Polymer Property : Cure Time = 24.0 hour Product List

Processing Properties

Tips: 30 items are displayed at most.

Processing Properties	Metric	English	Comments
Cure Time	720 - 1440 min	12.0 - 24.0 hour	Full cure for handling
P & P Technology MS-N Nickel Graphite Conductive Adhesive P & P Technology conductive nickel/graphite adhesive is a one part electrically conductive room temperature curing elastomer. It is supplied as a readily extrudable paste that cures rapidly when exp..
Cure Time	720 - 1440 min	12.0 - 24.0 hour	Cure for Handling
P & P Technology Silver/Aluminum Conductive Adhesive P & P Technology conductive silver/aluminum adhesive is a one part electrically conductive room temperature curing elastomer. It is supplied as a readily extrudable paste that cures rapidly when exp..
Cure Time	15.0 - 1440 min @Temperature 57.2 - 100 °C	0.250 - 24.0 hour @Temperature 135 - 212 °F	Average value: 434 min Grade Count:17
Overview of materials for Thermoset Polyurethane, Liquid This property data is a summary of similar materials in the MatWeb database for the category "Thermoset Polyurethane, Liquid". Each property range of values reported is minimum and maximum values of..
Cure Time	0.750 - 1440 min @Temperature 40.0 - 302 °C	0.0125 - 24.0 hour @Temperature 104 - 576 °F	Average value: 81.6 min Grade Count:121
Overview of materials for Epoxy, Electrically Conductive This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Electrically Conductive". Each property range of values reported is minimum and maximum values of..
Cure Time	1080 - 1440 min @Temperature 25.0 Â°C	18.0 - 24.0 hour @Temperature 77.0 Â°F
Fibre Glast 1099 Room Temperature Epoxy Surface Coat Safety hardener with fast overnight cure. Low viscosity thins the resin well for best detail reproduction. Can be sanded in 16-18 hours. #1099 is a white, medium viscosity epoxy surface coat that c..
Cure Time	720 - 1440 min @Temperature 204 - 232 Â°C	12.0 - 24.0 hour @Temperature 399 - 450 Â°F	Post cure
Lord Adhesives ChemlokÂ® 5150 Adhesive LORD ChemlokÂ® 5150 adhesive is a solvent-based adhesive used to bond uncured fluoroelastomers to metal. It can also be used to bond fluoroelastomers with an incorporated cure system to mechanical..
Cure Time	1080 - 1440 min @Temperature 23.9 °C	18.0 - 24.0 hour @Temperature 75.0 °F	85% maximum strength developed within
Master Bond EP21TDCNFL Two Component Nickel Conductive Epoxy Adhesive Master Bond Polymer System EP21TDCNFL is a two component, nickel filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidl..
Cure Time	1080 - 1440 min	18.0 - 24.0 hour	85% of maximum strength developed
Master Bond EP77M-1 Fast Setting, Silver Conductive Epoxy Description: Master Bond Polymer System EP77M-1 is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or..
Cure Time	720 - 1440 min @Temperature 23.0 °C	12.0 - 24.0 hour @Temperature 73.4 °F
Master Bond Mastersil 410 One Component Room Temperature Curing Silicon Master Bond MasterSil 410 is a ready-to-use, one component high performance silicone elastomer compound for bonding, sealing, protective coatings and formed-in-place gaskets. This compound has a pas..
Cure Time	720 - 1440 min @Temperature 23.0 °C	12.0 - 24.0 hour @Temperature 73.4 °F
Master Bond Mastersil 415 One Component Room Temperature Curing, Transparent Silicon Master Bond MasterSil 415 is a ready-to-use, one component high performance silicone elastomer compound for bonding, sealing and protective coatings featuring high transparency. It has a paste consi..
Cure Time	720 - 1440 min @Temperature 23.0 °C	12.0 - 24.0 hour @Temperature 73.4 °F
Master Bond X17 Elastomer Based One Component Adhesive and Primer Master Bond Polymer System X17 is a specially formulated one component adhesive especially designed for bonding polyolefins such as polypropylene, polyethylene as well as their many co-polymers and ..
Cure Time	720 - 1440 min @Temperature 23.9 °C	12.0 - 24.0 hour @Temperature 75.0 °F
Master Bond X17MED Elastomer Compound for Medical Device Applications Description: Master Bond Polymer System X17MED is a specially formulated one component adhesive specially designed for bonding polyolefins such as polypropylene and polyethylene as well as their man..
Cure Time	240 - 1440 min	4.00 - 24.0 hour	Full Cure Time @ 20ºC
Loctite® 3873 1 component acrylic High Conductivity Flexible Adhesive Thermally Conductive BondersLoctite® Thermally Conductive Adhesives eliminate the need for mechanical fasteners and clips, while providing the most efficient thermal transfer between transistors or..
Cure Time	5.00 - 1440 min	0.0833 - 24.0 hour	Full Cure
