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Polymer Property : Cure Time = 48.0 hour Product List
Processing PropertiesTips: 30 items are displayed at most.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time |
1440
-
2880
min <br>@Temperature 25.0 °C
|
24.0
-
48.0
hour <br>@Temperature 77.0 °F
|
Complete Cure Cycle |
|
Northstar Polymers MPP-R02C Semi-rigid Polyurethane Foam Formulation
MPP-R02C is semi-rigid foam formulations for molded foam products. It is closed-cell light foam with some structural integrity. Unlike rigid polyurethane foams, the physical properties of a cured pr..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 25.0 °C
|
24.0
-
48.0
hour <br>@Temperature 77.0 °F
|
Complete Cure Cycle |
|
Northstar Polymers MAP-R06C Semi Rigid Structural Foam Formulation
MPP-R06C is a polyurethane foam formulation. It is closed-cell foam with a good structural integrity and an enhanced skin quality. Unlike polyurethane rigid foams, the physical properties of a cured..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.0 °C
|
24.0
-
48.0
hour <br>@Temperature 73.4 °F
|
|
|
Master Bond EP21AR Acid Resistant Two Component Epoxy
Master Bond EP21AR is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealant with outstanding acid as well as excellent overall chemical resistance. E..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.9 °C
|
24.0
-
48.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond EP21ARHT Two component epoxy adhesive, sealant, coating and encapsulating system
Product Description: Master Bond EP21ARHT is a two component epoxy resin system for high performance bonding, sealing, coating and encapsulating. It has a convenient 100 to 50 mix ratio by weight an..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.9 °C
|
24.0
-
48.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond EP21LV35Med Two Component, Flexible USP Class VI Epoxy System
Master Bond Polymer System EP21LV3/5Med is a two part, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting that cures flexible. It cures readil..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.0 °C
|
24.0
-
48.0
hour <br>@Temperature 73.4 °F
|
|
|
Master Bond EP21TDC Toughened, Shock Resistant Two Component Epoxy System
Master Bond Polymer Adhesive EP21TDC is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one ..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.9 °C
|
24.0
-
48.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond EP21TDCSMed Two Component, Silver Conductive USP Class VI Epoxy
Master Bond Polymer System EP21TDCS MED is a two component, silver filled, electrically conductive adhesive/sealant that meets USP Class VI specifications for medical applications. The high strength..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.9 °C
|
24.0
-
48.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond EP30ANHT Two Part, Electrically Isolating Epoxy Adhesive
Description: Master Bond Polymer System EP30ANHT is a two part epoxy system with terrific thermal conductivity, while maintaining electrical insulation. One noteworthy property is its wide service t..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.9 °C
|
24.0
-
48.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond EP30P Epoxy Bonds Glass, Polycarbonates and Acrylics
Description: Master Bond Polymer Adhesive EP30P is a two component, transparent, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is for..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.9 °C
|
24.0
-
48.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond EP41S-1HT Solvent Resistant Adhesive, Sealant and Coating
Description: Master Bond EP41S-1HT is a two component epoxy resin system for high performance bonding, sealing, coating and encapsulating. It has a 100 to 30 mix ratio by weight and is formulated to..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.9 °C
|
24.0
-
48.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond EP79 Two Component, Silver Coated, Nickel Filled Conductive Epoxy
Master Bond Polymer System EP79 is a two component, silver coated, nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or ..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.0 °C
|
24.0
-
48.0
hour <br>@Temperature 73.4 °F
|
|
|
Master Bond Mastersil 151 Two Component Low Viscosity Silicone Compound
Master Bond MasterSil 151 is a two component, low viscosity
silicone compound for high performance potting and
encapsulation. MasterSil 151 is an addition cured system and does not require exposure..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.9 °C
|
24.0
-
