| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time |
1440
-
4320
min <br>@Temperature 25.0 °C
|
24.0
-
72.0
hour <br>@Temperature 77.0 °F
|
|
|
Resinlab® EP1287 Filled, Flame Retardant Epoxy Syntactic Foam
Resinlab™ EP1287 is a two part filled, flame retardant epoxy syntactic foam. It utilizes glass microspheres to reduce cured density and improve machinability. This product will be self-extinguishin..
|
|||
| Cure Time |
1440
min <br>@Temperature 23.0 °C
|
24.0
hour <br>@Temperature 73.4 °F
|
M10 steel, full strength |
|
Permabond HM165 Anaerobic Retainer
Permabond® HM165 is a high viscosity anaerobic retaining compound that cures when confined between metal parts to form a tough bond. It is best suited for cylindrical parts and where high temperatu..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 25.0 °C
|
24.0
-
48.0
hour <br>@Temperature 77.0 °F
|
|
|
Resinlab® EP1295 Black Medium Viscosity, Halogen Free, Flame Retardant Epoxy Casting Resin
Resinlab™ EP1295 Black is a medium viscosity, halogen free, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (..
|
|||
| Cure Time |
1440
min <br>@Temperature 24.0 °C
|
24.0
hour <br>@Temperature 75.2 °F
|
|
|
Parker Chomerics CHO-SHIELD® 2054 Conductive Coating
CHO-SHIELD® 2054 silver-plated-copper filled commercial-grade coating proved high levels of EMI shielding effectiveness, abrasion resistance and excellent adhesion on a variety of materials used fo..
|
|||
| Cure Time |
1440
min <br>@Temperature 25.0 °C
|
24.0
hour <br>@Temperature 77.0 °F
|
Complete Cure Cycle |
|
Northstar Polymers MPP-A80E High Performance Polyether
This high performance polyether system is one of a family of polymer systems developed by Northstar Polymers for specific demanding work environments. Urethane elastomers molded with this system ex..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.9 °C
|
24.0
-
48.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond MB600S Aqueous Based Sodium Silicate System for EMI/RFI Shielding
Description: Master Bond MB600S is a silver containing aqueous based sodium silicate system used as a coating in situations where EMI shielding effectiveness is paramount. Electromagnetic interferen..
|
|||
| Cure Time |
1440
min <br>@Temperature 25.0 °C
|
24.0
hour <br>@Temperature 77.0 °F
|
|
|
Tra-Con Tra-Bond 1137 Epoxy Microballoon Repair Adhesive
TRA-BOND 1137 is a sag resistant syntactic-foam formulation developed for aerospace honeycomb, fillet, edge-fill, contour repair, bonding, potting and casting applications where a light-weight, low ..
|
|||
| Cure Time |
1440
min <br>@Temperature 25.0 °C
|
24.0
hour <br>@Temperature 77.0 °F
|
|
|
Tra-Con Tra-Bond 2122 Metal Repair Aluminum Epoxy Adhesive
TRA-BOND 2122 is a versatile aluminum metal filled epoxy formulation developed for modern industrial casting, bonding and repair applications where a strong aluminum-like adhesive is required. This ..
|
|||
| Cure Time |
1440
min <br>@Temperature 25.0 °C
|
24.0
hour <br>@Temperature 77.0 °F
|
|
|
Tra-Con Tra-Bond 526H02
Information provided by Tra-Con Inc.
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.0 °C
|
24.0
-
48.0
hour <br>@Temperature 73.4 °F
|
|
|
Master Bond EP21FL Flexibilized and Toughened Low Viscosity Epoxy
Master Bond Polymer System EP21FL is a lower viscosity, two component, flexibilized epoxy resin system for high performance bonding, coating, sealing and encapsulating. It is formulated to cure at r..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.0 °C
|
24.0
-
48.0
hour <br>@Temperature 73.4 °F
|
|
|
Master Bond EP35 High Temperature Resistant Two Component Epoxy System
Master Bond Polymer Adhesive EP35 is a unique, room temperature curing, two component epoxy adhesive for high temperature bonding applications. Master Bond Polymer Adhesive EP35 produces high stren..
|
|||
| Cure Time |
1440
min <br>@Temperature 10.0 °C
|
24.0
hour <br>@Temperature 50.0 °F
|
Light Load |
|
Chesterton ARC 791 Composite
Description: A quartz reinforced composite designed to resurface and restore concrete surfaces, to protect new concrete, and to repair concrete damaged by chemical and physical abuse. ARC 791 has ex..
|
|||
| Cure Time |
1440
min <br>@Temperature 43.0 °C
|
24.0
hour <br>@Temperature 109 °F
|
Full Chemical |
|
Chesterton ARC 858 Abrasion resistant rebuilding and faring composite
An advanced ceramic composite for the repair and protection of all metal surfaces subjected to erosion, corrosion and chemical attack. It is normally applied at a thickness of 0.15 mm (60 mils) or m..
