Polymer Property : Cure Time = 3.00 hour Product List

Processing Properties

Tips: 30 items are displayed at most.

Processing Properties	Metric	English	Comments
Cure Time	120 - 180 min <br>@Temperature 60.0 °C	2.00 - 3.00 hour <br>@Temperature 140 °F
Resin Technology Group 404 Oxy-Bond™ Electrically Conductive Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma..
Cure Time	60.0 - 180 min <br>@Temperature 23.0 °C	1.00 - 3.00 hour <br>@Temperature 73.4 °F	M10 steel, working strength
Permabond HM129 Anaerobic Threadlocker Permabond® HM129 is a high strength medium viscosity anaerobic threadlocker and sealant. This material cures in the absence of air between tight fitting metal parts. Cure is fast and reliable on st..
Cure Time	120 - 180 min <br>@Temperature 93.3 °C	2.00 - 3.00 hour <br>@Temperature 200 °F
Master Bond EP21NDLO Low Outgassing, Room Temperature Curing Two Component Epoxy Master Bond EP21ND-LO is a two component, room temperature curing epoxy system for bonding, sealing and coating featuring outstanding physical properties. EP21ND-LO has a convenient one to one mix r..
Cure Time	120 - 180 min <br>@Temperature 93.3 °C	2.00 - 3.00 hour <br>@Temperature 200 °F
Master Bond EP30AN-1 Low Viscosity, NASA Low Outgassing Epoxy Description: Master Bond EP30AN-1 is a two part epoxy for high performance potting, sealing, coating and bonding featuring high thermal conductivity, excellent electrical insulation properties and N..
Cure Time	120 - 180 min <br>@Temperature 93.3 °C	2.00 - 3.00 hour <br>@Temperature 200 °F
Master Bond EP37-3FLFAN Electrically Isolating, Flexible Epoxy Description: Master Bond Polymer System EP37-3FLFAN is a two component system for high performance potting, bonding, sealing and coating that is formulated to cure at room temperature or more rapidl..
Cure Time	120 - 180 min <br>@Temperature 65.6 °C	2.00 - 3.00 hour <br>@Temperature 150 °F
Master Bond EP79FL Two Component Silver Nickel Conductive Epoxy Adhesive Master Bond Polymer System EP79FL is a two component, silver-coated nickel, electrically conductive system for high performance bonding and sealing. Its most salient features are its high flexibilit..
Cure Time	120 - 180 min <br>@Temperature 93.3 °C	2.00 - 3.00 hour <br>@Temperature 200 °F
Master Bond EP21BAS Radiopaque Two Component Epoxy Master Bond Polymer System EP21BAS is a radiopaque epoxy compound which offers outstanding performance and superior processability. Radiopaque epoxy polymer compounds are employed for medical diagno..
Cure Time	120 - 180 min <br>@Temperature 93.3 °C	2.00 - 3.00 hour <br>@Temperature 200 °F
Master Bond EP21FRNS-2 Two Component, Flame Resistant Epoxy System Master Bond Polymer System EP21FRNS-2 is a two component, room temperature curing, flame retardant compound for potting, encapsulating and casting. Particularly noteworthy are its low smoke generati..
Cure Time	120 - 180 min <br>@Temperature 93.3 °C	2.00 - 3.00 hour <br>@Temperature 200 °F
Master Bond EP30DP Abrasion Resistant Cryogenic Epoxy Urethane System Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, se..
Cure Time	120 - 180 min <br>@Temperature 100 °C	2.00 - 3.00 hour <br>@Temperature 212 °F
Master Bond EP30LV Optically Clear, Low Viscosity Epoxy Adhesive Description: Master Bond Polymer System EP30LV is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or mo..
Cure Time	120 - 180 min <br>@Temperature 93.3 °C	2.00 - 3.00 hour <br>@Temperature 200 °F
Master Bond EP30MED USP Class VI Certified Two Component Epoxy System Master Bond EP30Med is a two component, optically clear, low viscosity epoxy resin system for high performance bonding, sealing, coating, and encapsulating. It features excellent physical and electr..
Cure Time	60.0 - 180 min <br>@Temperature 93.3 °C	1.00 - 3.00 hour <br>@Temperature 200 °F
Master Bond EP30ND Non-Drip, Dimensionally Stable Epoxy Adhesive Description: Master Bond Polymer System EP30ND is a high viscosity, two component epoxy adhesive/sealant with a paste consistency. It will cure at room temperature or more rapidly at elevated temper..
Cure Time	120 - 180 min <br>@Temperature 93.3 °C	2.00 - 3.00 hour <br>@Temperature 200 °F
Master Bond EP30QF Quartz Filled, Two Component Epoxy System Master Bond Polymer System EP30QF is a quartz filled, two component epoxy for high performance bonding, sealing, coating and casting that is formulated to cure at room temperature or more rapidly at..
Cure Time	120 - 180 min <br>@Temperature 93.3 °C	2.00 - 3.00 hour <br>@Temperature 200 °F
