Polymer Property : Cure Time = 0.0111 hour Product List

Processing Properties

Tips: 30 items are displayed at most.

Processing Properties	Metric	English	Comments
Cure Time	0.250 - 0.667 min	0.00417 - 0.0111 hour	On Steel (Fixture)
ND Industries 301 Surface Insensitive Instant Superglue Low-medium viscosity for difficult to bond substrates
Cure Time	0.250 - 0.667 min	0.00417 - 0.0111 hour	On Steel (Fixture)
ND Industries 331 Surface Insensitive Instant Superglue Medium-high viscosity for difficult to bond surfaces
Cure Time	0.250 - 0.667 min	0.00417 - 0.0111 hour	On Steel (Fixture)
ND Industries 360 Surface Insensitive Instant Superglue General DescriptionA medium viscosity, general purpose cyanoacrylate which is also surface sensitive. Can handle a wide array of materials which include wood, cork, leather, stone and plastics, in ..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	On Steel (Fixture)
ND Industries SuperGlue Ethyl 300 General DescriptionA medium to low viscosity cyanoacrylate which is used for bonding plastics and rubber in various combinations.Meets military spec Mil-A-46050C Type II Class II
Cure Time	0.250 - 0.667 min	0.00417 - 0.0111 hour	On Steel (Fixture)
ND Industries SuperGlue Ethyl 314 General DescriptionA medium viscosity ethyl-based cyanoacrylate particularly suitable for rubbers and plastics. It is fast acting and may be fillet cured using ND Excel Accelerators.rubber O-rings,..
Cure Time	0.250 - 0.667 min	0.00417 - 0.0111 hour	On Steel (Fixture)
ND Industries SuperGlue Ethyl 325 Low-Medium Viscosity - General purposeMeets military spec Mil-A-46050C Type II Class I
Cure Time	0.250 - 0.667 min	0.00417 - 0.0111 hour	On Steel (Fixture)
ND Industries SuperGlue Ethyl 395 General DescriptionA low viscosity ethyl-based cyanoacrylate that exhibits fast cure speeds on a wide range of common materials such as metals, rubbers, and plastics.Typical Usesloudspeaker componen..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 13 Phenolic Formaldehyde Resin, UL Listed  (discontinued **) Phenolic molding compound, inorganically mica filled, heat resistance, good electrical properties, UL listed molding compound 0.75 mm/V-1 (NC), 3 mm/V-0, standardized molding compound.Application ar..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 1107 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to High Temperatures  (disconti Phenolic molding compound, inorganically filled, glass fiber reinforced, high heat resistance, low heat expansion coefficient, highest resistance to pressure, high dimensional stability.Application ..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 2535 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof  (discontinued ** Phenolic molding compound, inorganically/organically filled, average heat resistant, steam resistant, dish washer proof, high surface quality.Application areas: Fittings for ovens and dishwashers, t..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 4109 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, low shrinkage, high mechanical strength, U..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 6507 Phenolic Formaldehyde Resin, Elasticized, Low Shrinkage, Resistant to High Temperatures, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, elastomer modified, galvanizable, heat resistant, good media resistance, high dimensional stability at raised temperature, hi..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 7592 Phenolic Formaldehyde Resin, Galvanized, Conductive  (discontinued **) Phenolic molding compound, inorganically/organically filled. Shrinkage fies compatible to values of UP 3310 and PF 2560. Electroplateable.Application areas: Chromium plated oven strips.Information..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 14600 Phenolic Formaldehyde Resin, High Surface Quality  (discontinued **) Phenolic molding compound, mainly organically filled, low specific gravity.Application areas: Cookware fittings, electric devices.Information provided by Bak AGBak AG became a part of Hexion in 2005..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 14694 Phenolic Formaldehyde Resin, High Surface Quality  (discontinued **) Phenolic molding compound, mainly organically filled, very soft flow for large molds.Application areas: Housing parts, heat shields, cookware fittings.Information provided by Bak AGBak AG became a p..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ 460124 Phenolic Formaldehyde Resin  (discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress.Application areas: Cookware fittings, electric devices.Information provided by Bak AGBak AG became a..