Polymer Property : Cure Time = 30.0 min Product List

Processing Properties

Tips: 30 items are displayed at most.

Processing Properties	Metric	English	Comments
Cure Time	30.0 min	0.500 hour	On steel (Fixture)
ND Industries 567 Shaft & Bearing Retainer Retaining Compound High temperature retainer for engine cylinder liners and heat exchanger tubes
Cure Time	30.0 min @Temperature -55.0 - 204 °C	0.500 hour @Temperature -67.0 - 399 °F	Handling
Palm Labs Adhesives TURBO-LOCK SERIES 13 Anaerobic Thread Locking Compound TURBO-LOCK 13 SERIES is a RED, high temperature, high strength, permanent, anaerobic thread-locking compound. It is highly resistance to heat, vibrations, water, gases, oils, hydrocarbons and many c..
Cure Time	30.0 min @Temperature 23.0 °C	0.500 hour @Temperature 73.4 °F
Parker Chomerics CHO-BOND 1086 Conductive Caulk/Sealant Chomerics two-component conductive epoxy caulks provide excellent adhesion to dissimilar substrates and can be used in lap or butt joint applications. They feature large silver-plated-copper particl..
Cure Time	30.0 min @Temperature 150 °C	0.500 hour @Temperature 302 °F	Oven
Permabond ES578 Epoxy Resin PERMABOND® ES578 is a single-part heat cured epoxy adhesive with excellent adhesion to metal surfaces, ceramics as well as composite materials. ES578 provides excellent thermal conductivity and bon..
Cure Time	30.0 min	0.500 hour	Fixture
Resinlab® RC8075 Anaerobic Retaining Compound The RC 8000 Series anaerobic retaining compounds are designed for use in demanding applications to fill the spaces and surface irregularities between tightly mated cylindrical parts. These products ..
Cure Time	30.0 min @Temperature 121 °C	0.500 hour @Temperature 250 °F
Parker Chomerics CHO-FLEX 4432 Conductive Ink CHO-FLEX polyester inks were developed for the membrane keyboard and sensor industries. The ink bond to Mylar films, and can be creased, heat-formed or scratched without affecting their performance...
Cure Time	30.0 - 4320 min	0.500 - 72.0 hour	Average value: 854 min Grade Count:23
Overview of materials for Epoxy, High Temperature This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Encapsulating, Mineral Filled". Each property range of values reported is minimum and maximum val..
Cure Time	30.0 min @Temperature 170 Â°C	0.500 hour @Temperature 338 Â°F
Humiseal 1B31 Acrylic Conformal Coating Humiseal 1B31 Acrylic Conformal CoatingHigh moisture resistanceExcellent dielectrical propertiesSelective chemical resistanceExcellent repairabilityMIL-I-46058C ApprovedPasses thermal shock test (MI..
Cure Time	30.0 min @Temperature 170 Â°C	0.500 hour @Temperature 338 Â°F
Humiseal 1B31LSE Acrylic Conformal Coating Humiseal 1B31LSE Acrylic Conformal CoatingHigh moisture resistanceExcellent dielectrical propertiesSelective chemical resistanceExcellent repairabilityMIL-I-46058C Approval PendingPasses thermal sho..
Cure Time	30.0 min @Temperature 150 Â°C	0.500 hour @Temperature 302 Â°F
Gwent Electronic Materials C2020711D3 Curable Silver Range This product is based on a unique curing process that results in the low temperature formation of a thermosetting conductive adhesive that combines good adhesion with excellent electrical properties..
Cure Time	30.0 min @Temperature 150 Â°C	0.500 hour @Temperature 302 Â°F
Gwent Electronic Materials C2091104D1 Conductive Silver Adhesive This ink can be used in a wide range of applications, as a conductive adhesive, it has excellent chemical resistance, with good adhesion. This product is based on a unique curing process that resul..
Cure Time	30.0 min @Temperature 154 °C	0.500 hour @Temperature 310 °F	Press cured
