Polymer Property : Cure Time = 0.167 min Product List

Processing Properties

Tips: 30 items are displayed at most.

Processing Properties	Metric	English	Comments
Cure Time	0.167 - 0.500 min	0.00278 - 0.00833 hour	On Steel (Fixture)
ND Industries SuperGlue Ethyl 320 Very low viscosity for pre-assembled componentsMeets military spec Mil-A-46050C Type II Class I
Cure Time	0.167 - 0.250 min	0.00278 - 0.00417 hour	Phenolic, handling time
Permabond 2011 Cyanoacrylate, gel PERMABOND® 2011 is a thixotropic, fast-setting cyanoacrylate particularly suitable for use on vertical and porous substrates. This material can be used on metals, plastics, elastomers, ceramics and..
Cure Time	0.167 min	0.00278 hour	Steel, set time
Permabond 738 Cyanoacrylate, toughened PERMABOND 738 is a toughened cyanoacrylate with improved impact and peel strength when compared to a conventional cyanoacrylate. It bonds rapidly at room temperature and its viscosity is stable over..
Cure Time	>= 0.167 min	>= 0.00278 hour	Buna N Rubber, set time
Permabond QFS10 Cyanoacrylate Activator The PERMABOND QFS 10 accelerates the cure of cyanoacrylate adhesives to provide a shorter set time. It can be used in a variety of applications but is especially useful when bonding porous or poorly..
Cure Time	<= 0.167 min	<= 0.00278 hour	PET, fixture time, (low power 4mW lamp)
Permabond UV648 UV-curable Adhesive PERMABOND UV648 is a UV-curing adhesive developed for use on plastics. It has good adhesion to acrylic and contains a long-wavelength photo initiator to allow it to cure through UV-stabilized plasti..
Cure Time	0.167 min	0.00278 hour	Steel, handling time
Permabond 108 Cyanoacrylate, gap filling PERMABOND® 108 is an intermediate viscosity cyanoacrylate that is used to bond through intermediate gaps. It is fast setting and suitable for use on plastics, rubber and metals. Cyanoacrylate adhes..
Cure Time	0.167 min	0.00278 hour	Phenolic, handling time
Permabond 108 Cyanoacrylate, gap filling PERMABOND® 108 is an intermediate viscosity cyanoacrylate that is used to bond through intermediate gaps. It is fast setting and suitable for use on plastics, rubber and metals. Cyanoacrylate adhes..
Cure Time	0.167 - 0.250 min	0.00278 - 0.00417 hour	Buna N Rubber, handling time
Permabond 802 Cyanoacrylate, High Temperature PERMABOND® 802 is a low viscosity modified ethyl cyanoacrylate suitable for applications where high temperature resistance is required. This material is fast setting and has good adhesion to rubber..
Cure Time	0.167 - 0.250 min	0.00278 - 0.00417 hour	Buna N Rubber, handling time
Permabond 820 Cyanoacrylate, High Temperature PERMABOND® 820 is a low viscosity modified ethyl cyanoacrylate suitable for applications where high temperature resistance is required. This material is fast setting and has good adhesion to rubber..
Cure Time	0.167 - 0.250 min	0.00278 - 0.00417 hour	Buna N Rubber, handling time
Permabond 920 Cyanoacrylate, High temperature PERMABOND® 920 is the original allyl cyanoacrylate adhesive. It is a single part, low viscosity liquid that will cure rapidly at room temperature when pressed into a thin film between parts. PERMAB..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Phenolic, set time
Permabond 931 Cyanoacrylate PERMABOND 931 is a low odor, nonfogging, nonfrosting cyanoacrylate. The reduced odor improves worker comfort. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate adhesiv..
Cure Time	>= 0.167 min	>= 0.00278 hour	Fixture
Resinlab® CYNERGY CA6208 Adhesive Description: The CYNERGY 6200 SERIES products are for use in demanding applications where very fast cure speeds are required. Also used when difficult to bond and acidic surfaces are used such as EP..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 31 Phenolic Formaldehyde Resin, UL Listed  (discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress, UL listed molding compound 1.5 mm/V-1 (All), 3 mm/V-0 (All), standardized molding compound.Applicat..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 31.9 Phenolic Formaldehyde Resin, Ammonia Free  (discontinued **) Phenolic molding compound, mainly organically filled, ammonia free, standardized molding compound.Application areas: Parts for electrical and telecommunications technology, motor vehicle ignition sy..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 2535 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof  (discontinued ** Phenolic molding compound, inorganically/organically filled, average heat resistant, steam resistant, dish washer proof, high surface quality.Application areas: Fittings for ovens and dishwashers, t..