Master Bond EP42HT-2AO-1 Two Part, Cryogenically Serviceable Epoxy Description: Master Bond EP42HT-2AO-1 Black is a room temperature curable, two component epoxy adhesive, sealant, coating and casting material that meets NASA low outgassing specifications. It featu..
Cure Time	60.0 - 180 min <br>@Temperature 100 °C	1.00 - 3.00 hour <br>@Temperature 212 °F
Abatron AboCoat 8501-2/AboCure 8501-2 Clear Epoxy Coating AboCoat 8501-2 is a clear, light amber resin made of 85% solids. It has a viscosity of 21-23 poises and a weight of 9.3 lbs/gallon. AboCure 8501-2 is a clear, light amber converter made of 85% solid..
Cure Time	30.0 - 180 min <br>@Temperature 50.0 - 100 °C	0.500 - 3.00 hour <br>@Temperature 122 - 212 °F	Optional
Abatron AboCoat 8709-12/AboCure 50-12 Silver-Filled Electrically Conductive Epoxy Compound AboCoat 8709-12/AboCure 50-12 is a versatile silver-epoxy high-solids coating with good conductive and adhesive properties. It is successful as a conductive compound for most electronic uses.
Cure Time	30.0 - 180 min <br>@Temperature 50.0 - 100 °C	0.500 - 3.00 hour <br>@Temperature 122 - 212 °F	Optional
Abatron AboCoat 8709-3 A/B Carbon-Filled Electrically Conductive Epoxy Compound AboCoat 8709-3 A/B is a high-solid carbon-epoxy coating with various conductivity ranges widely used in silk-screening.
Cure Time	30.0 - 180 min <br>@Temperature 50.0 - 100 °C	0.500 - 3.00 hour <br>@Temperature 122 - 212 °F	Optional
Abatron AboWeld 8201-14/AboCure 8201-14 Carbon-Filled Electrically Conductive Epoxy Compound AboWeld 8201-14/AboCure 8201-14 is an easy-to-use and very conductive carbon-epoxy paste. As the size of the conductive particles is relatively coarse, this product is used primarily as a thick adhe..
Cure Time	30.0 - 180 min <br>@Temperature 50.0 - 100 °C	0.500 - 3.00 hour <br>@Temperature 122 - 212 °F
Abatron AboWeld 8709-18/AboCure 50-12 Nickel-Filled Electrically Conductive Epoxy Compound AboWeld 8709-18/AboCure 50-12 is a practically solventless nickel-epoxy adhesive and resurfacing system with good coating capabilities in the intermediate conductivity range. It is very versatile.
Cure Time	30.0 - 180 min <br>@Temperature 50.0 - 100 °C	0.500 - 3.00 hour <br>@Temperature 122 - 212 °F	Optional
Abatron 8509-1 A/B Carbon-Filled Electrically Conductive Epoxy Compound 8509-1 A/B is a solventless carbon-epoxy system used as an adhesive and silk-screening material with anti-static and other lower-conductivity requirements.
Cure Time	30.0 - 180 min <br>@Temperature 50.0 - 100 °C	0.500 - 3.00 hour <br>@Temperature 122 - 212 °F	Optional
Abatron 8509-2A/8509-1B Carbon-Filled Electrically Conductive Epoxy Compound 8509-2A/8509-1B is a solventless carbon-epoxy system used as an adhesive and silk-screening material with anti-static and other lower-conductivity requirements.
Cure Time	30.0 - 180 min <br>@Temperature 50.0 - 100 °C	0.500 - 3.00 hour <br>@Temperature 122 - 212 °F	Optional
Abatron 8509-4 A/B Carbon-Filled Electrically Conductive Epoxy Compound 8509-4 A/B is a solventless carbon-epoxy system used as an adhesive and silk-screening material with anti-static and other lower-conductivity requirements.
Cure Time	120 - 180 min <br>@Temperature 100 °C	2.00 - 3.00 hour <br>@Temperature 212 °F
Abatron AboCast 8103-20 High-Performance Dielectric Epoxy AboCast 8103-20 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system is unique ..
Cure Time	120 - 180 min <br>@Temperature 100 °C	2.00 - 3.00 hour <br>@Temperature 212 °F
Abatron AboCast 8103-23 High-Performance Dielectric Epoxy AboCast 8103-23 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system has a comb..
Cure Time	30.0 - 180 min <br>@Temperature 50.0 - 100 °C	0.500 - 3.00 hour <br>@Temperature 122 - 212 °F	Optional
Abatron 8602-2 A/B Carbon-Filled Electrically Conductive Epoxy Compound 8602-2 A/B is a solventless carbon-epoxy system used as an adhesive and silk-screening material with anti-static and other lower-conductivity requirements.
Cure Time	120 - 180 min <br>@Temperature 93.3 °C	2.00 - 3.00 hour <br>@Temperature 200 °F
Master Bond EP21TDC-2LO Two component, highly flexibilized epoxy resin compound Product Description: Master Bond Polymer System EP21TDC-2LO is a two component, highly flexible epoxy resin compound for high performance bonding, sealing, coating, and encapsulation. It is formulat..
Cure Time	120 - 180 min <br>@Temperature 100 °C	2.00 - 3.00 hour <br>@Temperature 212 °F
Master Bond EP42HT-2LO Low Outgassing, Heat Resistant Two Component Epoxy Master Bond Polymer System EP42HT-2LO is a room temperature curable two component epoxy, adhesive, sealant, coating and casting material featuring high temperature resistance along with outstanding ..