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Polymer Property : Cure Time = 4320 min Product List
Processing PropertiesTips: 30 items are displayed at most.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time |
1440
-
4320
min <br>@Temperature 25.0 °C
|
24.0
-
72.0
hour <br>@Temperature 77.0 °F
|
|
|
Resinlab® EP1215 Clear Unfilled Epoxy Structural Adhesive
Resinlab™ EP1215 Clear is a two part unfilled epoxy structural adhesive designed for bonding applications requiring high strength and good impact resistance. It cures completely at room temperature..
|
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| Cure Time |
2880
-
4320
min <br>@Temperature 25.0 °C
|
48.0
-
72.0
hour <br>@Temperature 77.0 °F
|
Complete Cure Cycle |
|
Northstar Polymers MPP-D80B Rigid Polyurethane
MPP-D80B has a high load-bearing property at hardness 80 D Durometer. This material has a relatively slow curing pattern. Whereas many polyurethane formulations of this hardness cure very fast thus..
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| Cure Time |
1440
-
4320
min <br>@Temperature 25.0 °C
|
24.0
-
72.0
hour <br>@Temperature 77.0 °F
|
|
|
Resinlab® EP1294 Mineral Filled, Flame Retardant Epoxy Syntactic Foam
Resinlab™ EP1294 is a two part mineral filled, flame retardant epoxy syntactic foam. It utilizes glass microspheres to reduce cured density and improve machinability. This product will be self-exti..
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| Cure Time |
2880
-
4320
min <br>@Temperature 23.9 °C
|
48.0
-
72.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond EP21ANHT Two Component, Room Temperature Curing Epoxy Adhesive
Product Description: Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that combines high thermal conductivity and electrical insulation ..
|
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| Cure Time |
2880
-
4320
min <br>@Temperature 23.9 °C
|
48.0
-
72.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond EP21AOLV-1 Two Part, Room Temperature Curing Epoxy System
Product Description: Master Bond Polymer Adhesive EP21AOLV-1 is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant and coating. This versatile system will adhere t..
|
|||
| Cure Time |
2880
-
4320
min <br>@Temperature 23.9 °C
|
48.0
-
72.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond EP21HTND High Temperature Resistant, Non-Drip Epoxy Compound
Description: Master Bond EP21HTND is a two component, room temperature curing epoxy adhesive, sealant and coating with a paste viscosity and non-drip application feature. Its features are easy handl..
|
|||
| Cure Time |
2880
-
4320
min <br>@Temperature 23.9 °C
|
48.0
-
72.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond EP21LV-LO Two Component, Lower Viscosity, Room Temperature Curing Epoxy System
Product Description: Master Bond EP21LV-LO is a two component, lower viscosity, room temperature curing epoxy system for high performance bonding, sealing, coating and encapsulation. This user frien..
|
|||
| Cure Time |
2880
-
4320
min <br>@Temperature 23.9 °C
|
48.0
-
72.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond EP21TDCHT-LO Room Temperature Curing, Toughened Two Component Epoxy
Master Bond Polymer Adhesive EP21TDCHT-LO is a two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a very forgiving and convenient one ..
|
|||
| Cure Time |
2880
-
4320
min <br>@Temperature 23.9 °C
|
48.0
-
72.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond EP21TDCHTND Versatile, toughened two component epoxy for bonding, sealing and coating
Product Description: Master Bond EP21TDCHTND is a two component epoxy adhesive, sealant and coating featuring high performance, versatility and exceptional user friendliness. It has a very forgiving..
|
|||
| Cure Time |
2880
-
4320
min <br>@Temperature 23.9 °C
|
48.0
-
72.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond EP30AN-1 Low Viscosity, NASA Low Outgassing Epoxy
Description: Master Bond EP30AN-1 is a two part epoxy for high performance potting, sealing, coating and bonding featuring high thermal conductivity, excellent electrical insulation properties and N..
|
|||
| Cure Time |
2880
-
4320
min <br>@Temperature 23.0 °C
|
48.0
-
72.0
hour <br>@Temperature 73.4 °F
|
|
|
Master Bond EP37-3FLF Low Exotherm Highly Flexible Two Component Epoxy
Master Bond Polymer System EP37-3FLF is a very flexible, low viscosity, optically clear two component epoxy resin system designed for high performance bonding, coating and casting applications. The ..
|
|||
| Cure Time |
2880
-
4320
min <br>@Temperature 23.9 °C
|
48.0
-
72.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond EP42HT-2Med Epoxy Meets USP Class VI Requirements
Description: Master Bond Polymer System EP42HT-2Med is a room temperature curable two component epoxy, adhesive, sealant, coating and casting material featuring high temperature resistance along wit..
|
|||
| Cure Time |
2880
-
4320
min <br>@Temperature 23.9 °C
|
48.0
-
72.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond EP42HT-2ND-2Med Heat Resistant, Medical Grade Non-Drip Epoxy
Master Bond Polymer System EP42HT-2ND2MED (Black) is a room temperature curable two component epoxy adhesive and sealant featuring high temperature resistance along with outstanding chemical resista..
