Polymer Property : Cure Time = 300 min Product List

Processing Properties

Tips: 30 items are displayed at most.

Processing Properties	Metric	English	Comments
Cure Time	120 - 300 min @Temperature 25.0 °C	2.00 - 5.00 hour @Temperature 77.0 °F	De-mold Time
Northstar Polymers MPP-W43C Polyurethane Gel MPP-W43C is a polyurethane gel formulation specifically designed for padding and cushioning applications that require Shore Durometer OOO scale hardness materials. With this material, a user can ob..
Cure Time	240 - 300 min @Temperature 25.0 °C	4.00 - 5.00 hour @Temperature 77.0 °F	De-mold Time
Northstar Polymers MYP-V40A Polyurethane Filler Gel This polyurethane casting material is developed for applications that require inexpensive liquid resin filler such as encapsulation of a large electric components or puncture-free tire for low-speed..
Cure Time	240 - 300 min @Temperature 23.9 °C	4.00 - 5.00 hour @Temperature 75.0 °F
Master Bond EP21TDC-4 Two Component, Highly Flexible Epoxy System Master Bond Polymer System EP21TDC-4 is a two component, flexible epoxy resin system for high performance bonding, sealing and coating. It is formulated to cure at ambient temperatures or more quick..
Cure Time	240 - 300 min @Temperature 23.9 °C	4.00 - 5.00 hour @Temperature 75.0 °F
Master Bond EP21TDC-4ND Two component, highly flexibilized epoxy for bonding, sealing and coating Product Description: Master Bond EP21TDC-4ND is a two component, very flexible epoxy system for high performance bonding, sealing and coating with a non-drip consistency. It has a one to four mix ra..
Cure Time	240 - 300 min @Temperature 93.3 °C	4.00 - 5.00 hour @Temperature 200 °F
Master Bond EP30-D10 Abrasion Resistant, Flexible Adhesive Compound Description: Master Bond Polymer System EP30-D10 is a versatile two component, abrasion resistant elastomer featuring superior strength, toughness and chemical resistance for high performance bondin..
Cure Time	120 - 300 min @Temperature 65.0 °C	2.00 - 5.00 hour @Temperature 149 °F
Tra-Con Tra-Cast F311 Optically Transparent Semi-Flexible Casting System TRA-CAST F311 is a clear, low viscosity epoxy formulation developed for molding, embedding, casting and potting applications where clarity, toughness, long pot-life and superior impact properties ar..
Cure Time	180 - 300 min @Temperature 23.9 °C	3.00 - 5.00 hour @Temperature 75.0 °F
Master Bond EP21LSCL-1 Two Component, Room Temperature Curing Epoxy Resin Product Description: Master Bond Polymer System EP21LSCL-1 is a two component, low viscosity epoxy resin system featuring optical clarity as well as non-yellowing properties. This system can be used..
Cure Time	180 - 300 min @Temperature 60.0 °C	3.00 - 5.00 hour @Temperature 140 °F
Cytec (Conap) FR-1271 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Cure Time	180 - 300 min @Temperature 60.0 °C	3.00 - 5.00 hour @Temperature 140 °F
Cytec (Conap) FR-1272 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Cure Time	180 - 300 min @Temperature 60.0 °C	3.00 - 5.00 hour @Temperature 140 °F
Cytec (Conap) FR-1273 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Cure Time	180 - 300 min @Temperature 60.0 °C	3.00 - 5.00 hour @Temperature 140 °F
Cytec (Conap) FR-1274 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Cure Time	240 - 300 min @Temperature 25.0 °C	4.00 - 5.00 hour @Temperature 77.0 °F	tack free
Cytec Conathane® CC-1155 (Conap) Polyurethane Two-component Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i..
Cure Time	240 - 300 min @Temperature 25.0 °C	4.00 - 5.00 hour @Temperature 77.0 °F	tack free
Cytec Conathane® CC-1155-35 (Conap) Polyurethane Two-component Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i..
Cure Time	240 - 300 min @Temperature 25.0 °C	4.00 - 5.00 hour @Temperature 77.0 °F	tack free
Cytec Conathane® CC-1195 (Conap) Polyurethane Two-component Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i..