Polymer Property : Cure Time = 0.500 hour Product List

Processing Properties

Tips: 30 items are displayed at most.

Processing Properties	Metric	English	Comments
Cure Time	30.0 min @Temperature 121 °C	0.500 hour @Temperature 250 °F
Parker Chomerics CHO-FLEX 4430 Conductive Ink CHO-FLEX polyester inks were developed for the membrane keyboard and sensor industries. The ink bond to Mylar films, and can be creased, heat-formed or scratched without affecting their performance...
Cure Time	30.0 min @Temperature 152 °C	0.500 hour @Temperature 305 °F
TSE Industries Millathane® 5004 Millable Polyurethane Elastomer with 20 PHR N330 (HAF) Black MILLATHANE 5004 is a millable polyurethane elastomer having excellent processing characteristics. MILLATHANE 5004 stocks can be readily processed on conventional rubber equipment. Vulcanization is c..
Cure Time	30.0 min @Temperature 154 °C	0.500 hour @Temperature 310 °F
TSE Industries Millathane® CM Millable Polyether Urethane Rubber, Hardness 65A MILLATHANE CM is a sulfur and peroxide curable polyether urethane rubber. Its outstanding property is its great resistance to abrasion, which makes it of special interest for articles that are subje..
Cure Time	30.0 min @Temperature 160 Â°C	0.500 hour @Temperature 320 Â°F
Gwent Electronic Materials C2030529D3 Gold Via Ink This product is based on a unique curing process that results in the low temperature formation of a thermosetting conductive adhesive that combines good adhesion and electrical conductivity with che..
Cure Time	30.0 - 60.0 min @Temperature 120 Â°C	0.500 - 1.00 hour @Temperature 248 Â°F
Gwent Electronic Materials C2050503D1 Curable Carbon Ink This product is based on a unique curing process that results in the low temperature formation of a thermosetting conductive coating that combines good adhesion with excellent chemical, solvent and ..
Cure Time	30.0 min @Temperature 160 Â°C	0.500 hour @Temperature 320 Â°F
Gwent Electronic Materials C2030529D2 Silver Via Ink This product is based on a unique curing process that results in the low temperature formation of a thermosetting conductive adhesive that combines good adhesion and electrical conductivity with che..
Cure Time	30.0 - 45.0 min	0.500 - 0.750 hour	Tack-free
Sika Industry SikaFlex 252 One Part Polyurethane Adhesive Sika 252 SikaFlex One Part Polyurethane AdhesiveA high viscous, high strength adhesive, this product can replace rivets, screws, welds, and other mechanical fasteners. Seals and bonds in one step. 4..
Cure Time	30.0 min @Temperature 120 °C	0.500 hour @Temperature 248 °F
Tra-Con Tra-Duct 921H01 Information provided by Tra-Con Inc.
Cure Time	30.0 - 60.0 min	0.500 - 1.00 hour
Trelleborg Emerson & Cuming Stycast® 1090/11 Two-Component General Purpose Encapsulant Features and Typical Applications: Designed as general purpose encapsulants, these products offer a wide range of features including thermal conductivity, mechanical shock and impact resistance, as ..
Cure Time	30.0 - 60.0 min	0.500 - 1.00 hour
Trelleborg Emerson & Cuming Stycast® 2651-40FR/9 Two-Component Epoxy Flame Retardant Encapsulant Features and Typical ApplicationsProvide flame resistance down to 1/8 of an inch. These products also offer various other features such as thermal shock protection, low viscosity, and thermal conduc..
Cure Time	30.0 min	0.500 hour	On-Part Life
Loctite® 736 Trichloroethylene isopropyl alcohol Base Surface Primer Loctite offers a complete line of surface preparation products to ensure the maximum performance of Loctite® Adhesives and Sealants.Loctite® Accelerators are used to increase the cure speed and ga..
Cure Time	30.0 min @Temperature 32.0 °C	0.500 hour @Temperature 89.6 °F	Full Chemical
Chesterton ARC 5ES Rapid Repair Stick Description: ARC 5ES is specifically formulated for quick reliable repairs. Its “stick” design combines the performance of a two component system with the convenience of a single component. The AR..
Cure Time	30.0 min @Temperature 75.0 °C	0.500 hour @Temperature 167 °F	minimum, B-stage
Epoxy Technology EPO-TEK® B9021 Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta..
Cure Time	30.0 min @Temperature 25.0 °C	0.500 hour @Temperature 77.0 °F	Cooling time
Aquabond Technologies Aquabond™ ABS-55 Water Soluble Adhesive and Bonding Thermoplastic Description: Aquabond's water soluble thermoplastic is designed for temporary mounting of hard materials for slicing, dicing, grinding, lapping and polishing and comes in 3 different bonding tem..
Cure Time	30.0 - 60.0 min	0.500 - 1.00 hour	at 200°F; 0.75-1 hr at 480°F
Aremco Aremco-Seal™ 529VHV High Temperature Specialty Coatings Silicone Very high viscosity version, transparent silicone sealer with exceptional electrical and moisture resistance to 600°F (316°C). Ideal for use in cartridge heaters.
Cure Time	30.0 min	0.500 hour	Air Set prior to curing
Aremco Glass-Coat™ GC4000 High Temperature Specialty Coatings Glass Glass-enamel, gloss-black coating for stainless steel to 1000°F (538°C)
Cure Time	30.0 min	0.500 hour	Initial Set
3M Scotchkote™ 75RG 530 Urethane Elastomer Scotchkote Urethane Elastomer 75RG 530 has been specifically developed as a fast curing 75-80 Durometer, elastomeric repair system with a high degree of flexibility for rebuilding and resurfacing r..
Cure Time	30.0 min @Temperature 24.0 °C	0.500 hour @Temperature 75.2 °F
BCC Products BC 4558 Polyester Filler Paste BC4558 is a unique quickset paste designed for aircraft use in making fast repairs to damaged metal surfaces. Also recommended for use in edge filling honeycomb core and foam core composite panels. ..