Polymer Property : Cure Time = 240 min Product List

Processing Properties

Tips: 30 items are displayed at most.

Processing Properties	Metric	English	Comments
Cure Time	180 - 240 min <br>@Temperature 121 - 149 °C	3.00 - 4.00 hour <br>@Temperature 250 - 300 °F
Master Bond Ep46HT-2 Two Component, Heat Resistant Epoxy System Master Bond Polymer System EP46HT-2 is a two component epoxy system for bonding, sealing and casting applications where resistance to temperatures from -100°F to +500°F is required. It is 100% rea..
Cure Time	180 - 240 min <br>@Temperature 121 - 149 °C	3.00 - 4.00 hour <br>@Temperature 250 - 300 °F
Master Bond EP46HT-2Med Two Component Heat Resistant Biocompatible Epoxy System Master Bond Polymer System EP46HT-2MED is a two component medical grade epoxy system for high performance structural bonding and casting suitable for applications where resistance to temperatures fr..
Cure Time	60.0 - 240 min <br>@Temperature 65.0 °C	1.00 - 4.00 hour <br>@Temperature 149 °F
Tra-Con Tra-Bond 716K02 Thixotropic Adhesive 716K02 is a more thixotropic version of FDA2T. Information provided by Tra-Con Inc.
Cure Time	60.0 - 240 min <br>@Temperature 65.0 °C	1.00 - 4.00 hour <br>@Temperature 149 °F
Tra-Con Tra-Bond FDA15 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-15 is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Adminis..
Cure Time	60.0 - 240 min <br>@Temperature 65.0 °C	1.00 - 4.00 hour <br>@Temperature 149 °F
Tra-Con Tra-Bond FDA2 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-2 is a medium viscosity epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and rec..
Cure Time	60.0 - 240 min <br>@Temperature 65.0 °C	1.00 - 4.00 hour <br>@Temperature 149 °F
Tra-Con Tra-Bond FDA22 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-22 is a high viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Admini..
Cure Time	60.0 - 240 min <br>@Temperature 65.0 °C	1.00 - 4.00 hour <br>@Temperature 149 °F
Tra-Con Tra-Bond FDA23 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-23 is a high viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Admini..
Cure Time	60.0 - 240 min <br>@Temperature 65.0 °C	1.00 - 4.00 hour <br>@Temperature 149 °F
Tra-Con Tra-Bond FDA2T Food and Drug Application Epoxy Adhesive TRA-BOND FDA-2T is a thixotropic epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and receive..
Cure Time	60.0 - 240 min <br>@Temperature 65.0 °C	1.00 - 4.00 hour <br>@Temperature 149 °F
Tra-Con Tra-Duct 2916 Room Temperature Conductive Silver Epoxy Adhesive TRA-DUCT 2916 is an electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require high flexibility coupled with good ele..
Cure Time	120 - 240 min <br>@Temperature 100 °C	2.00 - 4.00 hour <br>@Temperature 212 °F
Trelleborg Emerson & Cuming Eccobond® 11 Heat Cure Catalyst Emerson & Cuming 11 Eccobond® Heat Cure CatalystGeneral purpose, low viscosity, elevated temperature curing. Long working life. Yields cured coatings with excellent chemical resistance. Subject to ..
Cure Time	180 - 240 min <br>@Temperature 93.3 °C	3.00 - 4.00 hour <br>@Temperature 200 °F
Master Bond EP30M3LV Electrically Insulative, Low Viscosity Two Component Epoxy Master Bond Polymer System EP30M3LV is a lower viscosity, two component epoxy system for high performance bonding, sealing and encapsulation. It is formulated to cure at ambient temperatures or mor..
Cure Time	180 - 240 min <br>@Temperature 65.6 - 93.3 °C	3.00 - 4.00 hour <br>@Temperature 150 - 200 °F
