Polymer Property : Cure Time = 0.00556 hour Product List

Processing Properties

Tips: 30 items are displayed at most.

Processing Properties	Metric	English	Comments
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	On Steel (Fixture)
ND Industries SuperGlue Ethyl 300 General DescriptionA medium to low viscosity cyanoacrylate which is used for bonding plastics and rubber in various combinations.Meets military spec Mil-A-46050C Type II Class II
Cure Time	0.333 - 1.00 min	0.00556 - 0.0167 hour	On Steel (Fixture)
ND Industries SuperGlue Ethyl 344 Medium viscosity, general purposeMeets military spec Mil-A-46050C Type II Class III
Cure Time	>= 0.333 min	>= 0.00556 hour	Fixture
Resinlab® CYNERGY CA6704 Adhesive Description: The CYNERGY 6700 SERIES are modified to provide greatly reduced odor and a further reduction of bloom or frosting of plastics when compared to the 6600 Series. These products are ideal ..
Cure Time	0.333 - 1.00 min	0.00556 - 0.0167 hour	With Excel 600392 primer (Fixture)
ND Industries 240 Structural Adhesive Excellent impact and solvent resistance
Cure Time	<= 0.333 min	<= 0.00556 hour	Buna N Rubber, handling time
Permabond 919 Cyanoacrylate, High temperature Features & Benefits: Rapid development of high strength; Ease of use – no mixing or heat cure; Bonds most materials; 100% reactive, no solvents.PERMABOND® 919 is an allyl cyanoacrylate adhesive. I..
Cure Time	<= 0.333 min	<= 0.00556 hour	Phenolic, handling time
Permabond 919 Cyanoacrylate, High temperature Features & Benefits: Rapid development of high strength; Ease of use – no mixing or heat cure; Bonds most materials; 100% reactive, no solvents.PERMABOND® 919 is an allyl cyanoacrylate adhesive. I..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 31.5 Phenolic Formaldehyde Resin, Improved Electrical Properties  (discontinued **) Phenolic molding compound, mainly organically filled, electrically high grade, standardized molding compound.Application areas: Parts for electrical and telecommunications technology, car electronic..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 31.9 Phenolic Formaldehyde Resin, Ammonia Free  (discontinued **) Phenolic molding compound, mainly organically filled, ammonia free, standardized molding compound.Application areas: Parts for electrical and telecommunications technology, motor vehicle ignition sy..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 2400 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof, UL Listed  (disc Phenolic molding compound, inorganically/organically filled, average heat resistance, increased dimensional stability, dish washer proof, UL listed molding compound 1.5 mm/V-0 (ALL).Application area..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 2535 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof  (discontinued ** Phenolic molding compound, inorganically/organically filled, average heat resistant, steam resistant, dish washer proof, high surface quality.Application areas: Fittings for ovens and dishwashers, t..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 2736 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed &nbs Phenolic molding compound, inorganically/organically filled, increased tracking resistance, UL listed molding compound 0.46 mm/V-0 (BK, Suffix "H"), 0.81 mm/V-0 (NC, GN, BK), 1.5 mm/V-0 (ALL).Applic..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 7592 Phenolic Formaldehyde Resin, Galvanized, Conductive  (discontinued **) Phenolic molding compound, inorganically/organically filled. Shrinkage fies compatible to values of UP 3310 and PF 2560. Electroplateable.Application areas: Chromium plated oven strips.Information..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 14600 Phenolic Formaldehyde Resin, High Surface Quality  (discontinued **) Phenolic molding compound, mainly organically filled, low specific gravity.Application areas: Cookware fittings, electric devices.Information provided by Bak AGBak AG became a part of Hexion in 2005..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ 151733 Phenolic Formaldehyde Resin  (discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress.Application areas: Contact strips.Information provided by Bak AGBak AG became a part of Hexion in 20..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ 460124 Phenolic Formaldehyde Resin  (discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress.Application areas: Cookware fittings, electric devices.Information provided by Bak AGBak AG became a..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ X22 Phenolic Formaldehyde Resin, UL Listed  (discontinued **) Phenolic molding compound, mainly organically filled, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Pot handles, operating controls, electrical isolators, housing parts.Informati..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ X24 Phenolic Formaldehyde Resin  (discontinued **) Phenolic molding compound, mainly organically filled.Application areas: Operating controls, housing parts, lamp holders.Information provided by Bak AGBak AG became a part of Hexion in 2005.
