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Polymer Property : Melt Temperature = 176 °F Product List
Processing PropertiesTips: 30 items are displayed at most.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
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Hexion Bakelite™ MP 4165 Melamine Phenolic Resin, Copper Adhesive, Low Shrinkage, High Mechanical Strength
(d
Melamine/phenolic molding compound, inorganically filled, glass fiber reinforced, good temperature stability, high level of mechanical properties, copper adhesive, flammability UL 94/V-0/1.6 mm (not..
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
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Hexion Bakelite™ PF 13 Phenolic Formaldehyde Resin, UL Listed
(discontinued **)
Phenolic molding compound, inorganically mica filled, heat resistance, good electrical properties, UL listed molding compound 0.75 mm/V-1 (NC), 3 mm/V-0, standardized molding compound.Application ar..
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
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Hexion Bakelite™ PF 31 Phenolic Formaldehyde Resin, UL Listed
(discontinued **)
Phenolic molding compound, mainly organically filled, standard molding compound for normal stress, UL listed molding compound 1.5 mm/V-1 (All), 3 mm/V-0 (All), standardized molding compound.Applicat..
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
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Hexion Bakelite™ PF 51 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets
(discontinued **)
Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Contact support power switch, switch..
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
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Hexion Bakelite™ PF 84 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets, High Mechanical Strength
&
Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Contact support power switch, moldin..
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
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Hexion Bakelite™ PF 85 Phenolic Formaldehyde Resin, UL Listed
(discontinued **)
Phenolic molding compound, organically filled, reinforced with cotton fibers, average notched impact strength, UL listed molding compound 1.5 mm/HB (BK, BN).Application areas: Switch covers, rolls, ..
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
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Hexion Bakelite™ PF 1107 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to High Temperatures
(disconti
Phenolic molding compound, inorganically filled, glass fiber reinforced, high heat resistance, low heat expansion coefficient, highest resistance to pressure, high dimensional stability.Application ..
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
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Hexion Bakelite™ PF 1141 Phenolic Formaldehyde Resin, High Surface Quality, Resistant to High Temperatures, Dishwasher Proof
Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, hot steam and hot water resistant (not suitable for use of higher voltage).Application..
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
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Hexion Bakelite™ PF 2137 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof
(discontinued **
Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, minimal distortion, dish washer proof.Application areas: Iron heat shields, fittings f..
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
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Hexion Bakelite™ PF 2400 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof, UL Listed
(disc
Phenolic molding compound, inorganically/organically filled, average heat resistance, increased dimensional stability, dish washer proof, UL listed molding compound 1.5 mm/V-0 (ALL).Application area..
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
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Hexion Bakelite™ PF 2736 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed
&nbs
Phenolic molding compound, inorganically/organically filled, increased tracking resistance, UL listed molding compound 0.46 mm/V-0 (BK, Suffix "H"), 0.81 mm/V-0 (NC, GN, BK), 1.5 mm/V-0 (ALL).Applic..
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
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Hexion Bakelite™ PF 4109 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free
Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, low shrinkage, high mechanical strength, U..
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
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Hexion Bakelite™ PF 7400 Phenolic Formaldehyde Resin, High Mechanical Strength
(discontinued **)
Phenolic molding compound, organically filled, reinforced with cotton fiber flakes, high notched impact strength.Application areas: Moldings for higher mechanical strain, e.g. power plugs high volta..
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
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Hexion Bakelite™ PF 7592 Phenolic Formaldehyde Resin, Galvanized, Conductive
(discontinued **)
Phenolic molding compound, inorganically/organically filled. Shrinkage fies compatible to values of UP 3310 and PF 2560. Electroplateable.Application areas: Chromium plated oven strips.Information..
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
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Hexion Bakelite™ PF 13591 Phenolic Formaldehyde Resin, High Surface Quality, UL Listed
(discontinued **)
Phenolic molding compound, mainly organically filled, very soft flow for large molds, UL listed molding compound 1.5 mm/V-1 (BK), 3.0 mm/V-0 (BK).Application areas: Pan handles, various applications..
