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Polymer Property : Mold Temperature = 320 °F Product List
Processing PropertiesTips: 30 items are displayed at most.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Mold Temperature | 160 - 188 °C | 320 - 370 °F | |
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PolyOne Dynalloy™ OBC8200-BT50 Thermoplastic Elastomer (TPE)
Dynalloy™ OBC8200-BT50 is a translucent grade to be used in blow molding applications. New Product. Commercial specifications have not been established. - Excellent Colorability - Rubbery FeelPurge..
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| Mold Temperature | >= 160 °C | >= 320 °F | |
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Solvay Specialty Polymers Supradel® HTS-2401 High Temperature Sulfone Resin
(discontinued **)
Supradel HTS-2401 is a high-temperature high-performance amorphous sulfone polymer designed for use in reinforced high temperature thermoplastic formulations. With its glass transition temperature o..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
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Hexion Bakelite™ PF 31.5 Phenolic Formaldehyde Resin, Improved Electrical Properties
(discontinued **)
Phenolic molding compound, mainly organically filled, electrically high grade, standardized molding compound.Application areas: Parts for electrical and telecommunications technology, car electronic..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
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Hexion Bakelite™ PF 31.9 Phenolic Formaldehyde Resin, Ammonia Free
(discontinued **)
Phenolic molding compound, mainly organically filled, ammonia free, standardized molding compound.Application areas: Parts for electrical and telecommunications technology, motor vehicle ignition sy..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
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Hexion Bakelite™ PF 84 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets, High Mechanical Strength
&
Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Contact support power switch, moldin..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
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Hexion Bakelite™ PF 1107 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to High Temperatures
(disconti
Phenolic molding compound, inorganically filled, glass fiber reinforced, high heat resistance, low heat expansion coefficient, highest resistance to pressure, high dimensional stability.Application ..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
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Hexion Bakelite™ PF 2137 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof
(discontinued **
Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, minimal distortion, dish washer proof.Application areas: Iron heat shields, fittings f..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
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Hexion Bakelite™ PF 2400 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof, UL Listed
(disc
Phenolic molding compound, inorganically/organically filled, average heat resistance, increased dimensional stability, dish washer proof, UL listed molding compound 1.5 mm/V-0 (ALL).Application area..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
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Hexion Bakelite™ PF 2736 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed
&nbs
Phenolic molding compound, inorganically/organically filled, increased tracking resistance, UL listed molding compound 0.46 mm/V-0 (BK, Suffix "H"), 0.81 mm/V-0 (NC, GN, BK), 1.5 mm/V-0 (ALL).Applic..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
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Hexion Bakelite™ PF 2736 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed
&nbs
Phenolic molding compound, inorganically/organically filled, increased tracking resistance, UL listed molding compound 0.46 mm/V-0 (BK, Suffix "H"), 0.81 mm/V-0 (NC, GN, BK), 1.5 mm/V-0 (ALL).Applic..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
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Hexion Bakelite™ PF 14694 Phenolic Formaldehyde Resin, High Surface Quality
(discontinued **)
Phenolic molding compound, mainly organically filled, very soft flow for large molds.Application areas: Housing parts, heat shields, cookware fittings.Information provided by Bak AGBak AG became a p..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
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Hexion Bakelite™ 460124 Phenolic Formaldehyde Resin
(discontinued **)
Phenolic molding compound, mainly organically filled, standard molding compound for normal stress.Application areas: Cookware fittings, electric devices.Information provided by Bak AGBak AG became a..
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| Mold Temperature | 160 - 200 °C | 320 - 392 °F | |
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Lehmann & Voss LUVOCOM® 2205-7054 Blend based on polyaryl ether ketone, with glass fiber
Applications: High dimensionally stable precision parts, high continuous use temperature.Especially suitable for medical parts, superheated steam sterilizable, hydrolysis resistanceChemical and hydr..
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| Mold Temperature | 160 °C | 320 °F | |
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Solvay Specialty Polymers Amodel® DW-1140 Polyphthalamide (PPA), 40% Glass Fiber
Amodel® DW-1140 is a 40% glass-fiber-reinforced resin designed for high strength and stiffness and improved hydrolytic stability. This material has low moisture absorption and a low coefficient o..
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| Mold Temperature | 160 °C | 320 °F | |
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Solvay Specialty Polymers Amodel® DW-1150 Polyphthalamide (PPA), 50% Glass Fiber
Amodel® DW-1150 is a 50% glass-fiber-reinforced resin designed for high strength and stiffness and improved hydrolytic stability. This material has low moisture absorption and a low coefficient o..
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| Mold Temperature | 160 °C | 320 °F | |
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Solvay Specialty Polymers Amodel® FC-1140 Polyphthalamide (PPA), 40% Glass Fiber
Amodel® FC-1140 is an FDA-approved, 40% glass fiber reinforced resin designed for high strength and stiffness. This combines with its excellent thermal properties, low water absorption and good h..
