Polymer Property : Dielectric Strength = 16.1 kV/mm Product List

Electrical Properties

Tips: 30 items are displayed at most.

Electrical Properties	Metric	English	Comments
Dielectric Strength	16.1 kV/mm	410 kV/in
Resinlab® EP1112NC Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP1112NC Clear is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. EP1112NC Clear is a modified version of the standard EP11..
Dielectric Strength	16.1 kV/mm @Thickness 3.17 mm	410 kV/in @Thickness 0.125 in	in air; ASTM D149
Ravago Manufacturing Americas Hylex® P1310G10 HB Polycarbonate, 10% Fiberglass Reinforced, UV Stabilized Information provided by Ravago.
Dielectric Strength	16.1 kV/mm @Thickness 3.17 mm	410 kV/in @Thickness 0.125 in	in Air; ASTM D149
Ravago Manufacturing Americas Hylex® P1317L Polycarbonate, UV Stabilized, Higher Flow, Mold Release Information provided by Ravago.
Dielectric Strength	16.1 kV/mm	410 kV/in
Resinlab® EP965 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting ..
Dielectric Strength	16.1 kV/mm	410 kV/in	in Air, 0.125 in; ASTM D149
Ravago Manufacturing Americas Hylex® P1325L Polycarbonate, UV Stabilized, High Flow, Mold Release Entec's proprietary products include a full range of compounds in the Nylon 6/6, Nylon 6, ABS, PBT, Polycarbonate, PC/ABS, PC/ASA, PC/PBT, and PPO/PPE resin families.Information provided by Ente..
Dielectric Strength	16.1 kV/mm	410 kV/in	Method A (Short-Time); ASTM D149
Techmer ES HiFillÂ® PA6 GF30 L BK 30% Glass Filled Availability: North AmericaForms: PelletsFiller/Reinforcement: Glass Fiber Reinforcement, 30% Filler by WeightAdditive: LubricantFeatures: LubricatedAppearance: BlackInformation provided by TP Compo..
Dielectric Strength	16.1 kV/mm	410 kV/in	Method A (Short-Time); ASTM D149
Techmer ES HiFillÂ® PA6 GF30 L N BK 30% Glass Filled Availability: North AmericaForms: PelletsFiller/Reinforcement: Glass Fiber Reinforcement, 30% Filler by WeightProcessing Method: Injection MoldingInformation provided by TP Composites, Inc.
Dielectric Strength	16.1 kV/mm	410 kV/in	Method A (Short-Time); ASTM D149
Techmer ES HiFillÂ® PA6 GF30 L X MT 30% Glass Filled Availability: North AmericaForms: PelletsFiller/Reinforcement: Glass Fiber Reinforcement, 30% Filler by WeightAdditive: LubricantFeatures: LubricatedAppearance: SilverTPCI# 7210102Information provid..
Dielectric Strength	16.1 kV/mm	410 kV/in	Method A (Short-Time); ASTM D149
Techmer ES HiFillÂ® PA6 GF33 L NAT004 33% Glass Filled Availability: North AmericaForms: PelletsFiller/Reinforcement: Glass Fiber Reinforcement, 33% Filler by WeightAdditive: Lubricant Features: LubricatedAppearance: Natural ColorTPCI# 9411102Informatio..
Dielectric Strength	16.1 kV/mm	410 kV/in	Method A (Short-Time); ASTM D149
Techmer ES HiFillÂ® PA6/6 GB20 L BK 20% Glass Bead Filler Availability: North AmericaForms: PelletsFiller/Reinforcement: Glass Bead, 20% Filler by WeightAdditive: LubricantFeatures: LubricatedAppearance: BlackInformation provided by TP Composites, Inc.
Dielectric Strength	16.1 kV/mm	410 kV/in	Method A (Short-Time); ASTM D149
Techmer ES HiFillÂ® PBT 1226 Availability: North AmericaForms: PelletsFeatures: Medium FlowAppearance: Natural ColorInformation provided by TP Composites, Inc.
Dielectric Strength	16.1 kV/mm	410 kV/in	Method A (Short-Time); ASTM D149
Techmer ES HiFillÂ® PBT 613 Availability: North AmericaForms: PelletsFeatures: Good Flow and Good ProcessabilityAppearance: Natural ColorInformation provided by TP Composites, Inc.
Dielectric Strength	16.1 kV/mm	410 kV/in	Method A (Short-Time); ASTM D149
Techmer ES StatiblendÂ® PA6 GF30 AS BK 30% Glass Filled Availability: North AmericaForms: PelletsFiller/Reinforcement: Glass Fiber, 30% Filler by WeightAdditive: AntistaticFeatures: AntistaticAppearance: BlackInformation provided by TP Composites, Inc.
Dielectric Strength	16.1 kV/mm	410 kV/in	Method A (Short-Time); ASTM D149
Techmer ES HiFill FRÂ® PET GF15 IM FR X 15% Glass Filled Availability: North AmericaForms: PelletsFiller/Reinforcement: Glass Fiber, 15% Filler by WeightAdditive: Impact Modifier and Mold ReleaseFeatures: Flame Retardant, Good Mold Release and Impact Modi..
