Polymer Property : Cure Time = 0.333 min Product List

Processing Properties

Tips: 30 items are displayed at most.

Processing Properties	Metric	English	Comments
Cure Time	0.250 - 0.333 min	0.00417 - 0.00556 hour	Neoprene, handling time
Permabond 731 Cyanoacrylate, toughened PERMABOND® 731 is a toughened cyanoacrylate with very good impact and peel strength when compared to a conventional cyanoacrylate. It bonds rapidly at room temperature and its viscosity is stable o..
Cure Time	0.250 - 0.333 min	0.00417 - 0.00556 hour	Steel, handling time
Permabond 737 Cyanoacrylate, toughened PERMABOND® 737 is a toughened cyanoacrylate with improved impact and peel strength for maximum flexibility. Its increased temperature resistance and dark color make 737 suitable for a wide range of..
Cure Time	0.250 - 0.333 min	0.00417 - 0.00556 hour	Steel, handling time
Permabond 920 Cyanoacrylate, High temperature PERMABOND® 920 is the original allyl cyanoacrylate adhesive. It is a single part, low viscosity liquid that will cure rapidly at room temperature when pressed into a thin film between parts. PERMAB..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ MP 4165 Melamine Phenolic Resin, Copper Adhesive, Low Shrinkage, High Mechanical Strength  (d Melamine/phenolic molding compound, inorganically filled, glass fiber reinforced, good temperature stability, high level of mechanical properties, copper adhesive, flammability UL 94/V-0/1.6 mm (not..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 31 Phenolic Formaldehyde Resin, UL Listed  (discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress, UL listed molding compound 1.5 mm/V-1 (All), 3 mm/V-0 (All), standardized molding compound.Applicat..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 1141 Phenolic Formaldehyde Resin, High Surface Quality, Resistant to High Temperatures, Dishwasher Proof Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, hot steam and hot water resistant (not suitable for use of higher voltage).Application..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 2137 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof  (discontinued ** Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, minimal distortion, dish washer proof.Application areas: Iron heat shields, fittings f..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 2400 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof, UL Listed  (disc Phenolic molding compound, inorganically/organically filled, average heat resistance, increased dimensional stability, dish washer proof, UL listed molding compound 1.5 mm/V-0 (ALL).Application area..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 2535 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof  (discontinued ** Phenolic molding compound, inorganically/organically filled, average heat resistant, steam resistant, dish washer proof, high surface quality.Application areas: Fittings for ovens and dishwashers, t..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 2736 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed &nbs Phenolic molding compound, inorganically/organically filled, increased tracking resistance, UL listed molding compound 0.46 mm/V-0 (BK, Suffix "H"), 0.81 mm/V-0 (NC, GN, BK), 1.5 mm/V-0 (ALL).Applic..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 4109 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, low shrinkage, high mechanical strength, U..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 6506 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to High Temperatures, UL Listed &nbs Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistant, UL listed molding compound 1.5 mm/V-..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 7592 Phenolic Formaldehyde Resin, Galvanized, Conductive  (discontinued **) Phenolic molding compound, inorganically/organically filled. Shrinkage fies compatible to values of UP 3310 and PF 2560. Electroplateable.Application areas: Chromium plated oven strips.Information..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 14600 Phenolic Formaldehyde Resin, High Surface Quality  (discontinued **) Phenolic molding compound, mainly organically filled, low specific gravity.Application areas: Cookware fittings, electric devices.Information provided by Bak AGBak AG became a part of Hexion in 2005..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 14694 Phenolic Formaldehyde Resin, High Surface Quality  (discontinued **) Phenolic molding compound, mainly organically filled, very soft flow for large molds.Application areas: Housing parts, heat shields, cookware fittings.Information provided by Bak AGBak AG became a p..