Polymer Property : Cure Time = 5.00 min Product List

Processing Properties

Tips: 30 items are displayed at most.

Processing Properties	Metric	English	Comments
Cure Time	5.00 min @Temperature 125 °C	0.0833 hour @Temperature 257 °F
NextGen Adhesives P907-12 Fiber Optic Adhesive Description: NGAC P907-12 is a rapid curing, low viscosity, heat cured epoxy adhesive system that is specifically formulated for use in the fiber optic industry.Advantages and Applications: Uses inc..
Cure Time	5.00 min @Temperature 150 °C	0.0833 hour @Temperature 302 °F
Resinlab® SEC1244 Silver Filled Epoxy Adhesive Resinlab™ SEC1244 is a silver filled, two component, elevated temperature curing epoxy adhesive. It provides excellent electrical conductivity useful in many electronic applications. It is a smooth..
Cure Time	5.00 min @Temperature 150 Â°C	0.0833 hour @Temperature 302 Â°F	Press Cure
Shin-Etsu Silicones LIMSâ„¢ KEG2001-50A/B Elastomer KEG2001-50 is a very fast cure type liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. Its viscosity is low enou..
Cure Time	5.00 min @Temperature 120 Â°C	0.0833 hour @Temperature 248 Â°F	Press Cure
Shin-Etsu Silicones LIMSâ„¢ KE1950-40A/B Elastomer KE-1950-40 is a liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. It's viscosity is low enough to allow easy ..
Cure Time	5.00 min @Temperature 150 Â°C	0.0833 hour @Temperature 302 Â°F	Press Cure
Shin-Etsu Silicones LIMSâ„¢ KEG2002-60A/B Elastomer Information Provided by Shin-Etsu Silicones of America, Inc.
Cure Time	5.00 min @Temperature 100 °C	0.0833 hour @Temperature 212 °F
Tra-Con Tra-Bond F123MV Color Keyed High Temperature Epoxy Adhesive TRA-BOND F123 MV is a fast cure, medium viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminati..
Cure Time	5.00 min @Temperature 125 °C	0.0833 hour @Temperature 257 °F
Tra-Con Tra-Duct 2958 Snap Cure Conductive Silver Epoxy Adhesive TRA-DUCT 2958 is a two-part, smooth paste of specially refined and processed epoxy and silver components, recommended for electronic, microelectronic and die-attach bonding and sealing applications ..
Cure Time	5.00 min @Temperature 180 °C	0.0833 hour @Temperature 356 °F
Trelleborg Emerson & Cuming Eccobond® C429-2 One-Component Silver Filled Electrically Conductive Epoxy Adhesive Emerson & Cuming C429-2 Eccobond® One-Component Silver Filled Electrically Conductive Epoxy AdhesiveOne component, high strength, moderate cost, silver filled, electrically conductive, epoxy adhesi..
Cure Time	5.00 min @Temperature 155 °C	0.0833 hour @Temperature 311 °F	TC90
TSE Industries Millathane® 76 Millable Polyester Polyurethane Rubber, 2.0 PHR MBTS Millathane® 76 is a very suitable choice for use in products such as bushings, small copier rolls; automotive applications — bumpers, o-rings, hydraulic seals, belts, gaskets, solid tires — and m..
Cure Time	5.00 min @Temperature 120 °C	0.0833 hour @Temperature 248 °F	Minimum Bond Line
Epoxy Technology EPO-TEK® 330 Low Viscosity, Optical Epoxy Product Description: EPO-TEK® 330 is a two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications.Advan..
Cure Time	5.00 min @Temperature 150 °C	0.0833 hour @Temperature 302 °F	Minimum Bond Line
Epoxy Technology EPO-TEK® H20E-8 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-8 is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a higher viscos..
Cure Time	5.00 min @Temperature 150 °C	0.0833 hour @Temperature 302 °F	minimum
Epoxy Technology EPO-TEK® OD2002 High Temperature Epoxy Material Description: High Tg version of EPO-TEK®353ND with low modulus and good toughness. Replacement for EPO-TEK® 364. Complies with USP Class VI biocompatibility standards.Information Provid..
Cure Time	5.00 min @Temperature 150 °C	0.0833 hour @Temperature 302 °F
Epoxy Technology EPO-TEK® H20E Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also ..
Cure Time	5.00 min @Temperature 75.0 °C	0.0833 hour @Temperature 167 °F
Dow Corning 3-4207 DIELECTRIC TOUGH GEL KIT Two-part, translucent green, fast RT or heat cure, tough, primerless chemical adhesion, UV indicator, and UL 94 V-1 flammability classification.Information provided by Dow Corning
Cure Time	5.00 - 10.000 min @Temperature 149 °C	0.0833 - 0.16667 hour @Temperature 300 °F
Master Bond Supreme 3AN One Component, Heat Curing Epoxy Adhesive Description: Master Bond Polymer System SUPREME 3AN is a one component, heat cured epoxy adhesive and sealant, featuring high peel and shear strength along with excellent thermal conductivity and co..