Dielectric Strength	16.1 kV/mm	410 kV/in	Method A (Short-Time); ASTM D149
Techmer ES HiFillÂ® PA6 GF33 L NAT024 33% Glass Filled Availability: North AmericaForms: PelletsFiller/Reinforcement: Glass Fiber Reinforcement, 33% Filler by WeightAdditive: Lubricant Features: LubricatedAppearance: Natural ColorTPCI# 8221102Informatio..
Dielectric Strength	16.1 kV/mm @Thickness 3.00 mm	410 kV/in @Thickness 0.118 in	ASTM D149
Teknor Apex ChemlonÂ® 143 G Nylon 66, 43% Short Glass Fiber Reinforced Notes: Flammability: Passes, FMVSS 302 Processing Method: Injection Molding Forms: Pellets FMVSSInformation Provided by Teknor Apex
Dielectric Strength	16.1 kV/mm	409 kV/in	ASTM D149
Wanshijie PETG Sheet PETG is also named GPET. It is made of a kind of non-crystalline PET resin sourced from cyclohexanediol modification. PETG differs greatly from PET and PCT. PETG is a kind of non-crystalline copolym..
Dielectric Strength	16.1 kV/mm	410 kV/in
Tra-Con Tra-Bond 2113 Clear Low Viscosity Epoxy Adhesive TRA-BOND 2113 is a clear, low viscosity epoxy adhesive system that contains no solvents, cures at room temperature, has excellent flowability and wetting characteristics, and adheres strongly to gla..
Dielectric Strength	16.1 kV/mm	410 kV/in
Tra-Con Tra-Bond F125 Fast Gel Clear Epoxy Adhesive TRA-BOND F125 is a 10 minute gelling epoxy recommended for use in fiber optic connectors, optical and industrial bonding applications. This clear, two part system is easily mixed and used at room te..
Dielectric Strength	16.1 kV/mm	410 kV/in
Tra-Con Tra-Bond 2158 Heat Conductive Electrically Insulating Compound TRA-BOND 2158 is a flexible, thermal conductive epoxy system. It is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards..
Dielectric Strength	16.1 kV/mm	410 kV/in
Atom Adhesives AA-BOND 2113 Epoxy Adhesive AA-BOND 2113 is a clear, low viscosity epoxy adhesive system that contains no solvents, cures at room temperature, has excellent flow ability and wetting characteristics, and adheres strongly to gla..
Dielectric Strength	16.1 kV/mm	410 kV/in
Atom Adhesives AA-BOND F162 Epoxy Adhesive AA-BOND F162 is a thixotropic electrical insulating epoxy adhesive system with low vapor pressure and outgassing characteristics. AA-BOND F162 was specifically developed for fiber optic, laser, phot..
Dielectric Strength	16.1 kV/mm	408 kV/in
3M Scotch-Weld™ 2216 B/A Gray Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive 2216 B/A is a flexible, two-part, room temperature curing epoxy with high peel and shear strength. Scotch-Weld epoxy adhesive 2216 B/A is identical to 3M Scotch-Wel..
Dielectric Strength	16.1 kV/mm	410 kV/in
Resinlab® EP11HTFS Gray Filled Epoxy Adhesive Resinlab™ EP11HTFS Gray is a two part filled epoxy adhesive designed for bonding metals and plastics. It cures at room temperature to a tough, semi-rigid material. It has good wetting to most surfa..
Dielectric Strength	16.1 kV/mm	410 kV/in
Resinlab® EP691 Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP691 is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting and ad..
Dielectric Strength	16.1 kV/mm	410 kV/in
Resinlab® EP965SC-7 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965SC-7 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wett..
Dielectric Strength	16.1 kV/mm	409 kV/in	ST; ASTM D149
Sumitomo Bakelite North America FM 4004F Fiberglass and Mineral Reinforced Phenolic Novolac FM 4004F is a fiberglass and mineral reinforced phenolic novolac compound with improved strength properties over FM 4004. This compound exhibits excellent dimensional stability and good strength at..
Dielectric Strength	16.1 kV/mm	410 kV/in
Resinlab® EP1026 Black Epoxy Adhesive Resinlab™ EP1026 Black is a two part unfilled epoxy adhesive designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material, and is free flowing in ..
Dielectric Strength	16.1 kV/mm	410 kV/in
Resinlab® EP1056LC Urethane Modified Epoxy Adhesive Resinlab™ EP1056LC is a two part urethane modified epoxy adhesive designed to give good adhesion to metals and hard to bond surfaces such as PVC. It is thixotropic to provide good gap filling abili..