|
|||
| Cure Time |
2880
-
4320
min <br>@Temperature 23.9 °C
|
48.0
-
72.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond EP76M-1R Nickel Conductive Epoxy Adhesive
Description: Master Bond Polymer System EP76M-1R is a two component, nickel filled, electrically conductive adhesive for high performance bonding formulated to cure at room temperature or more rapid..
|
|||
| Cure Time |
2880
-
4320
min <br>@Temperature 23.9 °C
|
48.0
-
72.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond MasterSil 153Med Silicone Paste for Medical Applications
Description: Master Bond MasterSil 153Med is a two component silicone compound with a paste consistency for high performance bonding and sealing. It can be used for medical device applications as it..
|
|||
| Cure Time |
2880
-
4320
min <br>@Temperature 23.9 °C
|
48.0
-
72.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond EP21TPFL-1AO Two Part, Flexible, Lower Viscosity Epoxy Polysulfide System
Product Description: Master Bond EP21TPFL-1AO is a two component, low viscosity epoxy polysulfide for high performance bonding, sealing, coating and casting offering thermal conductivity, electrical..
|
|||
| Cure Time |
2880
-
4320
min <br>@Temperature 23.0 °C
|
48.0
-
72.0
hour <br>@Temperature 73.4 °F
|
|
|
Master Bond EP30M3LV Electrically Insulative, Low Viscosity Two Component Epoxy
Master Bond Polymer System EP30M3LV is a lower viscosity, two component epoxy system for high performance bonding, sealing and encapsulation. It is formulated to cure at ambient temperatures or mor..
|
|||
| Cure Time |
1440
-
4320
min <br>@Temperature 23.9 °C
|
24.0
-
72.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond EP34AO Epoxy Compound Withstands High Temperatures
Description: Master Bond Polymer System EP34AO is a room temperature curing, two component epoxy compound for high temperature bonding and sealing applications especially where thermal conductivity ..
|
|||
| Cure Time |
1440
-
4320
min <br>@Temperature 23.9 °C
|
24.0
-
72.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond EP42HT-2AO-1 Two Part, Cryogenically Serviceable Epoxy
Description: Master Bond EP42HT-2AO-1 Black is a room temperature curable, two component epoxy adhesive, sealant, coating and casting material that meets NASA low outgassing specifications. It featu..
|
|||
| Cure Time |
2880
-
4320
min <br>@Temperature 23.9 °C
|
48.0
-
72.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond Supreme 33 High Temperature Resistant, Structural Adhesive
Description: Master Bond Polymer System Supreme 33 is a unique, room temperature curing, toughened epoxy adhesive/sealant, offering high temperature resistance. This innovative system offers high bo..
|
|||
| Cure Time |
1440
-
4320
min <br>@Temperature 25.0 °C
|
24.0
-
72.0
hour <br>@Temperature 77.0 °F
|
|
|
Resinlab® EP11HTFS Gray Filled Epoxy Adhesive
Resinlab™ EP11HTFS Gray is a two part filled epoxy adhesive designed for bonding metals and plastics. It cures at room temperature to a tough, semi-rigid material. It has good wetting to most surfa..
|
|||
| Cure Time |
1440
-
4320
min <br>@Temperature 25.0 °C
|
24.0
-
72.0
hour <br>@Temperature 77.0 °F
|
|
|
Resinlab® EP1296 Highly Filled, Moderately Thixotropic Black Casting Resin
Resinlab™ EP1296 is a highly filled, moderately thixotropic black casting resin designed for applications requiring good thermal conductivity, low shrinkage and a low CTE. It was especially formula..
|
|||
| Cure Time |
1440
-
4320
min <br>@Temperature 25.0 °C
|
24.0
-
72.0
hour <br>@Temperature 77.0 °F
|
|
|
Resinlab® SEC1233 Silver Filled Epoxy Adhesive
Resinlab™ SEC1233 is a silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature. SEC1233 provides excellent electrical conductivit..
|
|||
| Cure Time |
2880
-
4320
min <br>@Temperature 23.9 °C
|
48.0
-
72.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond EP21TDC-2LO Two component, highly flexibilized epoxy resin compound
Product Description: Master Bond Polymer System EP21TDC-2LO is a two component, highly flexible epoxy resin compound for high performance bonding, sealing, coating, and encapsulation. It is formulat..
|
|||
| Cure Time |
2880
-
4320
min <br>@Temperature 23.9 °C
|
48.0
-
72.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond EP42HT-2LO Low Outgassing, Heat Resistant Two Component Epoxy
Master Bond Polymer System EP42HT-2LO is a room temperature curable two component epoxy, adhesive, sealant, coating and casting material featuring high temperature resistance along with outstanding ..
|
|||
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