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Polymer Property : Cure Time = 2.00 hour Product List
Processing PropertiesTips: 30 items are displayed at most.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time |
90.0
-
120
min @Temperature 121 °C |
1.50
-
2.00
hour @Temperature 250 °F |
|
|
Henkel Hysol PL 7000 Film Adhesive
Epoxy film adhesive formulated to provide excellent performance properties in composite bonding, and has excellent results on composite surfaces that have been exposed to bond shop environments and ..
|
|||
| Cure Time |
90.0
-
120
min @Temperature 149 °C |
1.50
-
2.00
hour @Temperature 300 °F |
|
|
Master Bond EP17HT One component epoxy system for bonding, sealing, coating and casting
Product Description: Master Bond EP17HT is an one component, heat cured epoxy system for bonding, sealing, coating and encapsulating. It features good physical properties, electrical insulation prof..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 93.3 °C |
1.00
-
2.00
hour @Temperature 200 °F |
|
|
Master Bond EP21TDCS Silver Filled Electrically Conductive Epoxy Compound
Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidl..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 93.3 °C |
1.00
-
2.00
hour @Temperature 200 °F |
|
|
Master Bond EP30 Optically Clear, Low Viscosity Two Component Epoxy
Master Bond Polymer System EP30 is a low viscosity, two component epoxy system for high performance bonding, coating, sealing, potting and encapsulation. It readily cures at room temperature or more..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 93.3 °C |
1.00
-
2.00
hour @Temperature 200 °F |
|
|
Master Bond EP33CLV Epoxy Resists Chemicals and High Temperatures
Description: Master Bond EP33CLV is a two part, room temperature curing epoxy system used for bonding, sealing and coating featuring high temperature resistance, good dimensional stability and excel..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 93.3 °C |
1.00
-
2.00
hour @Temperature 200 °F |
|
|
Master Bond EP38CL Adhesive Features Toughness and Durability
Description: Master Bond EP38CL is a lower viscosity, optically clear two component epoxy system for high performance bonding, coating, sealing and small encapsulations, featuring toughness and dura..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 93.3 °C |
1.00
-
2.00
hour @Temperature 200 °F |
|
|
Master Bond EP41S-1 Chemically Resistant Two Component Epoxy System
Master Bond Polymer System EP41S-1 is a two component epoxy resin system designed for durable, high performance
bonding, sealing, coating and encapsulating. It successfully withstands prolonged imm..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 93.3 °C |
1.00
-
2.00
hour @Temperature 200 °F |
|
|
Master Bond EP51FL-1 Rapid Curing Cryogenic Two Component Epoxy
Master Bond Polymer System EP51FL-1 is a two component highly flexible epoxy resin system for high performance bonding sealing and coating. Although most flexiblilized epoxy formulations are very sl..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 93.3 °C |
1.00
-
2.00
hour @Temperature 200 °F |
|
|
Master Bond MasterSil 151Med Medical Grade Silicone Potting Compound
Description: Master Bond MasterSil 151Med is a two component, low viscosity silicone compound for high performance potting and encapsulation. MasterSil 151Med is an addition cured system and does no..
|
|||
| Cure Time |
60.0
-
120
min @Temperature >=79.4 °C |
1.00
-
2.00
hour @Temperature >=175 °F |
|
|
Master Bond MB600G Aqueous Based Electrically Conductive Sodium Silicate Coating
Master Bond MB600G is an aqueous based, sodium silicate system with graphite filler. It is intended for use in applications where moderate shielding effectiveness is required and cost is a more sign..
|
|||
| Cure Time |
60.0
-
120
min @Temperature >=79.4 °C |
1.00
-
2.00
hour @Temperature >=175 °F |
|
|
Master Bond MB600SCN Aqueous Based Electrically Conductive Sodium Silicate Coating
Master Bond MB600SCN is an aqueous based, sodium silicate system with a silver coated nickel filler. It is intended for use in applications where very good shielding effectiveness is required and co..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 65.0 °C |
1.00
-
2.00
hour @Temperature 149 °F |
|
|
Tra-Con Tra-Bond 2119 Low Viscosity Glass Laminating Adhesive
TRA-BOND 2119 is a crystal clear adhesive specifically designed for bonding glass to glass and glass to plastics. It also yields a high lap shear strength to metals and ceramics. This system cures t..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 65.0 °C |
1.00
-
2.00
hour @Temperature 149 °F |
|
|
Tra-Con Tra-Bond F113 High Impact Optically Clear Epoxy Adhesive
TRA-BOND F113 is an optically clear, low viscosity, high impact epoxy adhesive developed for bonding and small volume potting of plastic or glass optical fibers, lenses, and prisms, LED displays, an..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 65.0 °C |
1.00
-
2.00
hour @Temperature 149 °F |
|
|
Tra-Con Tra-Bond FDA12 Food and Drug Application Epoxy Adhesive
TRA-BOND FDA12 is a medium viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Admin..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 65.0 °C |
1.00
-
2.00
