Polymer Property : Cure Time = 2.00 hour Product List

Processing Properties

Tips: 30 items are displayed at most.

Processing Properties	Metric	English	Comments
Cure Time	120 - 180 min <br>@Temperature 93.3 °C	2.00 - 3.00 hour <br>@Temperature 200 °F
Master Bond EP21SC-1 Two Component Epoxy Resin System Product Description: Master Bond Polymer System EP21SC-1 is a two component epoxy system featuring abrasion resistance. This high performance compound utilizes silicon carbide as a filler material a..
Cure Time	120 - 180 min <br>@Temperature 93.3 °C	2.00 - 3.00 hour <br>@Temperature 200 °F
Master Bond EP30P Epoxy Bonds Glass, Polycarbonates and Acrylics Description: Master Bond Polymer Adhesive EP30P is a two component, transparent, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is for..
Cure Time	120 - 180 min <br>@Temperature 121 - 149 °C	2.00 - 3.00 hour <br>@Temperature 250 - 300 °F
Master Bond EP46HT-1 Epoxy For Serviceability Up To 600°F Description: Master Bond EP46HT-1 is a two component epoxy system for high performance structural bonding and sealing suitable for applications where resistance to temperatures from -100°F to +550°..
Cure Time	120 min <br>@Temperature 65.0 °C	2.00 hour <br>@Temperature 149 °F
Tra-Con Tra-Bond 342-14T Low Viscosity Room Temperature Cure Epoxy Adhesive TRA-BOND 342-14T single component, low viscosity alumina-filled epoxy adhesive exhibits high bond strength and excellent thermal shock characteristics. This adhesive may be cured at room temperature..
Cure Time	120 - 180 min <br>@Temperature 93.3 °C	2.00 - 3.00 hour <br>@Temperature 200 °F
Master Bond EP30LV-1 Ultra Low Viscosity, Two Part Epoxy System Description: Master Bond Polymer System EP30LV-1 is an ultra low viscosity, two component epoxy system for high performance bonding, coating, sealing, potting and encapsulation. It readily cures at ..
Cure Time	120 - 180 min <br>@Temperature 23.9 °C	2.00 - 3.00 hour <br>@Temperature 75.0 °F
Master Bond EP30M4 Chemically Resistant Two Component Epoxy System Master Bond Polymer System EP30M4 is a two component epoxy system for high performance bonding, sealing and encapsulation. This system features a forgiving 100 to 60 mix ratio by weight. EP30M4 resi..
Cure Time	120 min <br>@Temperature 32.0 °C	2.00 hour <br>@Temperature 89.6 °F	Tack Free
Chesterton ARC 855 Abrasion Control Liquid Description: An advanced ceramic composite formulated to protect equipment from aggressive chemical attack, corrosion, and erosion. The product is a low viscosity composite that is easily applied by..
Cure Time	120 min <br>@Temperature 65.0 °C	2.00 hour <br>@Temperature 149 °F
Epoxy Technology EPO-TEK® 310M-T Flexible Epoxy Material Description: A two component, flexible epoxy designed for low stress applications in semiconductor, hybrid, medical, acoustical and optical industries. Replacement for EPO-TEK® 310T.Info..
Cure Time	120 - 180 min <br>@Temperature 100 °C	2.00 - 3.00 hour <br>@Temperature 212 °F
Abatron AboCast 8103-21 High-Performance Dielectric Epoxy AboCast 8103-21 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system combines r..
Cure Time	120 - 240 min <br>@Temperature 120 - 160 °C	2.00 - 4.00 hour <br>@Temperature 248 - 320 °F	optional
Abatron AboCast 8103-27 High-Performance Dielectric Epoxy AboCast 8103-27 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system has high h..
Cure Time	120 min <br>@Temperature 204 °C	2.00 hour <br>@Temperature 400 °F	Recommended Postcure Cycle
