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Polymer Property : Cure Time = 90.0 min Product List
Processing PropertiesTips: 30 items are displayed at most.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time |
90.0
min @Temperature 121 °C |
1.50
hour @Temperature 250 °F |
|
|
Henkel Hysol MA 562S Core Splice Adhesive
Modified epoxy foaming adhesive that may be cured at 250°F / 121°C or 350°F / 177°C. Nonmetallic, medium tack, excellent slump resistance.
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| Cure Time |
90.0
min @Temperature 121 °C |
1.50
hour @Temperature 250 °F |
|
|
Henkel Hysol PL 777-1FR Film Adhesive
Flame retardant, nonmetallic modified epoxy film adhesiveApplications: Metal and Honeycomb Bonding
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|||
| Cure Time |
90.0
-
120
min @Temperature 121 °C |
1.50
-
2.00
hour @Temperature 250 °F |
|
|
Henkel Hysol PL 7000 Film Adhesive
Epoxy film adhesive formulated to provide excellent performance properties in composite bonding, and has excellent results on composite surfaces that have been exposed to bond shop environments and ..
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| Cure Time |
90.0
min @Temperature 121 °C |
1.50
hour @Temperature 250 °F |
|
|
Henkel Hysol PL 795SF Composite Surfacing Film
Modified epoxy film specifically formulated to improve the surface appearance of composite honeycomb structures. Excellent surface appearance; reduced pinholing, extra finishing. Superior out-time. ..
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| Cure Time |
90.0
-
120
min @Temperature 149 °C |
1.50
-
2.00
hour @Temperature 300 °F |
|
|
Master Bond EP17HT-LO One component epoxy system for bonding, sealing, coating and casting
Product Description: Master Bond EP17HT-LO is a one component, heat cured epoxy system for bonding, sealing, coating and encapsulating. It features good physical properties, electrical insulation pr..
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| Cure Time |
90.0
min @Temperature 80.0 °C |
1.50
hour @Temperature 176 °F |
|
|
Tra-Con Tra-Duct 29121 Snap Cure Conductive Silver Epoxy Adhesive
TRA-DUCT 29121 is 100% solids, two component silver filled epoxy designed for chip bonding in microelectronic and optoelectronic applications. TRA-DUCT 29121 is a soft, smooth paste. This two-part f..
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| Cure Time |
90.0
min @Temperature 100 °C |
1.50
hour @Temperature 212 °F |
|
|
Trelleborg Emerson & Cuming Eccobond® G 909 One-Component Fast Cure Epoxy Adhesive
Emerson & Cuming G 909 Eccobond® One-Component Fast Cure Epoxy AdhesiveHigh strength, thixotropic, flexible, epoxy adhesive. High peel strength (30 pli). Recommended for bonding copper, aluminum an..
|
|||
| Cure Time |
90.0
min @Temperature 95.0 °C |
1.50
hour @Temperature 203 °F |
|
|
Tra-Con Tra-Bond 293-1T General Purpose Instrument Epoxy Adhesive-Thixotropic
TRA-BOND 293-1T general purpose epoxy adhesive is designed to provide strong, semi-rigid bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper, and brass. This ver..
|
|||
| Cure Time |
90.0
min @Temperature 120 °C |
1.50
hour @Temperature 248 °F |
|
|
Trelleborg Emerson & Cuming Eccobond® 2780-45 One-Component High Temperature Performance Epoxy Adhesive
Emerson & Cuming 2780-45 Eccobond® One-Component High Temperature Performance Epoxy AdhesiveFilled, pourable, high temperature resistant, epoxy adhesive. Long term resistance to boiling glycol. Exc..
|
|||
| Cure Time |
90.0
min @Temperature 125 °C |
1.50
hour @Temperature 257 °F |
|
|
Trelleborg Emerson & Cuming Eccobond® C429-2 One-Component Silver Filled Electrically Conductive Epoxy Adhesive
Emerson & Cuming C429-2 Eccobond® One-Component Silver Filled Electrically Conductive Epoxy AdhesiveOne component, high strength, moderate cost, silver filled, electrically conductive, epoxy adhesi..
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|||
| Cure Time |
90.0
min @Temperature 43.0 °C |
1.50
hour @Temperature 109 °F |
Light Load |
|
Chesterton ARC 858 Abrasion resistant rebuilding and faring composite
An advanced ceramic composite for the repair and protection of all metal surfaces subjected to erosion, corrosion and chemical attack. It is normally applied at a thickness of 0.15 mm (60 mils) or m..
|
|||
| Cure Time |
90.0
min @Temperature 43.0 °C |
1.50
hour @Temperature 109 °F |
Light Load |
|
Chesterton ARC I BX1 Impact & Wear Resistant Epoxy Composite
Description: An advanced grade epoxy and urethane composite for the repair and protection of all metal surfaces subjected to severe abrasion and impact. It is normally applied at a thickness of 6 mm..
|
|||
| Cure Time |
90.0
min @Temperature 21.0 °C |
1.50
hour @Temperature 69.8 °F |
Light Load |
|
Chesterton ARC NVE SYSTEM Vinyl Ester Lining
Description: ARC NVE is a high performance, quartz reinforced, three-component, modified novolac vinyl ester lining capable of being applied to horizontal and vertical surfaces. The NVE system kit i..