Master Bond EP42HT-2FG Two Component Epoxy Adhesive for Food Applications Master Bond Polymer System EP42HT-2FG is a room temperature setting, two component epoxy adhesive, sealant and coating specially formulated for food applications. It has been independently tested an..
Cure Time	60.0 - 240 min <br>@Temperature 65.0 °C	1.00 - 4.00 hour <br>@Temperature 149 °F
Tra-Con Tra-Bond 813J01 Silicone Encapsulant TRA-BOND 813J01 is a silicone adhesive system formulated to provide excellent thermal conductivity. This unique product bonds well to difficult substrates. Typical applications include encapsulation..
Cure Time	60.0 - 240 min <br>@Temperature 65.0 °C	1.00 - 4.00 hour <br>@Temperature 149 °F
Tra-Con Tra-Bond FS437 Low Viscosity High Impact Epoxy Adhesive TRA-BOND FS437 is a two-part, low viscosity material formulated for optical applications which require excellent wicking, visible color and high strength. This material has been used successfully fo..
Cure Time	60.0 - 240 min <br>@Temperature 65.0 °C	1.00 - 4.00 hour <br>@Temperature 149 °F
Tra-Con Tra-Bond RO7 Radio Opaque Epoxy Adhesive TRA-BOND RO-7 is a high viscosity epoxy resin system specifically developed for adhesive and coating applications where radio opacity is required. It can be used as an X-ray marker on in-vitro medic..
Cure Time	60.0 - 240 min <br>@Temperature 65.0 °C	1.00 - 4.00 hour <br>@Temperature 149 °F
Tra-Con Tra-Duct 2902 Room Temperature Conductive Silver Epoxy Adhesive TRA-DUCT 2902 is an electrically conducting silver-filled epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical prop..
Cure Time	120 - 240 min <br>@Temperature 120 - 160 °C	2.00 - 4.00 hour <br>@Temperature 248 - 320 °F	optional
Abatron AboCast 8103-26 High-Performance Dielectric Epoxy AboCast 8103-26 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system has high h..
Cure Time	60.0 - 240 min <br>@Temperature 65.0 °C	1.00 - 4.00 hour <br>@Temperature 149 °F
Atom Adhesives AA-BOND FDA22 Epoxy Adhesive AA-BOND FDA22 is a high viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Administ..
Cure Time	60.0 - 240 min <br>@Temperature 160 - 180 °C	1.00 - 4.00 hour <br>@Temperature 320 - 356 °F	optional
Abatron AboCast 8103-13 One-Component Epoxy AboCast 8103-13 is the low-viscosity one-component clear epoxy system with deep impregnation that offers high performance at relatively high temperatures. It is best for thin-wall casting. Suggested..
Cure Time	120 - 240 min <br>@Temperature 120 - 160 °C	2.00 - 4.00 hour <br>@Temperature 248 - 320 °F	optional
Abatron AboCast 8103-29 High-Performance Dielectric Epoxy AboCast 8103-29 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system has high h..
Cure Time	180 - 240 min <br>@Temperature 121 °C	3.00 - 4.00 hour <br>@Temperature 250 °F
Abatron AboCast 8708-9 One-Component Structural/Dielectric Epoxy AboCast 8708-9 is a highly filled, class H (180°C) structural, castable adhesive compound for FASTER high-temperature curing. Suggested Uses: Structural bonding; Casting; Potting; Encapsulating; E..
Cure Time	60.0 - 240 min <br>@Temperature 65.0 °C	1.00 - 4.00 hour <br>@Temperature 149 °F
Atom Adhesives AA-BOND FDA26 Epoxy Adhesive AA-BOND FDA26 is Versatile adhesive guaranteed a high strength bond. AA-BOND FDA26 is two part adhesive used and cured at room temperature for bonding, repair applications by manufacturers of food p..
Cure Time	120 - 240 min <br>@Temperature 65.0 °C	2.00 - 4.00 hour <br>@Temperature 149 °F
Atom Adhesives AA-SUPERTHERM 195 Epoxy Adhesive AA-SUPERTHERM 195 is a two component, thermally conductive epoxy system recommended for staking transistors, diodes, resistors, integrated circuits and other heat sensitive components to printed cir..