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 2774 Phenolic Formaldehyde Resin, Dishwasher Proof, Improved Electrical Properties, Low Shrinkage, UL Listed Phenolic molding compound, inorganically filled, glass fiber reinforced, increased dimensional stability, averaged notched impact strength, average heat resistance, improved electrical properties, U..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 7592 Phenolic Formaldehyde Resin, Galvanized, Conductive  (discontinued **) Phenolic molding compound, inorganically/organically filled. Shrinkage fies compatible to values of UP 3310 and PF 2560. Electroplateable.Application areas: Chromium plated oven strips.Information..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 14694 Phenolic Formaldehyde Resin, High Surface Quality  (discontinued **) Phenolic molding compound, mainly organically filled, very soft flow for large molds.Application areas: Housing parts, heat shields, cookware fittings.Information provided by Bak AGBak AG became a p..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ 151733 Phenolic Formaldehyde Resin  (discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress.Application areas: Contact strips.Information provided by Bak AGBak AG became a part of Hexion in 20..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ X24 Phenolic Formaldehyde Resin  (discontinued **) Phenolic molding compound, mainly organically filled.Application areas: Operating controls, housing parts, lamp holders.Information provided by Bak AGBak AG became a part of Hexion in 2005.
Cure Time	0.167 - 0.500 min	0.00278 - 0.00833 hour	under visible/UV light
Hybrid Plastics NanoBondâ„¢ UV Curable Adhesive Generally used for dental and optical applications.Information provided by Hybrid Plastics
Cure Time	<= 0.167 min	<= 0.00278 hour
Dymax 956 Potting and Encapsulation Adhesive High Performance Light-Curing Adhesives and Coatings for Electronic AssemblyDymax 956 Potting and Encapsulation AdhesiveHigh strength and flexible, excellent for bonding dissimilar substrates Cure T..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Cooling Time
Advanced Polymer Alloys DuraGrip™ 6150 BK Melt Processable Elastomer DuraGrip™ 6150BK is designed to be a special purpose Melt Processable Elastomer (MPE) that is easy to use in injection molding and extrusion processes. DGR 6150BK has an excellent soft touch feel a..
Cure Time	0.167 - 0.583 min	0.00278 - 0.00972 hour	Time to Handling Strength
3M Scotch-Weld™ FLX300 Flexible Instant Adhesive 3M™ Scotch-Weld™ Flexible Instant Adhesive FLX (formerly PR851) is formulated for extended resistance to impact, vibration, stress, peel, and humidity applications. It is faster curing than 3M™ S..
Cure Time	0.167 - 1.00 min	0.00278 - 0.0167 hour	Time to Handling Strength
3M Scotch-Weld™ LO100 Low Odor Instant Adhesive 3M™ Scotch-Weld™ Low-Odor Instant Adhesives are formulated to have low volatility while maintaining bonding of a wide rage of materials. Low volatility means that these products are not only low o..
Cure Time	<= 0.167 min	<= 0.00278 hour	Phenolic, handling time
Permabond 910FS Cyanoacrylate, Methyl grade PERMABOND® 910FS is the original 100%-methyl cyanoacrylate adhesive. It is a single part, low viscosity liquid that will cure rapidly at room temperature when pressed into a thin film between parts..
Cure Time	0.167 - 0.250 min	0.00278 - 0.00417 hour	Steel, handling time
Permabond 943 Cyanoacrylate, low odor PERMABOND 943 is a low odor, non-fogging non-frosting alkoxyethyl cyanoacrylate. The reduced odor improves worker comfort. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate ad..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 7595 Phenolic Formaldehyde Resin, Low Coefficient of Friction, Galvanized, Conductive  (di Phenolic molding compound, inorganically/organically filled, modified with graphite, good heat conductivity, good sliding properties, conductive in electrical properties.Application areas: Bearers f..
Cure Time	0.167 min	0.00278 hour	Phenolic, set time
Permabond 262 Cyanoacrylate PERMABOND 262 is a low viscosity cyanoacrylate ideal for wicking type application. PERMABOND 262 provides faster set times and improved gap-filling capability compared to conventional cyanoacrylates..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 4260 Phenolic Formaldehyde Resin, Resistant to High Temperatures, Improved Electrical Properties, Low Shrinkage, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistantApplication areas: Commutators (starte..