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 38110 Phenolic Formaldehyde Resin, High Surface Quality  (discontinued **) Phenolic molding compound, mainly organically filled.Application areas: Devices for the electrical installation, pan handles, knobs, mainly for compression molding.Information provided by Bak AGBak ..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ 151733 Phenolic Formaldehyde Resin  (discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress.Application areas: Contact strips.Information provided by Bak AGBak AG became a part of Hexion in 20..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ X65 Phenolic Formaldehyde Resin, UL Listed  (discontinued **) Phenolic molding compound, inorganically/organically filled, good heat-resistance and dimensional stability, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Oven strips.Information..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Value given for curing at 300 W/in; Optimum properties in 24 hrs.
Humiseal 1C61 UV Cure Conformal Coating Humiseal 1C61 UV Cure Conformal CoatingHigh temperature resistanceGood dielectrical propertiesGood moisture resistanceRepairableUL Approval PendingMIL-I-46058C Approval PendingPasses thermal shock t..
Cure Time	0.0833 - 0.333 min	0.00139 - 0.00556 hour	Rubber set time
Lord Adhesives 9010 Medium Viscosity, Odorless, Non-Frosting Methoxyethyl Cyanoacrylate Adhesive Lord Cyanoacrylate AdhesivesLordÂ® Cyanoacrylate Adhesives were developed for production situations requiring instant bonds and immediate handling strength, particularly when bonding rubber, metal..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion UP 802 Unsaturated Polyester Resin, High Surface Quality, Low Shrinkage, High Arc Resistance Polyester molding compound, inorganically filled, glass fiber reinforced, styrene free, high dimensional stability, very slight post shrinkage, good mechanical properties, increased electrical value..
Cure Time	0.200 - 0.333 min	0.00333 - 0.00556 hour	per mm
Amity Thermosets ATI 101 Phenolic Molding Organic Filler, Injection Molded Characteristics:Electrical low loss Good mechanical strengthHigh electrical insulationGood mechanical strengthGlossy surfaceLow water absorptionColor-blackVery soft flow Applications: Electric swit..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Cooling Time
Advanced Polymer Alloys DuraGrip™ 6170 BK Melt Processable Elastomer DuraGrip™ 6170BK is designed to be a special purpose Melt Processable Elastomer (MPE) that is easy to use in injection molding and extrusion processes. DGR 6170BK has an excellent soft touch feel a..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Cooling Time
Advanced Polymer Alloys DuraGrip™ DGR 6030 NC/BK Thermoplastic Elastomer (TPE) DuraGrip® DGR 6030 NC/BK are designed to be general purpose Thermoplastic Elastomers (TPE) that are easy to use in injection molding and extrusion processes. DGR 6030 NC/BK have an excellent soft t..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Cooling Time
Advanced Polymer Alloys DuraGrip™ DGR 6080 NC/BK Thermoplastic Elastomer (TPE) DuraGrip® DGR 6080NC/BK are designed to be a general purpose Thermoplastic Elastomers (TPE) that are easy to use in injection molding and extrusion processes. DGR 6080NC/BK have excellent soft touc..
Cure Time	0.0833 - 0.333 min	0.00139 - 0.00555 hour	Time to Handling Strength
3M Scotch-Weld™ HT40 High Temperature Instant Adhesive 3M™ Scotch-Weld™ High Temperature Instant Adhesives provide superior performance for demanding applications where high temperatures, thermal cycling, or shock resistance is required. HT40 is a low..
Cure Time	0.250 - 0.333 min	0.00417 - 0.00556 hour	Fixture Rate
Dymax Magnet Bonder™ 2000 Adhesive DYMAX® Magnet Bonder™ Adhesives for Higher Performance and Lower CostDymax 2000 Magnet Bonder™ AdhesiveFastest cure; bond ferrite to steel. Typical Use: Loudspeaker magnet to pole piece.
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 2874 Phenolic Formaldehyde Resin, Low Shrinkage, Improved Electrical Properties, UL Listed, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, increased mechanical strength, increased temperature stability, low water absorption, good dimensional stability, UL listed m..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 4010 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage  (disconti Glass fiber reinforced and inorganically filled molding compound. High heat resistance, reduced molding shrinkage, good chemical resistance and mechanical properties.Application areas: Switch housi..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 4260 Phenolic Formaldehyde Resin, Resistant to High Temperatures, Improved Electrical Properties, Low Shrinkage, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistantApplication areas: Commutators (starte..