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
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Hexion Bakelite™ PF 14694 Phenolic Formaldehyde Resin, High Surface Quality
(discontinued **)
Phenolic molding compound, mainly organically filled, very soft flow for large molds.Application areas: Housing parts, heat shields, cookware fittings.Information provided by Bak AGBak AG became a p..
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
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Hexion Bakelite™ X24 Phenolic Formaldehyde Resin
(discontinued **)
Phenolic molding compound, mainly organically filled.Application areas: Operating controls, housing parts, lamp holders.Information provided by Bak AGBak AG became a part of Hexion in 2005.
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
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Hexion Bakelite™ X30 Phenolic Formaldehyde Resin
(discontinued **)
Phenolic molding compound, reinforced with cotton and sisal fibers, increased notched impact strength.Application areas: Covers for electrical and electromagnetic devices.Information provided by Bak..
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| Melt Temperature | 80.0 - 140 °C | 176 - 284 °F | |
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Huntsman KRYSTALFLEX® PE 399 Polyurethane Optical Aliphatic Film
Key Properties:Moisture ResistanceChemical CompatibilityCooler ProcessingHigher AdhesionMultiple Design OptionNo special storage requiredInformation provided by Alliance Polymers
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
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Hexion Bakelite™ PF 4010 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage
(disconti
Glass fiber reinforced and inorganically filled molding compound. High heat resistance, reduced molding shrinkage, good chemical resistance and mechanical properties.Application areas: Switch housi..
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
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Hexion Bakelite™ PF 4041 Phenolic Formaldehyde Resin, Resistant to High Temperatures
(discontinued **)
Phenolic molding compound, glass fiber reinforced and inorganically filled, elasticized. Very good heat resistance, very good mechanical properties, reduced mold shrinkage and post-shrinkage, good ..
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
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Hexion Bakelite™ PF 4111 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free, Copper Adhesive
Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, high mechanical strength, copper-adhesive,..
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
|
Hexion Bakelite™ PF 8052 Phenolic Formaldehyde Resin, Resistant to High Temperatures
(discontinued **)
Phenolic molding compound, glass fiber reinforced and inorganically filled. Excellent heat resistance with respect to surface finish and mechanical properties.Application areas: Pan handles, heat r..
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
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Hexion Bakelite™ PF 83 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets
(discontinued **)
Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Switch covers, rolls, handle casings..
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
|
Hexion Bakelite™ PF 1142 Phenolic Formaldehyde Resin, High Mechanical Strength
(discontinued **)
Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability, good mechanical properties.Application areas: Insulating flanges, sealings, pulleys.Information p..
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
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Hexion Bakelite™ PF 2560 Phenolic Formaldehyde Resin, High Surface Quality, For Electrostatic Coating, UL Listed
&n
Phenolic molding compound, inorganically/organically filled, average heat resistant, high surface quality, lower water absorption than PF 31, minimal distortion, UL listed molding compound 1.5 mm/V-..
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
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Hexion Bakelite™ PF 2836 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed
&nbs
Phenolic molding compound, inorganically/organically filled, increased heat resistance, increased tracking resistance, low shrinkage and post shrinkage, improved electrical properties, UL listed mol..
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
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Hexion Bakelite™ PF 2855 Phenolic Formaldehyde Resin, High Surface Quality, Low Shrinkage, For Electrostatic Coating, Dishwasher Proof, UL Listed
Phenolic molding compound, inorganically/organically filled, heat resistant up to 250°C, hot steam and hot water resistant, high surface quality, for electrostatic coating, UL listed molding compou..
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
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Hexion Bakelite™ PF 4155 Phenolic Formaldehyde Resin, Resistant to High Temperatures, Improved Electrical Properties, Low Shrinkage, High Mechanical Strength
Phenolic molding compound, inorganically filled, glass fiber reinforced, good media and temperature resistance. Conditioned Cu-adhesion.Application areas: Commutators (fuel pumps, actuators, starte..
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
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Hexion Bakelite™ PF 4260 Phenolic Formaldehyde Resin, Resistant to High Temperatures, Improved Electrical Properties, Low Shrinkage, High Mechanical Strength
Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistantApplication areas: Commutators (starte..
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