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| Mold Temperature | 160 - 180 °C | 320 - 356 °F | |
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Amity Thermosets ATF 197 Phenolic Molding Inorganic and glass Filler, Compression Molded
Characteristics:Flame retardantSpark resistant Good electrical insulationHeat stability ( 200°C )Good mouldability Low water absorptionLow shrinkageColor-blackSoft/medium flow Applications:Switchg..
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| Mold Temperature | 160 - 180 °C | 320 - 356 °F | |
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Amity Thermosets ATO 142 Phenolic Molding Organic Filler, Compression Molded
Characteristics:Electrical low loss Good mechanical strengthHigh electrical insulationGood mechanical strengthGlossy surfaceLow water absorptionColor-black, brownMedium/hard flow Applications: Elec..
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| Mold Temperature | 160 - 180 °C | 320 - 356 °F | |
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Amity Thermosets ATO 176 Phenolic Molding Organic and inorganic Filler, Compression Molded
Characteristics:Heat resistant ( asbestos free )Good electric insulationLow shrinkageLow water absorptionMedium mechanical strengthNot suitable for high mechanical tensionColor-blackMedium flow App..
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| Mold Temperature | 160 - 180 °C | 320 - 356 °F | |
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Amity Thermosets ATS 1612 Phenolic Molding Nylon, inorganic, and glass Filler, Compression Molded
Characteristics:High dielectric & mechanical strengthWeather resistant Good electric insulationLow water absorption Good mechanical tension bearing capacityColor-blackSoft/Medium flow Applications:R..
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| Mold Temperature | 160 - 180 °C | 320 - 356 °F | |
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Amity Thermosets ATS 751 Phenolic Molding Inorganic and glass fiber Filler, Compression Molded
Characteristics:High impact strength Dimensional stabilityHigh mechanical strengthHeat stability ( 200°C )Good media resistance ( eg. Oil, water ) Low shrinkageGood electrical resistanceColor-brown..
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| Mold Temperature | 160 °C | 320 °F | Optimal |
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BASF Ultrason® E 2010 SW Q31 10088 PESU
Information provided by BASF
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| Mold Temperature | 160 - 180 °C | 320 - 356 °F | |
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Amity Thermosets ATI 102 Phenolic Molding Organic Filler, Injection Molded
Characteristics:Electrical low loss Good mechanical strengthHigh electrical insulationGood mechanical strengthGlossy surfaceLow water absorptionColor-blackVery soft flow Applications: Electric swit..
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| Mold Temperature | 160 - 180 °C | 320 - 356 °F | |
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Amity Thermosets ATO 1510 Phenolic Molding Glass fiber Filler, Compression Molded
Characteristics:Shock resistantElectrical low lossHigh mechanical strengthHeat stableHigh electrical insulationDimensional stabilityGood mechanical tension bearing strengthMedium copper adhesionColo..
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| Mold Temperature | 160 - 180 °C | 320 - 356 °F | |
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Amity Thermosets ATS 157 Phenolic Molding Long glass fiber Filler, Compression Molded
Characteristics:Shock resistant ( High impact strength )Very good mechanical strengthGood dielectric strengthLow water absorptionLow shrinkageColor-pale brown, black, dark brown, green etc.Medium/st..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
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Hexion Bakelite™ EP 8412 Epoxy Resin, High Arc Resistance, Improved Electrical Properties, Low Shrinkage
Epoxy molding compound, inorganically filled, glass fiber reinforced, heat resistant, dimensionally stable, good electrical and mechanical properties, very good chemical resistance, low viscosity, U..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
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Hexion Bakelite™ PF 2874 Phenolic Formaldehyde Resin, Low Shrinkage, Improved Electrical Properties, UL Listed, High Mechanical Strength
Phenolic molding compound, inorganically filled, glass fiber reinforced, increased mechanical strength, increased temperature stability, low water absorption, good dimensional stability, UL listed m..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
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Hexion Bakelite™ PF 2874 Phenolic Formaldehyde Resin, Low Shrinkage, Improved Electrical Properties, UL Listed, High Mechanical Strength
Phenolic molding compound, inorganically filled, glass fiber reinforced, increased mechanical strength, increased temperature stability, low water absorption, good dimensional stability, UL listed m..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
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Hexion Bakelite™ PF 4111 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free, Copper Adhesive
Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, high mechanical strength, copper-adhesive,..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
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Hexion Bakelite™ PF 1142 Phenolic Formaldehyde Resin, High Mechanical Strength
(discontinued **)
Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability, good mechanical properties.Application areas: Insulating flanges, sealings, pulleys.Information p..
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