TSE Industries Millathane® HT High Temperature-Resistant Millable Polyester Polyurethane with 80 PHR Hi-Sil 243 LD Filler MILLATHANE HT is a polyester millable polyurethane which has the ability to withstand elevated temperatures. Polyurethanes have been known for their excellent resistance to abrasion, impact, tear st..
Cure Time	30.0 min @Temperature 150 °C	0.500 hour @Temperature 302 °F	Full Cure
Loctite® 3533 Low viscosity fill encapsulant Fill Encapsulant COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants imp..
Cure Time	30.0 min @Temperature 120 °C	0.500 hour @Temperature 248 °F
Dow Corning SE 4440 LP KIT Two-part, grey, 1:1, addition cure gel, good thermal conductivity, low viscosity.Information provided by Dow Corning
Cure Time	30.0 min @Temperature 32.0 °C	0.500 hour @Temperature 89.6 °F	Full Chemical
Chesterton ARC 5ES Rapid Repair Stick Description: ARC 5ES is specifically formulated for quick reliable repairs. Its “stick” design combines the performance of a two component system with the convenience of a single component. The AR..
Cure Time	30.0 min @Temperature 120 °C	0.500 hour @Temperature 248 °F
Dow Corning SE 4446 CV KIT Two-part, grey, 1:1, addition cure gel, good thermal conductivity, controlled volatility.Information provided by Dow Corning
Cure Time	>= 30.0 min @Temperature 75.0 °C	>= 0.500 hour @Temperature 167 °F	tack free
ACC EP RAP 45 EPI Engineered Polymers Aliphatic Polyurea EP RAP 45 Aliphatic Polyurea, “Powered by Reactamine® Technology”, is a two component 100% solids, no VOC is, aliphatic polyurea (silicone optional) coating, that was developed for UV stable (col..
Cure Time	>= 30.0 min @Temperature 75.0 °C	>= 0.500 hour @Temperature 167 °F	tack free
ACC EP RAP-1567 SP-HX EPI Engineered Polymers Silicone Aliphatic Polyurea RAP-1567 SP is a two component 100% solids, no VOC’s, silicone aliphatic polyureas “Powered by ReactAmine® Technology” that was developed for UV stable (colorfast) polyurea applications. This ne..
Cure Time	30.0 min @Temperature 25.0 °C	0.500 hour @Temperature 77.0 °F	Cooling time
Aquabond Technologies Aquabond™ ABS-55 Water Soluble Adhesive and Bonding Thermoplastic Description: Aquabond's water soluble thermoplastic is designed for temporary mounting of hard materials for slicing, dicing, grinding, lapping and polishing and comes in 3 different bonding tem..
Cure Time	30.0 min	0.500 hour	Initial Set
3M Scotchkote™ 75RG 530 Urethane Elastomer Scotchkote Urethane Elastomer 75RG 530 has been specifically developed as a fast curing 75-80 Durometer, elastomeric repair system with a high degree of flexibility for rebuilding and resurfacing r..
Cure Time	30.0 min @Temperature 24.0 °C	0.500 hour @Temperature 75.2 °F
BCC Products BC 4558 Polyester Filler Paste BC4558 is a unique quickset paste designed for aircraft use in making fast repairs to damaged metal surfaces. Also recommended for use in edge filling honeycomb core and foam core composite panels. ..
Cure Time	30.0 - 60.0 min @Temperature 25.0 °C	0.500 - 1.00 hour @Temperature 77.0 °F	demold time
BCC Products BC 8400 Urethane Casting BC8400 is an unfilled, low viscosity, quick setting two component urethane system. When properly cured, BC 8400 will exhibit high impact strength and yield thermoplastic-like parts. Some features i..
Cure Time	30.0 min @Temperature 93.3 °C	0.500 hour @Temperature 200 °F	0.25 hr at 480°F, 0.20 hr at 1000°F
Aremco Glass-Coat™ SGC4000 High Temperature Specialty Coatings Silicone-Glass Silicone-glass-ceramic, gray, low viscosity, scratch resistant coating for stainless steel to 900°F (482°C)
Cure Time	30.0 - 60.0 min @Temperature 90.0 °C	0.500 - 1.00 hour @Temperature 194 °F
Gwent Electronic Materials C2040226D2 Curable Carbon Ink This product is based on a unique curing process that results in the low temperature formation of a thermosetting conductive coating that combines good adhesion with excellent chemical, solvent and ..