- HOME
- POLYMER SEARCH
- Polymer Property : Mold Temperature = 374 °F
Polymer Property : Mold Temperature = 374 °F Product List
Processing PropertiesTips: 30 items are displayed at most.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Mold Temperature | 180 - 190 °C | 356 - 374 °F | |
|
LATI LARPEEK 10 G/30 30% Glass Reinforced Polyetheretherketone (PEEK)
(Unverified Data**)
Larpeek polyetheretherketone (PEEK) is a high performance thermoplastic offering cost effective performance in difficult environments across all industries. PEEK is temperature resistant (up to 250°..
|
|||
| Mold Temperature | 180 - 190 °C | 356 - 374 °F | |
|
LATI LARPEEK 50 G/60 60% Glass Reinforced Polyetheretherketone (PEEK)
(discontinued **)
Larpeek polyetheretherketone (PEEK) is a high performance thermoplastic offering cost effective performance in difficult environments across all industries. PEEK is temperature resistant (up to 250°..
|
|||
| Mold Temperature | 180 - 190 °C | 356 - 374 °F | |
|
LATI LATILUB 88/50-30GRT PEEK Based, 30% Graphite and PTFE Self Lubricating Plastic
(Unverified Data**)&l
Latilub self-lubricating plastic materials are designed to replace metals in applications such as gears, bushings, cams, slides, etc., for which, besides their intrinsic properties (moldability, low..
|
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
|
Hexion Bakelite™ PF 31.9 Phenolic Formaldehyde Resin, Ammonia Free
(discontinued **)
Phenolic molding compound, mainly organically filled, ammonia free, standardized molding compound.Application areas: Parts for electrical and telecommunications technology, motor vehicle ignition sy..
|
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
|
Hexion Bakelite™ PF 1107 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to High Temperatures
(disconti
Phenolic molding compound, inorganically filled, glass fiber reinforced, high heat resistance, low heat expansion coefficient, highest resistance to pressure, high dimensional stability.Application ..
|
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
|
Hexion Bakelite™ PF 1141 Phenolic Formaldehyde Resin, High Surface Quality, Resistant to High Temperatures, Dishwasher Proof
Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, hot steam and hot water resistant (not suitable for use of higher voltage).Application..
|
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
|
Hexion Bakelite™ PF 2736 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed
&nbs
Phenolic molding compound, inorganically/organically filled, increased tracking resistance, UL listed molding compound 0.46 mm/V-0 (BK, Suffix "H"), 0.81 mm/V-0 (NC, GN, BK), 1.5 mm/V-0 (ALL).Applic..
|
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
|
Hexion Bakelite™ PF 2736 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed
&nbs
Phenolic molding compound, inorganically/organically filled, increased tracking resistance, UL listed molding compound 0.46 mm/V-0 (BK, Suffix "H"), 0.81 mm/V-0 (NC, GN, BK), 1.5 mm/V-0 (ALL).Applic..
|
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
|
Hexion Bakelite™ PF 6506 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to High Temperatures, UL Listed
&nbs
Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistant, UL listed molding compound 1.5 mm/V-..
|
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
|
Hexion Bakelite™ PF 6506 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to High Temperatures, UL Listed
&nbs
Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistant, UL listed molding compound 1.5 mm/V-..
|
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
|
Hexion Bakelite™ PF 6507 Phenolic Formaldehyde Resin, Elasticized, Low Shrinkage, Resistant to High Temperatures, High Mechanical Strength
Phenolic molding compound, inorganically filled, glass fiber reinforced, elastomer modified, galvanizable, heat resistant, good media resistance, high dimensional stability at raised temperature, hi..
|
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
|
Hexion Bakelite™ PF 7592 Phenolic Formaldehyde Resin, Galvanized, Conductive
(discontinued **)
Phenolic molding compound, inorganically/organically filled. Shrinkage fies compatible to values of UP 3310 and PF 2560. Electroplateable.Application areas: Chromium plated oven strips.Information..
|
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
|
Hexion Bakelite™ PF 12404 Phenolic Formaldehyde Resin, High Surface Quality, Low Shrinkage
(discontinued **)&
Phenolic molding compound, inorganically/organically filled, good dimensional stability, low shrinkage.Application areas: Housing parts for gas meter.Information provided by Bak AGBak AG became a pa..
|
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
|
Hexion Bakelite™ PF 13591 Phenolic Formaldehyde Resin, High Surface Quality, UL Listed
(discontinued **)
Phenolic molding compound, mainly organically filled, very soft flow for large molds, UL listed molding compound 1.5 mm/V-1 (BK), 3.0 mm/V-0 (BK).Application areas: Pan handles, various applications..
|
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
|
Hexion Bakelite™ PF 14694 Phenolic Formaldehyde Resin, High Surface Quality
(discontinued **)
Phenolic molding compound, mainly organically filled, very soft flow for large molds.Application areas: Housing parts, heat shields, cookware fittings.Information provided by Bak AGBak AG became a p..
