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Polymer Property : Cure Time = 2880 min Product List
Processing PropertiesTips: 30 items are displayed at most.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time |
1440
-
2880
min <br>@Temperature 25.0 °C
|
24.0
-
48.0
hour <br>@Temperature 77.0 °F
|
Complete Cure Cycle |
|
Northstar Polymers MPP-R02C Semi-rigid Polyurethane Foam Formulation
MPP-R02C is semi-rigid foam formulations for molded foam products. It is closed-cell light foam with some structural integrity. Unlike rigid polyurethane foams, the physical properties of a cured pr..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 25.0 °C
|
24.0
-
48.0
hour <br>@Temperature 77.0 °F
|
Complete Cure Cycle |
|
Northstar Polymers MAP-R06C Semi Rigid Structural Foam Formulation
MPP-R06C is a polyurethane foam formulation. It is closed-cell foam with a good structural integrity and an enhanced skin quality. Unlike polyurethane rigid foams, the physical properties of a cured..
|
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| Cure Time |
2160
-
2880
min <br>@Temperature 25.0 °C
|
36.0
-
48.0
hour <br>@Temperature 77.0 °F
|
Permit Normal Usage |
|
Lord Adhesives Aeroglaze® Z302 Absorptive Polyurethane
Aeroglaze® Z302 absorptive polyurethane is primarily for application to substrates used in space operations. These operations include those where coatings must exhibit low outgassing characterist..
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| Cure Time |
1440
-
2880
min <br>@Temperature 23.0 °C
|
24.0
-
48.0
hour <br>@Temperature 73.4 °F
|
|
|
Master Bond EP21 Room Temperature Curing Epoxy System
Room temperature curing epoxy adhesive Master Bond EP21 has outstanding physical properties and durability. Its variable mix ratio feature allows you to adjust the type of cure to get either a more ..
|
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| Cure Time |
1440
-
2880
min <br>@Temperature 23.0 °C
|
24.0
-
48.0
hour <br>@Temperature 73.4 °F
|
|
|
Master Bond EP21AR Acid Resistant Two Component Epoxy
Master Bond EP21AR is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealant with outstanding acid as well as excellent overall chemical resistance. E..
|
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| Cure Time |
1440
-
2880
min <br>@Temperature 23.0 °C
|
24.0
-
48.0
hour <br>@Temperature 73.4 °F
|
|
|
Master Bond EP21FRSPLV Flame Resistant Two Component Epoxy
Master Bond Polymer System EP21FRSPLV is a two component, room temperature curable, flame resistant compound for potting, encapsulating and casting. EP21FRSPLV has a one to one mix ratio, by weight...
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.0 °C
|
24.0
-
48.0
hour <br>@Temperature 73.4 °F
|
|
|
Master Bond EP21HT High Temperature Resistant Two Component Epoxy
Master Bond Polymer System EP21HT is a two component, room temperature curing epoxy adhesive, sealant and coating with high temperature resistance up to 400°F. EP21HT produces high strength, durabl..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.9 °C
|
24.0
-
48.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond EP21LVMed Two Component, Low Viscosity USP Class VI Epoxy
Master Bond EP21LVMed is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily at room tempera..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.0 °C
|
24.0
-
48.0
hour <br>@Temperature 73.4 °F
|
|
|
Master Bond EP21ND Non Drip Room Temperature Curing Epoxy System
Master Bond Polymer System EP21ND is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties. EP21ND can be mixed by weight or volume and is available in a ..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.9 °C
|
24.0
-
48.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond EP30HV Optically Clear, High Strength Two Part Epoxy
Description: Master Bond EP30HV is a lower viscosity, two component epoxy system for high performance bonding, sealing, coating and potting. It is formulated to cure at room temperature or more rapi..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.9 °C
|
24.0
-
48.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond EP38CL Adhesive Features Toughness and Durability
Description: Master Bond EP38CL is a lower viscosity, optically clear two component epoxy system for high performance bonding, coating, sealing and small encapsulations, featuring toughness and dura..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.9 °C
|
24.0
-
48.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond EP41S-1HTND Non-Drip, High Performance Epoxy Adhesive
Description: Master Bond EP41S-1HTND is a two component epoxy resin system for high performance bonding, sealing and coating. It has a 100 to 30 mix ratio by weight and its viscosity is a smooth pas..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.9 °C
|
24.0
-
48.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond EP76M-F Electrically Conductive, Two Part Epoxy
Description: Master Bond EP76M-F is a two component, nickel filled, electrically conductive epoxy system for high performance bonding, sealing, and coating formulated to cure at room temperature or ..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.0 °C
|
24.0
-
48.0
hour <br>@Temperature 73.4 °F
|
|
|
Master Bond Mastersil 151 Two Component Low Viscosity Silicone Compound
Master Bond MasterSil 151 is a two component, low viscosity
silicone compound for high performance potting and
encapsulation. MasterSil 151 is an addition cured system and does not require exposure..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.9 °C
|
24.0
-
48.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond MB600G Aqueous Based Electrically Conductive Sodium Silicate Coating
Master Bond MB600G is an aqueous based, sodium silicate system with graphite filler. It is intended for use in applications where moderate shielding effectiveness is required and cost is a more sign..
