Polymer Property : Cure Time = 72.0 hour Product List

Processing Properties

Tips: 30 items are displayed at most.

Processing Properties	Metric	English	Comments
Cure Time	2880 - 4320 min <br>@Temperature 25.0 °C	48.0 - 72.0 hour <br>@Temperature 77.0 °F	Complete Cure Cycle
Northstar Polymers MPP-D80B Rigid Polyurethane MPP-D80B has a high load-bearing property at hardness 80 D Durometer. This material has a relatively slow curing pattern. Whereas many polyurethane formulations of this hardness cure very fast thus..
Cure Time	1440 - 4320 min <br>@Temperature 25.0 °C	24.0 - 72.0 hour <br>@Temperature 77.0 °F
Resinlab® EP1294 Mineral Filled, Flame Retardant Epoxy Syntactic Foam Resinlab™ EP1294 is a two part mineral filled, flame retardant epoxy syntactic foam. It utilizes glass microspheres to reduce cured density and improve machinability. This product will be self-exti..
Cure Time	2880 - 4320 min <br>@Temperature 25.0 °C	48.0 - 72.0 hour <br>@Temperature 77.0 °F	Complete Cure Cycle
Northstar Polymers GK-22 Polyurethane Gel for Adhesion Pad Applications GK-22 is a polyurethane gel formulation designed to make soft sticky polyurethane gel for pressure-sensitive-adhesive type products. This 2-part cast urethane system can be manually processed easi..
Cure Time	2880 - 4320 min <br>@Temperature 23.9 °C	48.0 - 72.0 hour <br>@Temperature 75.0 °F
Master Bond EP21ANHT Two Component, Room Temperature Curing Epoxy Adhesive Product Description: Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that combines high thermal conductivity and electrical insulation ..
Cure Time	2880 - 4320 min <br>@Temperature 23.9 °C	48.0 - 72.0 hour <br>@Temperature 75.0 °F
Master Bond EP21AOLV-1 Two Part, Room Temperature Curing Epoxy System Product Description: Master Bond Polymer Adhesive EP21AOLV-1 is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant and coating. This versatile system will adhere t..
Cure Time	2880 - 4320 min <br>@Temperature 23.9 °C	48.0 - 72.0 hour <br>@Temperature 75.0 °F
Master Bond EP21HTND High Temperature Resistant, Non-Drip Epoxy Compound Description: Master Bond EP21HTND is a two component, room temperature curing epoxy adhesive, sealant and coating with a paste viscosity and non-drip application feature. Its features are easy handl..
Cure Time	2880 - 4320 min <br>@Temperature 23.9 °C	48.0 - 72.0 hour <br>@Temperature 75.0 °F
Master Bond EP21LV-LO Two Component, Lower Viscosity, Room Temperature Curing Epoxy System Product Description: Master Bond EP21LV-LO is a two component, lower viscosity, room temperature curing epoxy system for high performance bonding, sealing, coating and encapsulation. This user frien..
Cure Time	2880 - 4320 min <br>@Temperature 23.9 °C	48.0 - 72.0 hour <br>@Temperature 75.0 °F
Master Bond EP21NDFG Two component epoxy compound for high performance applications Product Description: Master Bond EP21NDFG is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties, easy processing and a non-drip, paste-like consistency..
Cure Time	2880 - 4320 min <br>@Temperature 23.9 °C	48.0 - 72.0 hour <br>@Temperature 75.0 °F
Master Bond EP21TDCHTND Versatile, toughened two component epoxy for bonding, sealing and coating Product Description: Master Bond EP21TDCHTND is a two component epoxy adhesive, sealant and coating featuring high performance, versatility and exceptional user friendliness. It has a very forgiving..
Cure Time	2880 - 4320 min <br>@Temperature 23.9 °C	48.0 - 72.0 hour <br>@Temperature 75.0 °F
Master Bond EP30AN-1 Low Viscosity, NASA Low Outgassing Epoxy Description: Master Bond EP30AN-1 is a two part epoxy for high performance potting, sealing, coating and bonding featuring high thermal conductivity, excellent electrical insulation properties and N..
Cure Time	2880 - 4320 min <br>@Temperature 23.9 °C	48.0 - 72.0 hour <br>@Temperature 75.0 °F
Master Bond EP37-3FLFAN Electrically Isolating, Flexible Epoxy Description: Master Bond Polymer System EP37-3FLFAN is a two component system for high performance potting, bonding, sealing and coating that is formulated to cure at room temperature or more rapidl..