hour @Temperature 149 °F |
|
|
Tra-Con Tra-Cast 3108 General Purpose Epoxy Casting Compound
TRA-CAST 3108 is a low viscosity two-part formulation recommended for underfill and encapsulating applications where the combination of good mechanical thermal and electrical properties are required..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 65.0 °C |
1.00
-
2.00
hour @Temperature 149 °F |
|
|
Trelleborg Emerson & Cuming Eccobond® 1309 General Purpose Catalyst
Emerson & Cuming 1309 Eccobond® General Purpose CatalystFaster curing version of 9. Very fast room temperature curing, low viscosity, general purpose. Short working life. Imparts excellent chemical..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 65.0 °C |
1.00
-
2.00
hour @Temperature 149 °F |
|
|
Trelleborg Emerson & Cuming Eccobond® 24 LV General Purpose Catalyst
Emerson & Cuming 24 LV Eccobond® General Purpose CatalystFaster curing, shorter working life version of 23 LV. Recommended for small mass castings due to higher exotherm. Cure Type: Room Temp or He..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 93.3 °C |
1.00
-
2.00
hour @Temperature 200 °F |
|
|
Master Bond EP21LV Low Viscosity Two Component Epoxy
Master Bond Polymer System EP21LV is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting. It is formulated to cure readily at ..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 93.3 °C |
1.00
-
2.00
hour @Temperature 200 °F |
|
|
Master Bond EP21TDCSLO Two Component Silver Conductive Epoxy Adhesive
Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rap..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 93.3 °C |
1.00
-
2.00
hour @Temperature 200 °F |
|
|
Master Bond EP27 Low Temperature Curing Two Component Epoxy
Master Bond Polymer System EP27 is a unique two component
epoxy formulation offers relatively fast cures at temperatures as low as 40°F and below, with curing times much shorter than currently exis..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 65.0 °C |
1.00
-
2.00
hour @Temperature 149 °F |
|
|
Tra-Con Tra-Bond 2115 Clear High Strength Epoxy Adhesive
TRA-BOND 2115 is a clear, low viscosity epoxy formulation used in the fabrication of lasers. It is capable of withstanding 30 seconds of 60 watt direct laser energy. The low cure shrinkage (using a ..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 65.0 °C |
1.00
-
2.00
hour @Temperature 149 °F |
2nd step |
|
Abatron AboCast 8502-5/AboCure 8502-5 Colorless, Low-Exotherm Epoxy Casting Compound
AboCast 8502-5/AboCure 8502-5 is a rigid, colorless, low-exotherm epoxy casting compound for spherical masses up to 500 grams. It is a 2-component structural and dielectric liquid system with extrem..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 82.222 - 98.889 °C |
1.00
-
2.00
hour @Temperature 180.00 - 210.00 °F |
|
|
Abatron AboTar 8607-1 Solventless Tar-Epoxy Compound
AboTar 8607-1 is a 2-part tar-epoxy lower cost system for filling and leveling pot holes and grossly uneven flooring. It can be used neat or with sand or aggregates. Uses: Resurfacing concrete and ..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 93.0 - 105 °C |
1.00
-
2.00
hour @Temperature 199 - 221 °F |
|
|
Abatron ROCKWELD 55-27 A/B Structural Adhesive Putty; Epoxy
ROCKWELD 55-27 is a 2-component epoxy system with low density, high-strength, and no shrinkage. It is a structural adhesive putty for sculpturing, repairs and restoration of stone, concrete and maso..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 150 - 160 °C |
1.00
-
2.00
hour @Temperature 302 - 320 °F |
|
|
Abatron AboCast 8501-6 One-Component Epoxy
AboCast 8501-6 is a clear, high-temperature one-component epoxy system for very high-temperature uses. It offers the highest heat resistance of the clear resins. Suggested Uses: Casting; Potting; E..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 150 - 160 °C |
1.00
-
2.00
hour @Temperature 302 - 320 °F |
|
|
Abatron AboCast 8504-1 One-Component Epoxy
AboCast 8504-1 is a clear, all-purpose one-component epoxy system, with an optimum balance of properties for most casting, adhesive, impregnation, and coating applications.
|
|||
| Cure Time |
60.0
-
120
min @Temperature 150 - 160 °C |
1.00
-
2.00
hour @Temperature 302 - 320 °F |
|
|
Abatron AboCast 8504-5 One-Component Epoxy
AboCast 8504-5 is a clear, plasticized one-component epoxy system with very high strength and impact. It provides exceptional physical properties and thermal shock resistance from sub-zero to modera..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 180 °C |
1.00
-
2.00
hour @Temperature 356 °F |
|
|
Abatron AboCast 8708-6 One-Component Structural/Dielectric Epoxy
AboCast 8708-6 is a highly filled, class H (180°C) structural, castable adhesive compound for SLOW high-temperature curing. Suggested Uses: Structural bonding; Casting; Potting; Encapsulating; Emb..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 93.3 °C |
1.00
-
2.00
hour @Temperature 200 °F |
|
|
Master Bond EP21TP-2 Oil And Fuel Resistant Polysulfide Based Adhesive System
Master Bond Polymer Adhesive EP21TP-2 is a two component polysulfide/epoxy based adhesive/sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 1 to 1 mix r..
|
|||
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