|
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| Cure Time |
1440
-
2880
min <br>@Temperature 23.9 °C
|
24.0
-
48.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond EP30QF Quartz Filled, Two Component Epoxy System
Master Bond Polymer System EP30QF is a quartz filled, two component epoxy for high performance bonding, sealing, coating and casting that is formulated to cure at room temperature or more rapidly at..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.0 °C
|
24.0
-
48.0
hour <br>@Temperature 73.4 °F
|
|
|
Master Bond EP34 Room Temperature Curing Two Component Epoxy System
Master Bond Polymer System EP34 is a unique room temperature curing two component epoxy compound for high temperature potting and encapsulating applications. Adhesion to metals, glass, ceramics, woo..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.0 °C
|
24.0
-
48.0
hour <br>@Temperature 73.4 °F
|
|
|
Master Bond EP35 High Temperature Resistant Two Component Epoxy System
Master Bond Polymer Adhesive EP35 is a unique, room temperature curing, two component epoxy adhesive for high temperature bonding applications. Master Bond Polymer Adhesive EP35 produces high stren..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.9 °C
|
24.0
-
48.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond Supreme 11HT-LO Adhesive and Sealant Serviceable to +400°F
Description: Master Bond Polymer System Supreme 11HT-LO is an easy to use two part epoxy adhesive/sealant combining both high shear and high peel strengths along with a relatively fast cure at room ..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 25.0 °C
|
24.0
-
48.0
hour <br>@Temperature 77.0 °F
|
|
|
Cytec (Conap) FR-1271 Conapoxy® Resin / Conacure® Hardener
Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 25.0 °C
|
24.0
-
48.0
hour <br>@Temperature 77.0 °F
|
|
|
Cytec (Conap) FR-1272 Conapoxy® Resin / Conacure® Hardener
Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 25.0 °C
|
24.0
-
48.0
hour <br>@Temperature 77.0 °F
|
|
|
Cytec (Conap) FR-1273 Conapoxy® Resin / Conacure® Hardener
Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.0 °C
|
24.0
-
48.0
hour <br>@Temperature 73.4 °F
|
Recommended Cure |
|
Aremco Aremco-Bond™ 2210 High Performance Epoxide
Aluminum and Ceramic-Filled, Vibration and Impact Resistant, for Repairing Aluminum Mold and Wear Surfaces.
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.0 °C
|
24.0
-
48.0
hour <br>@Temperature 73.4 °F
|
at RT, Alternate Cure |
|
Aremco Aremco-Bond™ 631 High Performance Epoxide
Clear-Amber, 1:1, Good Bond Strength and Corrosion Resistance.Also available filled with aluminum oxide (Alumina) or pigments.
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.0 °C
|
24.0
-
48.0
hour <br>@Temperature 73.4 °F
|
Alternate |
|
Aremco Aremco-Bond™ 657 High Performance Epoxide
Stainless Steel-Filled, High Corrosion Resistance.
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 79.4 °C
|
24.0
-
48.0
hour <br>@Temperature 175 °F
|
recommended cure |
|
Aremco Aremco-Bond™ 2320 High Performance Epoxide
Toughened, Unfilled, Fast-Setting, BPA Free, 2:1, High Peel & Shear Strength
|
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