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion UP 802 Unsaturated Polyester Resin, High Surface Quality, Low Shrinkage, High Arc Resistance Polyester molding compound, inorganically filled, glass fiber reinforced, styrene free, high dimensional stability, very slight post shrinkage, good mechanical properties, increased electrical value..
Cure Time	0.333 min	0.00556 hour	Primary Cure is UV: Full Cure in 20-40 seconds @ 70 mW/cm^2. Secondary Cure is Moisture: Tack free in 2-6 hours, Full cure in 72 hours.
Loctite® Shadowcure™ 5293 Silicone Coating Conformal CoatingsConformal coatings are thin dielectric coatings that extend the longevity of circuit boards by protecting components and traces from corrosion, shorts, and mechanical damage. Locti..
Cure Time	0.333 - 0.500 min	0.00556 - 0.00833 hour	per mm
Amity Thermosets ATF 197 Phenolic Molding Inorganic and glass Filler, Compression Molded Characteristics:Flame retardantSpark resistant Good electrical insulationHeat stability ( 200°C )Good mouldability Low water absorptionLow shrinkageColor-blackSoft/medium flow Applications:Switchg..
Cure Time	0.333 - 0.417 min	0.00556 - 0.00694 hour	per mm
Amity Thermosets ATM 123 Phenolic Molding Organic Filler, Compression Molded Characteristics:Glossy surface free of filler marks Surface good & free of flaws Good mouldabilitySurface free of filler marks even after turningGood mechanical strengthColor-black, brownMedium flow..
Cure Time	0.333 - 0.417 min	0.00556 - 0.00694 hour	per mm
Amity Thermosets ATO 142 Phenolic Molding Organic Filler, Compression Molded Characteristics:Electrical low loss Good mechanical strengthHigh electrical insulationGood mechanical strengthGlossy surfaceLow water absorptionColor-black, brownMedium/hard flow Applications: Elec..
Cure Time	0.333 - 0.417 min	0.00556 - 0.00694 hour	per mm
Amity Thermosets ATG 116 Phenolic Molding Organic and inorganic Filler, Compression Molded Characteristics:Medium mechanical strength Medium electrical insulationGeneral purposeColor- BlackMedium flow Applications: Electrical accessories & fittings ( medium quality ) Domestic appliance ha..
Cure Time	0.333 - 0.500 min	0.00556 - 0.00833 hour	per mm
Amity Thermosets ATR 126 Phenolic Molding Organic Filler, Compression Molded Characteristics:Ammonia freeGood mouldabilityGood mechanical strengthGood electrical insulationGood surface finishMedium thermal stability Color-black, brownSoft/medium flow Applications:Telecommuni..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 2874 Phenolic Formaldehyde Resin, Low Shrinkage, Improved Electrical Properties, UL Listed, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, increased mechanical strength, increased temperature stability, low water absorption, good dimensional stability, UL listed m..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 4010 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage  (disconti Glass fiber reinforced and inorganically filled molding compound. High heat resistance, reduced molding shrinkage, good chemical resistance and mechanical properties.Application areas: Switch housi..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 4111 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free, Copper Adhesive Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, high mechanical strength, copper-adhesive,..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 7595 Phenolic Formaldehyde Resin, Low Coefficient of Friction, Galvanized, Conductive  (di Phenolic molding compound, inorganically/organically filled, modified with graphite, good heat conductivity, good sliding properties, conductive in electrical properties.Application areas: Bearers f..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 83 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets  (discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Switch covers, rolls, handle casings..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 2855 Phenolic Formaldehyde Resin, High Surface Quality, Low Shrinkage, For Electrostatic Coating, Dishwasher Proof, UL Listed Phenolic molding compound, inorganically/organically filled, heat resistant up to 250°C, hot steam and hot water resistant, high surface quality, for electrostatic coating, UL listed molding compou..