoxy adhesive, sealant and coating specially formulated for food applications. It has been independently tested an..
|
|||
| Cure Time |
180
min <br>@Temperature 32.0 °C
|
3.00
hour <br>@Temperature 89.6 °F
|
Tack Free |
|
Chesterton ARC HT-T Spark Testable High Temperature Trowelable Abrasion Control Compound
An advanced ceramic composite formulated to protect equipment from corrosion and erosion in elevated temperature water solution immersion. This system is a high viscosity composite that is applied b..
|
|||
| Cure Time |
180
min <br>@Temperature 16.0 °C
|
3.00
hour <br>@Temperature 60.8 °F
|
Tack Free |
|
Chesterton ARC MX1 Vertical Build Extreme Wear Compound
Description: An advanced ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, abrasion and chemical attack. It is applied at a thickness of 6 mm (1/4”)..
|
|||
| Cure Time |
180
-
300
min <br>@Temperature 60.0 °C
|
3.00
-
5.00
hour <br>@Temperature 140 °F
|
|
|
Cytec (Conap) FR-1271 Conapoxy® Resin / Conacure® Hardener
Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
|
|||
| Cure Time |
180
-
300
min <br>@Temperature 60.0 °C
|
3.00
-
5.00
hour <br>@Temperature 140 °F
|
|
|
Cytec (Conap) FR-1272 Conapoxy® Resin / Conacure® Hardener
Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
|
|||
| Cure Time |
180
min <br>@Temperature 60.0 °C
|
3.00
hour <br>@Temperature 140 °F
|
|
|
Cytec Conathane® CE-1175 (Conap) Polyurethane Dielectric Conformal Coating
Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i..
|
|||
| Cure Time |
180
min <br>@Temperature 80.0 °C
|
3.00
hour <br>@Temperature 176 °F
|
Minimum Bond Line |
|
Epoxy Technology EPO-TEK® E4110-PFC Electrically Conductive Epoxy
Product Description: EPO-TEK®E4110-PFC is a two-component, silver filled, electrically conductive adhesive designed for semiconductor IC packaging and general electronic assembly. It is a thixotr..
|
|||
| Cure Time |
180
min <br>@Temperature 80.0 °C
|
3.00
hour <br>@Temperature 176 °F
|
|
|
Epoxy Technology EPO-TEK® EJ2189-LV Electrically Conductive Epoxy
Low Viscosity, two component room temp curing conductive epoxyInformation Provided by Epoxy Technology
|
|||
| Cure Time |
180
min <br>@Temperature 65.0 °C
|
3.00
hour <br>@Temperature 149 °F
|
|
|
Epoxyset Epoxibond EB-107LP-2 Unfilled Epoxy Adhesive
A two-component, unfilled epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc.
|
|||
| Cure Time |
180
min <br>@Temperature 80.0 °C
|
3.00
hour <br>@Temperature 176 °F
|
|
|
Epoxyset Epoxiohm EO-21M-5 Electrically Conductive Epoxy Adhesive
EO-21M-5 is an electrically conductive & thermally conductive, silver filled epoxy adhesive. This two component system is designed to be cured at room temperature or the cure can be accelerated by e..
|
|||
| Cure Time |
180
min <br>@Temperature 75.0 °C
|
3.00
hour <br>@Temperature 167 °F
|
|
|
Tra-Con Tra-Bond 724-17GR1B3 Polyurethane Adhesive
TRA-BOND 724-17GR1B3 premixed and frozen polyurethane adhesive is designed for good adhesion, providing strong resilient bonds to a wide variety of substrates, including aluminum, solder, nylon, myl..
|
|||
| Cure Time |
180
min <br>@Temperature 100 °C
|
3.00
hour <br>@Temperature 212 °F
|
|
|
Tra-Con Tra-Bond 872-3 Flexible Epoxy Adhesive
TRA-BOND 872-3 transparent, flexible epoxy adhesive is designed for bonding materials with mismatched coefficients of thermal expansion. The long working life of this adhesive makes it ideal for use..
|
|||
| Cure Time |
180
min <br>@Temperature 16.0 °C
|
3.00
hour <br>@Temperature 60.8 °F
|
Tack Free |
|
Chesterton MRS 58 Metal Rebuilding System
An advanced ceramic composite for the repair and protection of all metal surfaces subjected to erosion, corrosion and chemical attack. It is normally applied at a thickness of 1.5 mm (60 mils) or mo..
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