Arlon 30570R020 0.020" (0.508 mm) Uncured/Unsupported Silicone Rubber on a Release Carrier Design/Construction:Side 1: Uncured/Unsupported Silicone Rubber on a Release Carrier Appearance: Red silicone gum on polymer linerThis data represents typical values for the production material. The..
Cure Time	120 min <br>@Temperature 204 °C	2.00 hour <br>@Temperature 400 °F	Recommended Postcure Cycle
Arlon 55579R033 0.033" (0.838 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Uncured layer on top of a cured layer on one side Appearance: Red silicone gum and rubber on fiberglass clothThis data Represents typical values for the production materi..
Cure Time	120 min <br>@Temperature 232 °C	2.00 hour <br>@Temperature 450 °F	Recommended Postcure Cycle
Arlon 56596R045 0.045" (1.14 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Cured Silicone Rubber Side 2: Uncured Silicone RubberProduct Use: Flexible heater insulationAppearance: Red silicone gum and rubber on fiberglass with polymer release lin..
Cure Time	120 min <br>@Temperature 204 °C	2.00 hour <br>@Temperature 400 °F	Recommended Postcure Cycle
Arlon CP-301C Bulk Compound This data represents typical values for the production material. The data should not be used to write, or in place of, material specifications.Information provided by Arlon, Silicone Technologies Di..
Cure Time	120 min <br>@Temperature 204 °C	2.00 hour <br>@Temperature 400 °F	Recommended Postcure Cycle
Arlon P29609R025 0.025" (0.635 mm) Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Layer-on-Layer Product Use: Traction motor insulation, electrical insulationAppearance: Red silicone gum on fiberglass clothThis data Represents typical values for the pr..
Cure Time	120 min <br>@Temperature 204 °C	2.00 hour <br>@Temperature 400 °F	Recommended Postcure Cycle
Arlon R32959R020 0.015" (0.381 mm) Primerless Traction Motor Tape with Fiberglass Substrate Design/Construction:Side 1: Layer-on-LayerAppearance: Red silicone gum on glass fabricThis data Represents typical values for the production material. The data should not be used to write, or in pla..
Cure Time	120 - 240 min <br>@Temperature 65.0 °C	2.00 - 4.00 hour <br>@Temperature 149 °F
Atom Adhesives AA-BOND 2153 Epoxy Adhesive AA-BOND 2153 is a thixotropic (smooth paste) thermal conductive epoxy system that passes the NASA Outgassing Specification. It is used for staking transistors, diodes, resistors, integrated circuits..
Cure Time	120 min <br>@Temperature 204 °C	2.00 hour <br>@Temperature 400 °F	Recommended Postcure Cycle
Arlon 55578XA030M 0.0305" (0.775 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Cured Silicone RubberSide 2: Cured/Uncured Layers This data Represents typical values for the production material. The data should not be used to write, or in place of, m..
Cure Time	120 min <br>@Temperature 204 °C	2.00 hour <br>@Temperature 400 °F	Recommended Postcure Cycle
Arlon R35366X020 0.020" (0.508 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate Design/Construction:Interleave: Polyethylene Side 2: Uncured Silicone RubberSubstrate: Style 7628 Fiberglass Side 1: Cured Silicone Rubber Appearance: Gray gum on glass fiber fabricThis data represe..
Cure Time	120 min <br>@Temperature 25.0 °C	2.00 hour <br>@Temperature 77.0 °F	tack free
Cytec Conathane® CE-1163 (Conap) Polyurethane Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i..
Cure Time	120 - 180 min <br>@Temperature 93.3 °C	2.00 - 3.00 hour <br>@Temperature 200 °F
Master Bond EP21TDC-2LO Two component, highly flexibilized epoxy resin compound Product Description: Master Bond Polymer System EP21TDC-2LO is a two component, highly flexible epoxy resin compound for high performance bonding, sealing, coating, and encapsulation. It is formulat..