48.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond MB600G Aqueous Based Electrically Conductive Sodium Silicate Coating
Master Bond MB600G is an aqueous based, sodium silicate system with graphite filler. It is intended for use in applications where moderate shielding effectiveness is required and cost is a more sign..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.9 °C
|
24.0
-
48.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond MB600S Aqueous Based Sodium Silicate System for EMI/RFI Shielding
Description: Master Bond MB600S is a silver containing aqueous based sodium silicate system used as a coating in situations where EMI shielding effectiveness is paramount. Electromagnetic interferen..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.9 °C
|
24.0
-
48.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond Supreme 11ANHT Fast Curing Epoxy Paste System
Description: Master Bond Polymer System SUPREME 11ANHT is a two component epoxy resin system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevat..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.0 °C
|
24.0
-
48.0
hour <br>@Temperature 73.4 °F
|
|
|
Master Bond EP21LV Low Viscosity Two Component Epoxy
Master Bond Polymer System EP21LV is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting. It is formulated to cure readily at ..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.9 °C
|
24.0
-
48.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond EP30LV-1 Ultra Low Viscosity, Two Part Epoxy System
Description: Master Bond Polymer System EP30LV-1 is an ultra low viscosity, two component epoxy system for high performance bonding, coating, sealing, potting and encapsulation. It readily cures at ..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.0 °C
|
24.0
-
48.0
hour <br>@Temperature 73.4 °F
|
|
|
Master Bond EP30MED USP Class VI Certified Two Component Epoxy System
Master Bond EP30Med is a two component, optically clear, low viscosity epoxy resin system for high performance bonding, sealing, coating, and encapsulating. It features excellent physical and electr..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.9 °C
|
24.0
-
48.0
hour <br>@Temperature 75.0 °F
|
|
|
Master Bond EP30QF Quartz Filled, Two Component Epoxy System
Master Bond Polymer System EP30QF is a quartz filled, two component epoxy for high performance bonding, sealing, coating and casting that is formulated to cure at room temperature or more rapidly at..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.0 °C
|
24.0
-
48.0
hour <br>@Temperature 73.4 °F
|
|
|
Master Bond EP34 Room Temperature Curing Two Component Epoxy System
Master Bond Polymer System EP34 is a unique room temperature curing two component epoxy compound for high temperature potting and encapsulating applications. Adhesion to metals, glass, ceramics, woo..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.0 °C
|
24.0
-
48.0
hour <br>@Temperature 73.4 °F
|
|
|
Master Bond EP35 High Temperature Resistant Two Component Epoxy System
Master Bond Polymer Adhesive EP35 is a unique, room temperature curing, two component epoxy adhesive for high temperature bonding applications. Master Bond Polymer Adhesive EP35 produces high stren..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 25.0 °C
|
24.0
-
48.0
hour <br>@Temperature 77.0 °F
|
|
|
Cytec (Conap) FR-1271 Conapoxy® Resin / Conacure® Hardener
Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 25.0 °C
|
24.0
-
48.0
hour <br>@Temperature 77.0 °F
|
|
|
Cytec (Conap) FR-1274 Conapoxy® Resin / Conacure® Hardener
Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.0 °C
|
24.0
-
48.0
hour <br>@Temperature 73.4 °F
|
Alternate Cure |
|
Aremco Aremco-Bond™ 568 High Performance Epoxide
Aluminum-Filled, 1:1, Good Bond Strength and High Thermal Conductivity.
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 23.0 °C
|
24.0
-
48.0
hour <br>@Temperature 73.4 °F
|
Alternate |
|
Aremco Aremco-Bond™ 657 High Performance Epoxide
Stainless Steel-Filled, High Corrosion Resistance.
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 79.4 °C
|
24.0
-
48.0
hour <br>@Temperature 175 °F
|
recommended cure |
|
Aremco Aremco-Bond™ 2320 High Performance Epoxide
Toughened, Unfilled, Fast-Setting, BPA Free, 2:1, High Peel & Shear Strength
|
|||
| Cure Time |
1440
-
2880
min <br>@Temperature 25.0 °C
|
24.0
-
48.0
hour <br>@Temperature 77.0 °F
|
|
|
Resinlab® EP1240RC Flame Retardant Epoxy Casting Resin
Resinlab™ EP1240RC is a medium viscosity, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034, Pro..
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