Loctite® 5205 Flexible Cure Flange Sealant Anaerobic GasketingLoctite® 5205 Flexible Cure Flange SealantFast curing and flexible, good sealing properties against oil and water/glycol particularly at high temperatures. High viscosity. Recom..
Cure Time	60.0 - 1440 min	1.00 - 24.0 hour	Full Cure, Unprimed
Loctite® 5205 Flexible Cure Flange Sealant Anaerobic GasketingLoctite® 5205 Flexible Cure Flange SealantFast curing and flexible, good sealing properties against oil and water/glycol particularly at high temperatures. High viscosity. Recom..
Cure Time	60.0 - 1440 min	1.00 - 24.0 hour	Full Cure, Unprimed
Loctite® 5206 Flexible Cure Flange Sealant Anaerobic GasketingLoctite® 5206 Flexible Cure Flange SealantSlow curing allows for micro-movement during assembly operations. Good sealing properties against oil and water/glycol. High viscosity...
Cure Time	960 - 1440 min @Temperature 93.3 °C	16.0 - 24.0 hour @Temperature 200 °F
Cotronics Duralco™ 132 500°F (260°C) Aluminum Filled Epoxy Aluminum filled epoxy that cures at room temperature to form machinable, thermally conductive bond lines. High heat transfer. Can be supplied as a “non-sag” putty.Applications: heat tacking, hea..
Cure Time	960 - 1440 min	16.0 - 24.0 hour
Dow BETAMATE™ 7000/7050 L Epoxy Two component room temperature fast curing polyurethane structural adhesive with high elastic modulus.Information provided by Dow
Cure Time	960 - 1440 min @Temperature 93.3 °C	16.0 - 24.0 hour @Temperature 200 °F
Cotronics Duralco™ 128 500°F (260°C) Ceramic Filled Epoxy Ceramic filled, electrically resistant adhesive and potting compound. The ceramic fillers provide both high thermal conductivity and high dielectric strength. Cures at room temperature. Curing ca..
Cure Time	480 - 1440 min	8.00 - 24.0 hour	Full Cure
3M Scotch-Weld™ DP8010NS Structural Adhesive 3M™ Scotch-Weld™ Structural Plastic Adhesive DP-8010NS is a two-part acrylic-based adhesive (10:1 ratio by volume) that can bond many low surface energy plastics, including many grades of Polyprop..
Cure Time	480 - 1440 min	8.00 - 24.0 hour	Full cure
3M Scotch-Weld™ DP805 Acrylic Adhesives 3M™ Scotch-Weld™ Acrylic Adhesive DP805 is a two-part, 1:1 mix ratio, toughened acrylic structural adhesives. They exhibit excellent shear and peel strengths along with good impact and durability ..
Cure Time	480 - 1440 min	8.00 - 24.0 hour	Full cure
3M Scotch-Weld™ DP810 Black Structural Adhesive 3M™ Scotch-Weld™ Low-Odor Acrylic Adhesives are two-part, 1:1 mix ratio, toughened structural adhesives with less odor than most acrylic adhesives. The adhesives have excellent shear and peel stre..
Cure Time	480 - 1440 min	8.00 - 24.0 hour	Full cure
3M Scotch-Weld™ DP810 Tan Structural Adhesive 3M™ Scotch-Weld™ Low-Odor Acrylic Adhesives are two-part, 1:1 mix ratio, toughened structural adhesives with less odor than most acrylic adhesives. The adhesives have excellent shear and peel stre..
Cure Time	240 - 1440 min	4.00 - 24.0 hour	Full cure
3M Scotch-Weld™ DP825 Acrylic Adhesives 3M™ Scotch-Weld™ Acrylic Adhesive DP825 is a two-part, 1:1 mix ratio, toughened acrylic structural adhesives. They exhibit excellent shear and peel strengths along with good impact, durability and..
Cure Time	240 - 1440 min	4.00 - 24.0 hour	Full Cure; Unprimed
Loctite® Gasket Eliminator® 504 Flange Sealant Anaerobic GasketingLoctite® 504 Gap Filling Rigid Cure Gasket Eliminator® Flange SealantA single-component, instant low pressure seal that fills gaps to 0.030". Typical Use: Gap filling
Cure Time	30.0 - 1440 min	0.500 - 24.0 hour	Full Cure
Loctite® 5182 Flexible Cure Anaerobic Sealant Anaerobic GasketingLoctite® 5182 Flexible Cure Anaerobic SealantRecommended Primer: 7649 (N). Typical Use: Robotic application on flanges, seals, covers
Cure Time	240 - 1440 min	4.00 - 24.0 hour	Full Cure, Unprimed
Loctite® 5182 Flexible Cure Anaerobic Sealant Anaerobic GasketingLoctite® 5182 Flexible Cure Anaerobic SealantRecommended Primer: 7649 (N). Typical Use: Robotic application on flanges, seals, covers
Cure Time	240 - 1440 min	4.00 - 24.0 hour	Full Cure; Unprimed
Loctite® Gasket Eliminator® 510 Flange Sealant Anaerobic GasketingLoctite® 510 High Temperature Rigid Cure Gasket Eliminator® Flange SealantProduct has a temperature range to 400ºF with excellent solvent and chemical resistance. Makes or dre..
Cure Time	240 - 1440 min	4.00 - 24.0 hour	Full Cure Time @ 20ºC
Loctite® Output™ 383 Acrylic Adhesive Acrylic Bonding Adhesives and Thermally Conductive BondersLoctite® Acrylic Adhesives were developed for bonding applications that require tensile, shear and peel strength combined with maximum impa..