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|||
| Cure Time |
90.0
min @Temperature 80.0 °C |
1.50
hour @Temperature 176 °F |
Minimum Bond Line |
|
Epoxy Technology EPO-TEK® 375 High Temperature Epoxy
Product Description: EPO-TEK®375 is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. Also available in a single component frozen sy..
|
|||
| Cure Time |
90.0
min @Temperature 80.0 °C |
1.50
hour @Temperature 176 °F |
Minimum Bond Line |
|
Epoxy Technology EPO-TEK® H20E-8 Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H20E-8 is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a higher viscos..
|
|||
| Cure Time |
90.0
min @Temperature 165 °C |
1.50
hour @Temperature 329 °F |
Minimum Bond Line |
|
Epoxy Technology EPO-TEK® H35-175MP Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H35-175MP is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-elec..
|
|||
| Cure Time |
90.0
min @Temperature 165 °C |
1.50
hour @Temperature 329 °F |
Minimum Bond Line |
|
Epoxy Technology EPO-TEK® H35-175MPLV Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H35-175MPLV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-el..
|
|||
| Cure Time |
90.0
min @Temperature 165 °C |
1.50
hour @Temperature 329 °F |
Minimum Bond Line |
|
Epoxy Technology EPO-TEK® H35-175MPT Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H35MPT is a single component, silver-filled, electrically conductive epoxy designed for military hybrid die and component attach. High viscosity version of EPO-TEK® H..
|
|||
| Cure Time |
90.0
min @Temperature 43.0 °C |
1.50
hour @Temperature 109 °F |
Light Load |
|
Chesterton ARC MX2 High Wear Fine Particle Wear Compound
Description: An advanced ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion and chemical attack. It is applied at a thickness of 3 mm (1/8”..
|
|||
| Cure Time |
90.0
min @Temperature 165 °C |
1.50
hour @Temperature 329 °F |
Minimum Bond Line |
|
Epoxy Technology EPO-TEK® E3035 Electrically Conductive Adhesive
Product Description: EPO-TEK® E3035 is a single component, silver-filled epoxy for hybrid die and component attach.Advantages & Application Notes: Performs exceptionally well as a die attach for sm..
|
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| Cure Time |
90.0
min @Temperature 180 °C |
1.50
hour @Temperature 356 °F |
|
|
Atom Adhesives AA-DUCT AD1 Epoxy Adhesive
AA-DUCT AD1 is a single component epoxy, formulated with pure silver power combined with organic binders and solvents to produce electrically conductive paths, films or patterns over non-conductive ..
|
|||
| Cure Time |
90.0
min @Temperature 121 °C |
1.50
hour @Temperature 250 °F |
|
|
Henkel Hysol MA 562 Core Splice Adhesive
General-purpose 250°F / 121°C or 350°F / 177°C curing foaming adhesive. Designed for service temperatures from -67°F / -55°C to 350°F / 177°C. Medium tack, nonmetallic, low exotherm properti..
|
|||
| Cure Time |
90.0
min @Temperature 121 °C |
1.50
hour @Temperature 250 °F |
|
|
Henkel Hysol PL 795 Film Adhesive
Epoxy film adhesive designed for composite bonding applications. May cure at 250°F / 121°C or 350°F / 177°C, with service temperatures up to 350°F / 177°C. Ideal for co-cure or secondary bondi..
|
|||
| Cure Time |
90.0
min @Temperature 21.0 °C |
1.50
hour @Temperature 69.8 °F |
Light Load |
|
Chesterton ARC NVE VC Vinyl Ester Sealer
Description: ARC NVE VC (Veil Coat) is a two-component, modified epoxy novolac vinyl ester sealer coat formulated for application by brush, roller or spray at 0.15-0.25 mm (0.07-0.010”) wet film th..
|
|||
| Cure Time |
90.0
min @Temperature 121 °C |
1.50
hour @Temperature 250 °F |
|
|
Henkel Hysol PL 460 Core Splice Adhesive
Foaming epoxy adhesive in paste form for easy extrusion through packaged cartridges. Expands and cures at temperatures from 250°F / 121°C to 350°F / 177°C. Qualified to Boeing BMS 5-90, Type IV...
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