Polymer Property : Cure Time = 0.333 min Product List

Processing Properties

Tips: 30 items are displayed at most.

Processing Properties	Metric	English	Comments
Cure Time	<= 0.333 min	<= 0.00556 hour	EPDM, handling time
Permabond 105 Cyanoacrylate, for difficult rubbers PERMABOND® 105 is a low viscosity high purity cyanoacrylate adhesive. It is ideal for use on hard-to-bond plastics and rubbers such as natural rubber, EPDM and butyl rubber. Cyanoacrylate adhesives..
Cure Time	<= 0.333 min	<= 0.00556 hour	Steel, handling time
Permabond 922 Cyanoacrylate, High temperature PERMABOND® 922 is the original allyl cyanoacrylate adhesive. It is a single part, moderate viscosity liquid that will cure rapidly at room temperature when pressed into a thin film between parts. P..
Cure Time	>= 0.333 min	>= 0.00556 hour	Fixture
Resinlab® CYNERGY CA6604 Adhesive Description: The CYNERGY 6600 SERIES are modified to provide greatly reduced odor and frosting of plastics. These products are ideal for bonding dissimilar materials with excellent performance on a ..
Cure Time	>= 0.333 min	>= 0.00556 hour	Fixture
Resinlab® CYNERGY CA6605 Adhesive Description: The CYNERGY 6600 SERIES are modified to provide greatly reduced odor and frosting of plastics. These products are ideal for bonding dissimilar materials with excellent performance on a ..
Cure Time	>= 0.333 min	>= 0.00556 hour	Fixture
Resinlab® CYNERGY CA6704 Adhesive Description: The CYNERGY 6700 SERIES are modified to provide greatly reduced odor and a further reduction of bloom or frosting of plastics when compared to the 6600 Series. These products are ideal ..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 31 Phenolic Formaldehyde Resin, UL Listed  (discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress, UL listed molding compound 1.5 mm/V-1 (All), 3 mm/V-0 (All), standardized molding compound.Applicat..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 31.9 Phenolic Formaldehyde Resin, Ammonia Free  (discontinued **) Phenolic molding compound, mainly organically filled, ammonia free, standardized molding compound.Application areas: Parts for electrical and telecommunications technology, motor vehicle ignition sy..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 2137 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof  (discontinued ** Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, minimal distortion, dish washer proof.Application areas: Iron heat shields, fittings f..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 2400 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof, UL Listed  (disc Phenolic molding compound, inorganically/organically filled, average heat resistance, increased dimensional stability, dish washer proof, UL listed molding compound 1.5 mm/V-0 (ALL).Application area..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 2535 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof  (discontinued ** Phenolic molding compound, inorganically/organically filled, average heat resistant, steam resistant, dish washer proof, high surface quality.Application areas: Fittings for ovens and dishwashers, t..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 2774 Phenolic Formaldehyde Resin, Dishwasher Proof, Improved Electrical Properties, Low Shrinkage, UL Listed Phenolic molding compound, inorganically filled, glass fiber reinforced, increased dimensional stability, averaged notched impact strength, average heat resistance, improved electrical properties, U..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 7400 Phenolic Formaldehyde Resin, High Mechanical Strength  (discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fiber flakes, high notched impact strength.Application areas: Moldings for higher mechanical strain, e.g. power plugs high volta..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ 460124 Phenolic Formaldehyde Resin  (discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress.Application areas: Cookware fittings, electric devices.Information provided by Bak AGBak AG became a..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ X30 Phenolic Formaldehyde Resin  (discontinued **) Phenolic molding compound, reinforced with cotton and sisal fibers, increased notched impact strength.Application areas: Covers for electrical and electromagnetic devices.Information provided by Bak..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ X65 Phenolic Formaldehyde Resin, UL Listed  (discontinued **) Phenolic molding compound, inorganically/organically filled, good heat-resistance and dimensional stability, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Oven strips.Information..
Cure Time	0.333 - 0.417 min	0.00556 - 0.00694 hour	Plastic set time