|
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
|
Hexion Bakelite™ PF 14694 Phenolic Formaldehyde Resin, High Surface Quality
(discontinued **)
Phenolic molding compound, mainly organically filled, very soft flow for large molds.Application areas: Housing parts, heat shields, cookware fittings.Information provided by Bak AGBak AG became a p..
|
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
|
Hexion Bakelite™ X22 Phenolic Formaldehyde Resin, UL Listed
(discontinued **)
Phenolic molding compound, mainly organically filled, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Pot handles, operating controls, electrical isolators, housing parts.Informati..
|
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
|
Hexion Bakelite™ X30 Phenolic Formaldehyde Resin
(discontinued **)
Phenolic molding compound, reinforced with cotton and sisal fibers, increased notched impact strength.Application areas: Covers for electrical and electromagnetic devices.Information provided by Bak..
|
|||
| Mold Temperature | 150 - 190 °C | 302 - 374 °F | |
|
LATI Lapex R G/20 PPSU, 20% Glass Reinforced
Polyphenylene Sulfone (PPSU) based compound. Glass fibers. Low smoke density and low toxicity index. Very high dimensional stability.Availability: Africa & Middle East; Asia Pacific; Europe; Latin A..
|
|||
| Mold Temperature | 180 - 190 °C | 356 - 374 °F | |
|
LATI Latigray 88/10-01 CX/30 PEEK
Radiopaque compound based on Polyetheretherketone (PEEK). Special mineral filler. Availability: Africa & Middle East; Asia Pacific; Europe; Latin America; North AmericaInformation provided by Lati I..
|
|||
| Mold Temperature | 150 - 190 °C | 302 - 374 °F | |
|
LATI Latilub 85-10T G/30 PES, 30% Glass Fiber Reinforced, PTFE Filled
Self-lubricating product based on Polyether Sulfone (PES). PTFE. Glass fibers. Availability: Africa & Middle East; Asia Pacific; Europe; Latin America; North AmericaInformation provided by Lati Indu..
|
|||
| Mold Temperature | 135 - 190 °C | 275 - 374 °F | Average value: 157 °C Grade Count:17 |
|
Overview of materials for Polyethersulfone (PES), 30% Glass Fiber Filled
This property data is a summary of similar materials in the MatWeb database for the category "Polyethersulfone (PES), 30% Glass Fiber Filled". Specific grades with glass content between 25% and 34% ..
|
|||
| Mold Temperature | 170 - 190 °C | 338 - 374 °F | Injection molding |
|
Hexion Bakelite™ EP 8412 Epoxy Resin, High Arc Resistance, Improved Electrical Properties, Low Shrinkage
Epoxy molding compound, inorganically filled, glass fiber reinforced, heat resistant, dimensionally stable, good electrical and mechanical properties, very good chemical resistance, low viscosity, U..
|
|||
| Mold Temperature | 143 - 190 °C | 289 - 374 °F | Average value: 172 °C Grade Count:9 |
|
Overview of materials for Epoxy, Molded, Glass Fiber Filler
This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Molded, Glass Fiber Filler". Each property range of values reported is minimum and maximum values..
|
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
|
Hexion Bakelite™ PF 4010 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage
(disconti
Glass fiber reinforced and inorganically filled molding compound. High heat resistance, reduced molding shrinkage, good chemical resistance and mechanical properties.Application areas: Switch housi..
|
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
|
Hexion Bakelite™ PF 4111 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free, Copper Adhesive
Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, high mechanical strength, copper-adhesive,..
|
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
|
Hexion Bakelite™ PF 7595 Phenolic Formaldehyde Resin, Low Coefficient of Friction, Galvanized, Conductive
(di
Phenolic molding compound, inorganically/organically filled, modified with graphite, good heat conductivity, good sliding properties, conductive in electrical properties.Application areas: Bearers f..
|
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
|
Hexion Bakelite™ PF 1142 Phenolic Formaldehyde Resin, High Mechanical Strength
(discontinued **)
Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability, good mechanical properties.Application areas: Insulating flanges, sealings, pulleys.Information p..
|
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
|
Hexion Bakelite™ PF 2560 Phenolic Formaldehyde Resin, High Surface Quality, For Electrostatic Coating, UL Listed
&n
Phenolic molding compound, inorganically/organically filled, average heat resistant, high surface quality, lower water absorption than PF 31, minimal distortion, UL listed molding compound 1.5 mm/V-..
|
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
|
Hexion Bakelite™ PF 2836 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed
&nbs
Phenolic molding compound, inorganically/organically filled, increased heat resistance, increased tracking resistance, low shrinkage and post shrinkage, improved electrical properties, UL listed mol..
|
|||
Copyright © lookpolymers.com All Rights Reserved