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Polymer Property : Mold Temperature = 190 °C Product List
Processing PropertiesTips: 30 items are displayed at most.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Mold Temperature | 180 - 190 °C | 356 - 374 °F | |
|
LATI LARPEEK 10 K/20 20% Carbon Fiber Reinforced Polyetheretherketone (PEEK)
(Unverified Data**)
Larpeek polyetheretherketone (PEEK) is a high performance thermoplastic offering cost effective performance in difficult environments across all industries. PEEK is temperature resistant (up to 250°..
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| Mold Temperature | 180 - 190 °C | 356 - 374 °F | |
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LATI LARPEEK 10 K/30 30% Carbon Fiber Reinforced Polyetheretherketone (PEEK)
(Unverified Data**)
Larpeek polyetheretherketone (PEEK) is a high performance thermoplastic offering cost effective performance in difficult environments across all industries. PEEK is temperature resistant (up to 250°..
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| Mold Temperature | 180 - 190 °C | 356 - 374 °F | |
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LATI LARPEEK 50 G/40 40% Glass Reinforced Polyetheretherketone (PEEK)
(discontinued **)
Larpeek polyetheretherketone (PEEK) is a high performance thermoplastic offering cost effective performance in difficult environments across all industries. PEEK is temperature resistant (up to 250°..
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| Mold Temperature | 180 - 190 °C | 356 - 374 °F | |
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LATI LARPEEK 50 K/30 30% Carbon Fiber Reinforced Polyetheretherketone (PEEK)
(Unverified Data**)
Larpeek polyetheretherketone (PEEK) is a high performance thermoplastic offering cost effective performance in difficult environments across all industries. PEEK is temperature resistant (up to 250°..
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| Mold Temperature | 180 - 190 °C | 356 - 374 °F | |
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LATI LATILUB 88/50-30GRT PEEK Based, 30% Graphite and PTFE Self Lubricating Plastic
(Unverified Data**)&l
Latilub self-lubricating plastic materials are designed to replace metals in applications such as gears, bushings, cams, slides, etc., for which, besides their intrinsic properties (moldability, low..
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| Mold Temperature | 170 - 190 °C | 338 - 374 °F | |
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Raschig Group 3572 Epoxy
Glass-fiber reinforced epoxy molding compound. Good mechanical strength and electrical strength, enhanced elasticity for ensuring good sealing under extreme heat and/or humidity, good chemical resis..
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| Mold Temperature | 170 - 190 °C | 338 - 374 °F | Injection molding |
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Hexion Bakelite™ EP 8414 Epoxy Resin, High Arc Resistance, Improved Electrical Properties, Low Shrinkage
(dis
Epoxy molding compound, inorganically filled, glass fiber reinforced, highly heat resistant, good electrical even at higher temperatures, very slight post shrinkage, increased media resistance, UL l..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
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Hexion Bakelite™ PF 31.5 Phenolic Formaldehyde Resin, Improved Electrical Properties
(discontinued **)
Phenolic molding compound, mainly organically filled, electrically high grade, standardized molding compound.Application areas: Parts for electrical and telecommunications technology, car electronic..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
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Hexion Bakelite™ PF 31.9 Phenolic Formaldehyde Resin, Ammonia Free
(discontinued **)
Phenolic molding compound, mainly organically filled, ammonia free, standardized molding compound.Application areas: Parts for electrical and telecommunications technology, motor vehicle ignition sy..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
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Hexion Bakelite™ PF 51 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets
(discontinued **)
Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Contact support power switch, switch..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
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Hexion Bakelite™ PF 84 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets, High Mechanical Strength
&
Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Contact support power switch, moldin..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
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Hexion Bakelite™ PF 2137 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof
(discontinued **
Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, minimal distortion, dish washer proof.Application areas: Iron heat shields, fittings f..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
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Hexion Bakelite™ PF 2400 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof, UL Listed
(disc
Phenolic molding compound, inorganically/organically filled, average heat resistance, increased dimensional stability, dish washer proof, UL listed molding compound 1.5 mm/V-0 (ALL).Application area..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
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Hexion Bakelite™ PF 2535 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof
(discontinued **
Phenolic molding compound, inorganically/organically filled, average heat resistant, steam resistant, dish washer proof, high surface quality.Application areas: Fittings for ovens and dishwashers, t..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
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Hexion Bakelite™ PF 2736 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed
&nbs