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ X30 Phenolic Formaldehyde Resin  (discontinued **) Phenolic molding compound, reinforced with cotton and sisal fibers, increased notched impact strength.Application areas: Covers for electrical and electromagnetic devices.Information provided by Bak..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ X65 Phenolic Formaldehyde Resin, UL Listed  (discontinued **) Phenolic molding compound, inorganically/organically filled, good heat-resistance and dimensional stability, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Oven strips.Information..
Cure Time	0.500 - 0.667 min	0.00833 - 0.0111 hour	Metal set time
Lord Adhesives 9900 Normal Setting, High Viscosity, Odorless, Non-Frosting Methyl Cyanoacrylate Adhesive Lord Cyanoacrylate AdhesivesLordÂ® Cyanoacrylate Adhesives were developed for production situations requiring instant bonds and immediate handling strength, particularly when bonding rubber, metal..
Cure Time	0.500 - 0.667 min	0.00833 - 0.0111 hour	Fixture Rate
Dymax Magnet Bonder™ 2020 Adhesive DYMAX® Magnet Bonder™ Adhesives for Higher Performance and Lower CostDymax 2020 Magnet Bonder™ AdhesiveAcrylic and methacrylic acid-free; bond ferrite to metal, plated metals, E-coat, sealed cans..
Cure Time	0.167 - 0.667 min	0.00278 - 0.0111 hour	Time to Handling Strength
3M Scotch-Weld™ EC100 General Purpose Instant Adhesive 3M™ Scotch-Weld™ General Purpose Instant Adhesives are single component, high strength ethyl cyanoacrylate adhesive designed to bond to a variety of substances including most plastics, rubbers, me..
Cure Time	0.500 - 0.667 min	0.00833 - 0.0111 hour	Zinc, handling time
Permabond 941 Cyanoacrylate, low odor PERMABOND 941 is a low odor, non-fogging non-frosting alkoxyethyl cyanoacrylate. The reduced odor improves worker comfort. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate ad..
Cure Time	0.500 - 0.667 min	0.00833 - 0.0111 hour	Zinc, handling time
Permabond 943 Cyanoacrylate, low odor PERMABOND 943 is a low odor, non-fogging non-frosting alkoxyethyl cyanoacrylate. The reduced odor improves worker comfort. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate ad..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 4041 Phenolic Formaldehyde Resin, Resistant to High Temperatures  (discontinued **) Phenolic molding compound, glass fiber reinforced and inorganically filled, elasticized. Very good heat resistance, very good mechanical properties, reduced mold shrinkage and post-shrinkage, good ..
Cure Time	0.500 - 0.667 min	0.00833 - 0.0111 hour	Zinc, handling time
Permabond 947 Cyanoacrylate, low odor PERMABOND 947 is a low odor, non-fogging non-frosting alkoxyethyl cyanoacrylate. The reduced odor improves worker comfort. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate ad..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 83 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets  (discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Switch covers, rolls, handle casings..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 2560 Phenolic Formaldehyde Resin, High Surface Quality, For Electrostatic Coating, UL Listed &n Phenolic molding compound, inorganically/organically filled, average heat resistant, high surface quality, lower water absorption than PF 31, minimal distortion, UL listed molding compound 1.5 mm/V-..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 2836 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed &nbs Phenolic molding compound, inorganically/organically filled, increased heat resistance, increased tracking resistance, low shrinkage and post shrinkage, improved electrical properties, UL listed mol..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 2855 Phenolic Formaldehyde Resin, High Surface Quality, Low Shrinkage, For Electrostatic Coating, Dishwasher Proof, UL Listed Phenolic molding compound, inorganically/organically filled, heat resistant up to 250°C, hot steam and hot water resistant, high surface quality, for electrostatic coating, UL listed molding compou..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 4155 Phenolic Formaldehyde Resin, Resistant to High Temperatures, Improved Electrical Properties, Low Shrinkage, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, good media and temperature resistance. Conditioned Cu-adhesion.Application areas: Commutators (fuel pumps, actuators, starte..