|
|||
| Cure Time |
1440
min <br>@Temperature 16.0 °C
|
24.0
hour <br>@Temperature 60.8 °F
|
Light Load |
|
Chesterton ARC I BX1 Impact & Wear Resistant Epoxy Composite
Description: An advanced grade epoxy and urethane composite for the repair and protection of all metal surfaces subjected to severe abrasion and impact. It is normally applied at a thickness of 6 mm..
|
|||
| Cure Time |
1440
min <br>@Temperature 16.0 °C
|
24.0
hour <br>@Temperature 60.8 °F
|
Light Load |
|
Chesterton ARC PW Potable Water Coating
Description: ARC PW is a 100% solids lining certified for NSF/ANSI 61 potable water, cold water service. It is recommended to be applied by brush, roll or spray at 500-750 microns (20-30 mils) total..
|
|||
| Cure Time |
1440
min <br>@Temperature 25.0 °C
|
24.0
hour <br>@Temperature 77.0 °F
|
Full Load |
|
Chesterton MRS SD4i Metal Rebuilding System
An advanced ceramic composite for resurfacing and protection of metal surfaces in immersion service. It is normally applied in a thickness range of 250-370 microns (10 – 15 mils) per coat. Non-shri..
|
|||
| Cure Time |
1440
min <br>@Temperature 25.0 °C
|
24.0
hour <br>@Temperature 77.0 °F
|
|
|
Cytec CE-1170 (Conap) Acrylic Dielectric Conformal Coating
Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i..
|
|||
| Cure Time |
1440
min <br>@Temperature 25.0 °C
|
24.0
hour <br>@Temperature 77.0 °F
|
|
|
Cytec CE-1171 (Conap) Acrylic Dielectric Conformal Coating
Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i..
|
|||
| Cure Time |
1440
min <br>@Temperature 24.0 °C
|
24.0
hour <br>@Temperature 75.2 °F
|
full cure |
|
BCC Products BC 100 Medium Cyanoacrylate Adhesive
BC100 Medium, like its name in the medium viscosity version of cyanoacrylate adhesive that has become most popular in the super bonding applications. A 12 second fixture bond makes the BC100 the fas..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.0 °C
|
24.0
-
48.0
hour <br>@Temperature 73.4 °F
|
at RT, Alternate Cure |
|
Aremco Aremco-Bond™ 631 High Performance Epoxide
Clear-Amber, 1:1, Good Bond Strength and Corrosion Resistance.Also available filled with aluminum oxide (Alumina) or pigments.
|
|||
| Cure Time |
1440
min <br>@Temperature 25.0 °C
|
24.0
hour <br>@Temperature 77.0 °F
|
|
|
Atom Adhesives AA-BOND 428 Epoxy Adhesive
AA-BOND 428 is a two part, heat-resistant and low exotherm, epoxy adhesive formulation. It is a 100% solid epoxy adhesive, with superior chemical resistance and shear strength. AA-BOND 428 contains ..
|
|||
| Cure Time |
1440
min <br>@Temperature 25.0 °C
|
24.0
hour <br>@Temperature 77.0 °F
|
|
|
Atom Adhesives AA-DUCT 2919 Epoxy Adhesive
AA-DUCT 2919 is a non-bleeding, electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require good flexibility coupled w..
|
|||
| Cure Time |
1440
min <br>@Temperature 24.0 °C
|
24.0
hour <br>@Temperature 75.2 °F
|
full cure |
|
BCC Products BC 100 Thick Cyanoacrylate Adhesive
BC100 Thick is the slow and thickest member of the BCC Products line of cyanoacrylate adhesive. Excellent for gap filling the BC100 Thick has a 30 second fixture time allowing for the material to f..
|
|||
| Cure Time |
1440
min <br>@Temperature 25.0 °C
|
24.0
hour <br>@Temperature 77.0 °F
|
|
|
Atom Adhesives AA-BOND FDA26 Epoxy Adhesive
AA-BOND FDA26 is Versatile adhesive guaranteed a high strength bond. AA-BOND FDA26 is two part adhesive used and cured at room temperature for bonding, repair applications by manufacturers of food p..
|
|||
| Cure Time |
1440
min <br>@Temperature 23.0 °C
|
24.0
hour <br>@Temperature 73.4 °F
|
M10 steel, full strength |
|
Permabond HM135 Anaerobic Retainer
Permabond® HM135 is a fast curing, medium viscosity anaerobic adhesive for locking and sealing threads and retaining cylindrical components. It gives maximum torque strength on brass or plated bras..
|
|||