Lord Adhesives CA High Viscosity, General Purpose, Non Stringing, Non Migrating Ethyl Cyanoacrylate Adhesive Lord Cyanoacrylate AdhesivesLordÂ® Cyanoacrylate Adhesives were developed for production situations requiring instant bonds and immediate handling strength, particularly when bonding rubber, metal..
Cure Time	<= 0.333 min	<= 0.00556 hour
Dymax 930 Coil Terminating, Tamper proofing and Structural Electronic Bonder High Performance Light-Curing Adhesives and Coatings for Electronic AssemblyDymax 930 Coil Terminating, Tamper proofing and Structural Electronic BonderHigh strength, superior bonds to steel, alumin..
Cure Time	0.333 - 0.500 min	0.00556 - 0.00833 hour	per mm
Amity Thermosets ATF 197 Phenolic Molding Inorganic and glass Filler, Compression Molded Characteristics:Flame retardantSpark resistant Good electrical insulationHeat stability ( 200°C )Good mouldability Low water absorptionLow shrinkageColor-blackSoft/medium flow Applications:Switchg..
Cure Time	0.333 - 0.417 min	0.00556 - 0.00694 hour	per mm
Amity Thermosets ATG 115 Phenolic Molding Organic Filler, Compression Molded Characteristics:Medium mechanical strength Medium electrical insulationGeneral purposeColor- Black, BrownSoft/medium flow Applications: Electrical accessories & fittings ( medium quality ) Domestic ..
Cure Time	0.333 - 0.417 min	0.00556 - 0.00694 hour	per mm
Amity Thermosets ATM 144 Phenolic Molding Organic Filler, Compression Molded Characteristics:Good mouldability Good mechanical strengthGood electrical insulationGood surface finishMedium thermal stabilityColor- black, brownSoft/medium flow Applications: Electric control pane..
Cure Time	0.333 - 1.17 min	0.00555 - 0.0195 hour	Time to Handling Strength
3M Scotch-Weld™ LO1000 Low Odor Instant Adhesive 3M™ Scotch-Weld™ Low-Odor Instant Adhesives are formulated to have low volatility while maintaining bonding of a wide rage of materials. Low volatility means that these products are not only low o..
Cure Time	0.333 - 0.583 min	0.00555 - 0.00972 hour	Time to Handling
3M Scotch-Weld™ MG300 FLX Medical Grade Instant Adhesive 3M™ Scotch-Weld™ Medical Grade Instant Adhesive are intended for use on a wide variety of materials used in the construction of disposable medical assemblies. They will quickly bond metals, plasti..
Cure Time	0.333 - 0.417 min	0.00556 - 0.00694 hour	per mm
Amity Thermosets ATG 112 Phenolic Molding Organic Filler, Compression Molded Characteristics:Medium mechanical strength Medium electrical insulationGeneral purposeColor- Black, BrownSoft/medium flow Applications: Electrical accessories & fittings ( medium quality ) Domestic ..
Cure Time	0.333 - 0.417 min	0.00556 - 0.00694 hour	per mm
Amity Thermosets ATO 145 Phenolic Molding Organic Filler, Compression Molded Characteristics:Electrical low loss Good mechanical strengthHigh electrical insulationGood mechanical strengthGlossy surfaceLow water absorptionColor-black, brownMedium flow Applications: Electric ..
Cure Time	0.333 - 0.500 min	0.00556 - 0.00833 hour	per mm
Amity Thermosets ATR 126 Phenolic Molding Organic Filler, Compression Molded Characteristics:Ammonia freeGood mouldabilityGood mechanical strengthGood electrical insulationGood surface finishMedium thermal stability Color-black, brownSoft/medium flow Applications:Telecommuni..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 2874 Phenolic Formaldehyde Resin, Low Shrinkage, Improved Electrical Properties, UL Listed, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, increased mechanical strength, increased temperature stability, low water absorption, good dimensional stability, UL listed m..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 4111 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free, Copper Adhesive Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, high mechanical strength, copper-adhesive,..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 7595 Phenolic Formaldehyde Resin, Low Coefficient of Friction, Galvanized, Conductive  (di Phenolic molding compound, inorganically/organically filled, modified with graphite, good heat conductivity, good sliding properties, conductive in electrical properties.Application areas: Bearers f..
Cure Time	>= 0.333 min	>= 0.00556 hour	Fixture
Resinlab® CYNERGY CA6908 Adhesive Description: The CYNERGY 6900 SERIES are for use in demanding applications where very fast cure speeds and high temperature resistance are required. These are single component solvent free materials..
Cure Time	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 83 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets  (discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Switch covers, rolls, handle casings..