Phenolic molding compound, inorganically/organically filled, increased tracking resistance, UL listed molding compound 0.46 mm/V-0 (BK, Suffix "H"), 0.81 mm/V-0 (NC, GN, BK), 1.5 mm/V-0 (ALL).Applic..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
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Hexion Bakelite™ PF 7592 Phenolic Formaldehyde Resin, Galvanized, Conductive
(discontinued **)
Phenolic molding compound, inorganically/organically filled. Shrinkage fies compatible to values of UP 3310 and PF 2560. Electroplateable.Application areas: Chromium plated oven strips.Information..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
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Hexion Bakelite™ PF 7592 Phenolic Formaldehyde Resin, Galvanized, Conductive
(discontinued **)
Phenolic molding compound, inorganically/organically filled. Shrinkage fies compatible to values of UP 3310 and PF 2560. Electroplateable.Application areas: Chromium plated oven strips.Information..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
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Hexion Bakelite™ PF 12404 Phenolic Formaldehyde Resin, High Surface Quality, Low Shrinkage
(discontinued **)&
Phenolic molding compound, inorganically/organically filled, good dimensional stability, low shrinkage.Application areas: Housing parts for gas meter.Information provided by Bak AGBak AG became a pa..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
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Hexion Bakelite™ 151733 Phenolic Formaldehyde Resin
(discontinued **)
Phenolic molding compound, mainly organically filled, standard molding compound for normal stress.Application areas: Contact strips.Information provided by Bak AGBak AG became a part of Hexion in 20..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
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Hexion Bakelite™ 151733 Phenolic Formaldehyde Resin
(discontinued **)
Phenolic molding compound, mainly organically filled, standard molding compound for normal stress.Application areas: Contact strips.Information provided by Bak AGBak AG became a part of Hexion in 20..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
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Hexion Bakelite™ X30 Phenolic Formaldehyde Resin
(discontinued **)
Phenolic molding compound, reinforced with cotton and sisal fibers, increased notched impact strength.Application areas: Covers for electrical and electromagnetic devices.Information provided by Bak..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
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Hexion Bakelite™ X30 Phenolic Formaldehyde Resin
(discontinued **)
Phenolic molding compound, reinforced with cotton and sisal fibers, increased notched impact strength.Application areas: Covers for electrical and electromagnetic devices.Information provided by Bak..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
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Hexion Bakelite™ X65 Phenolic Formaldehyde Resin, UL Listed
(discontinued **)
Phenolic molding compound, inorganically/organically filled, good heat-resistance and dimensional stability, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Oven strips.Information..
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| Mold Temperature | 180 - 190 °C | 356 - 374 °F | |
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LATI Laticonther 88/10 GR/50 PEEK, 50% Graphite Reinforced
High thermal conductivity product based on Polyetheretherketone (PEEK). Graphite. Availability: Africa & Middle East; Asia Pacific; Europe; Latin America; North AmericaInformation provided by Lati I..
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| Mold Temperature | 150 - 190 °C | 302 - 374 °F | Injection molding |
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BASF Ultrason E 2010 G4 20% Glass Filled PES
Ultrason E 2010 G4 is a 20% glass reinforced, medium viscosity injection molding PES grade with high rigidity and strength.
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| Mold Temperature | 135 - 190 °C | 275 - 374 °F | Average value: 157 °C Grade Count:17 |
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Overview of materials for Polyethersulfone (PES), 30% Glass Fiber Filled
This property data is a summary of similar materials in the MatWeb database for the category "Polyethersulfone (PES), 30% Glass Fiber Filled". Specific grades with glass content between 25% and 34% ..
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| Mold Temperature | 170 - 190 °C | 338 - 374 °F | |
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Raschig Group 5557 DAP
(discontinued **)
Glass fiber-reinforced and inorganically filled diallylphthalate molding compound (DAP) in various colors. Good mechanical strength together with retention of high electrical properties under hot h..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
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Hexion Bakelite™ PF 4041 Phenolic Formaldehyde Resin, Resistant to High Temperatures
(discontinued **)
Phenolic molding compound, glass fiber reinforced and inorganically filled, elasticized. Very good heat resistance, very good mechanical properties, reduced mold shrinkage and post-shrinkage, good ..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
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Hexion Bakelite™ PF 8052 Phenolic Formaldehyde Resin, Resistant to High Temperatures
(discontinued **)
Phenolic molding compound, glass fiber reinforced and inorganically filled. Excellent heat resistance with respect to surface finish and mechanical properties.Application areas: Pan handles, heat r..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
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Hexion Bakelite™ PF 4155 Phenolic Formaldehyde Resin, Resistant to High Temperatures, Improved Electrical Properties, Low Shrinkage, High Mechanical Strength
Phenolic molding compound, inorganically filled, glass fiber reinforced, good media and temperature resistance. Conditioned Cu-adhesion.Application areas: Commutators (fuel pumps, actuators, starte..
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