Cure Time	2880 - 4320 min <br>@Temperature 23.9 °C	48.0 - 72.0 hour <br>@Temperature 75.0 °F
Master Bond EP42HT-2Med Epoxy Meets USP Class VI Requirements Description: Master Bond Polymer System EP42HT-2Med is a room temperature curable two component epoxy, adhesive, sealant, coating and casting material featuring high temperature resistance along wit..
Cure Time	2880 - 4320 min <br>@Temperature 23.9 °C	48.0 - 72.0 hour <br>@Temperature 75.0 °F
Master Bond EP42HT-2ND-2Med Heat Resistant, Medical Grade Non-Drip Epoxy Master Bond Polymer System EP42HT-2ND2MED (Black) is a room temperature curable two component epoxy adhesive and sealant featuring high temperature resistance along with outstanding chemical resista..
Cure Time	2880 - 4320 min <br>@Temperature 23.9 °C	48.0 - 72.0 hour <br>@Temperature 75.0 °F
Master Bond MasterSil 153Med Silicone Paste for Medical Applications Description: Master Bond MasterSil 153Med is a two component silicone compound with a paste consistency for high performance bonding and sealing. It can be used for medical device applications as it..
Cure Time	2880 - 4320 min <br>@Temperature 23.9 °C	48.0 - 72.0 hour <br>@Temperature 75.0 °F
Master Bond EP21FRNS-2 Two Component, Flame Resistant Epoxy System Master Bond Polymer System EP21FRNS-2 is a two component, room temperature curing, flame retardant compound for potting, encapsulating and casting. Particularly noteworthy are its low smoke generati..
Cure Time	2880 - 4320 min <br>@Temperature 23.0 °C	48.0 - 72.0 hour <br>@Temperature 73.4 °F
Master Bond EP30M3LV Electrically Insulative, Low Viscosity Two Component Epoxy Master Bond Polymer System EP30M3LV is a lower viscosity, two component epoxy system for high performance bonding, sealing and encapsulation. It is formulated to cure at ambient temperatures or mor..
Cure Time	2880 - 4320 min <br>@Temperature 23.9 °C	48.0 - 72.0 hour <br>@Temperature 75.0 °F
Master Bond EP33ND Epoxy Paste Resists Harsh Chemicals Description: Master Bond EP33ND is a two part, room temperature curing epoxy system used for bonding, sealing and coating featuring high temperature resistance, good dimensional stability and very g..
Cure Time	2880 - 4320 min <br>@Temperature 23.9 °C	48.0 - 72.0 hour <br>@Temperature 75.0 °F
Master Bond EP42-2LV Epoxy Resists Heat and Chemicals Description: Master Bond Polymer System EP42-2LV is a low viscosity room temperature curable two component epoxy, adhesive, sealant, coating and casting material featuring outstanding chemical resis..
Cure Time	2880 - 4320 min <br>@Temperature 23.9 °C	48.0 - 72.0 hour <br>@Temperature 75.0 °F
Master Bond EP42HT-2 Epoxy Adhesive Resists Sterilization Description: Master Bond Polymer System EP42HT-2 is a room temperature curable, two component epoxy adhesive, sealant, coating and casting material featuring high temperature resistance along with o..
Cure Time	1440 - 4320 min <br>@Temperature 25.0 °C	24.0 - 72.0 hour <br>@Temperature 77.0 °F
Tra-Con Tra-Bond 2143D Medium Viscosity Polyamide Epoxy Adhesive TRA-BOND 2143D is a medium viscosity adhesive recommended for industrial bonding and sealing applications where toughness, impact resistance, and superior mechanical properties are required. This tw..
Cure Time	1440 - 4320 min <br>@Temperature 25.0 °C	24.0 - 72.0 hour <br>@Temperature 77.0 °F
Resinlab® EP1200 Black Casting Resin Resinlab™ EP1200 Black is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity, flexibility and a low CTE. It meets the re..
Cure Time	1440 - 4320 min <br>@Temperature 25.0 °C	24.0 - 72.0 hour <br>@Temperature 77.0 °F
Resinlab® EP1200LV Casting Resin Resinlab™ EP1200LV a low viscosity version of EP1200, a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity, flexibility an..
Cure Time	2880 - 4320 min <br>@Temperature 23.9 °C	48.0 - 72.0 hour <br>@Temperature 75.0 °F
Master Bond EP21TDC-2LO Two component, highly flexibilized epoxy resin compound Product Description: Master Bond Polymer System EP21TDC-2LO is a two component, highly flexible epoxy resin compound for high performance bonding, sealing, coating, and encapsulation. It is formulat..