Polymer Property : Volume Resistivity = 8.00e+14 ohm-cm Product List

Electrical Properties

Tips: 30 items are displayed at most.

Electrical Properties	Metric	English	Comments
Volume Resistivity	8.00e+14 ohm-cm	8.00e+14 ohm-cm
Resinlab® EP1112NC Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP1112NC Clear is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. EP1112NC Clear is a modified version of the standard EP11..
Volume Resistivity	8.00e+14 ohm-cm	8.00e+14 ohm-cm
Resinlab® EP1121 Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP1121 Clear is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I..
Volume Resistivity	8.00e+14 ohm-cm	8.00e+14 ohm-cm
Resinlab® EP1320 Heat Cure Epoxy Conformal Coating Resinlab™ EP1320 and EP1320LV are one part heat cure epoxy conformal coatings. They can also be used as a small mass potting compounds, structural adhesives, or insulating polymer systems where the..
Volume Resistivity	8.00e+14 ohm-cm	8.00e+14 ohm-cm
Resinlab® EP1320LV Heat Cure Epoxy Conformal Coating Resinlab™ EP1320 and EP1320LV are one part heat cure epoxy conformal coatings. They can also be used as a small mass potting compounds, structural adhesives, or insulating polymer systems where the..
Volume Resistivity	8.00e+14 ohm-cm	8.00e+14 ohm-cm
Resinlab® EP1325 Thixotropic, Heat Curing Epoxy Adhesive Resinlab™ EP1325 and EP1325LV are one part thixotropic, heat curing epoxy adhesives. They can also be used as a small mass potting compounds, staking or damming adhesives, or polymer systems where ..
Volume Resistivity	8.00e+14 ohm-cm	8.00e+14 ohm-cm
Resinlab® EP1325LV Thixotropic, Heat Curing Epoxy Adhesive Resinlab™ EP1325 and EP1325LV are one part thixotropic, heat curing epoxy adhesives. They can also be used as a small mass potting compounds, staking or damming adhesives, or polymer systems where ..
Volume Resistivity	8.00e+14 ohm-cm	8.00e+14 ohm-cm
Resinlab® EP1330LV Heat Cure Epoxy Polymer System Resinlab™ EP1330 and EP1330LV are one part heat cure epoxy polymer systems. They can also be used as a small mass potting or staking compounds, or a dam adhesive in and “dam and fill” application..
Volume Resistivity	8.00e+14 ohm-cm	8.00e+14 ohm-cm
Resinlab® EP1385 Clear Epoxy Formulation Resinlab™ EP1385 Clear is an epoxy formulation designed for applications requiring resistance to E-85 type fuels. It has good wetting and adhesion to most surfaces. It has very good resistance to w..
Volume Resistivity	8.00e+14 ohm-cm	8.00e+14 ohm-cm
Resinlab® EP691 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP 691 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting..
Volume Resistivity	8.00e+14 ohm-cm	8.00e+14 ohm-cm
Resinlab® EP965LVLX Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965LVLX Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has ..
Volume Resistivity	8.00e+14 ohm-cm	8.00e+14 ohm-cm	ASTM D257
Techmer ES HiFillÂ® PA6/6 GF/M15 HS L BK 40/15% Glass/Mineral Fiber Filled Availability: North AmericaForms: PelletsFiller/Reinforcement: Glass Fiber Reinforcement, 40% Filler by Weight and Mineral Filler, 15% Filler by WeightAdditive: Lubricant and Heat StabilizerFeatures..
Volume Resistivity	8.00e+14 ohm-cm	8.00e+14 ohm-cm	ASTM D257
Techmer ES HiFillÂ® PA6/6 GF/M40 B1 BK 40% Glass/Mineral Fiber Filled Availability: North AmericaForms: PelletsFiller/Reinforcement: Glass Fiber Reinforcement, 40% Filler by Weight and Mineral Filler, 40% Filler by WeightAdditive: LubricantFeatures: LubricatedAppearan..
Volume Resistivity	8.00e+14 ohm-cm	8.00e+14 ohm-cm	ASTM D257
Techmer ES HiFillÂ® PA6/6 GF/M40 IG BK 40% Glass/Mineral Fiber Filled Availability: North AmericaForms: PelletsFiller/Reinforcement: Glass Fiber Reinforcement, 40% Filler by Weight and Mineral Filler, 40% Filler by WeightAdditive: Lubricant and Heat StabilizerFeatures..
Volume Resistivity	8.00e+14 ohm-cm @Temperature 20.0 °C	8.00e+14 ohm-cm @Temperature 68.0 °F	BS 2782
Teknor Apex Sinvicomp SIH 6007A Polyvinyl Chloride, Flexible Availability: Asia Pacific Features: Good Stiffness Uses: Wire and Cable Applications Wire Types: V-90 Agency Ratings: AS 3147-1992 Forms: Pellets Processing Method: ExtrusionInformation Provided by..
Volume Resistivity	8.00e+14 ohm-cm @Temperature 20.0 °C	8.00e+14 ohm-cm @Temperature 68.0 °F	ASTM D257
Fainplast Compounds HAX HF 018/15 Halogen Free PVC General purpose
Volume Resistivity	8.00e+14 ohm-cm @Temperature 23.0 °C	8.00e+14 ohm-cm @Temperature 73.4 °F	ASTM D257
DuPont Performance Polymers Delrin® 111P NC010 Acetal Homopolymer Delrin® 111P is a high viscosity acetal homopolymer with improved thermal stability and modifications for more precise molding (reduced warpage, fewer voids). It has higher tensile strength and mod..
Volume Resistivity	8.00e+14 ohm-cm	8.00e+14 ohm-cm	C96/35/90; IPC TM-650 2.5.17.1
Arlon CuClad 233 PTFE/Woven Fiberglass Laminate Microwave Printed Circuit Board Substrate CuClad 233 uses a medium fiberglass/PTFE ratio to balance lower dielectric constant and improved dissipation factor without sacrificing mechanical properties.Cross Plied Woven Fiberglass, alternatin..
Volume Resistivity	8.00e+14 ohm-cm	8.00e+14 ohm-cm
Resinlab® EP1026HP Epoxy Adhesive Resinlab™ EP1026HP is a high performance fast setting epoxy adhesive designed for bonding metals, ceramics, glass and most plastics. This product gives good resistance to water salt spray, inorgan..
Volume Resistivity	8.00e+14 ohm-cm	8.00e+14 ohm-cm
Resinlab® EP1026R Rubber Modified Epoxy Adhesive Resinlab™ EP1026R is a two part unfilled rubber modified epoxy adhesive designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material, and is free ..
Volume Resistivity	8.00e+14 ohm-cm	8.00e+14 ohm-cm
Resinlab® EP1195 Flame Retardant Epoxy Casting Resin Resinlab™ EP1195 is a low viscosity, fast gelling, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File # E1..
Volume Resistivity	8.00e+14 ohm-cm	8.00e+14 ohm-cm
Resinlab® EP11HT Gray Filled Epoxy Adhesive Resinlab™ EP11HT Gray is a two part filled epoxy adhesive designed for bonding metals and plastics. It cures at room temperature to a tough, semi-rigid material. It has good wetting to most surfa..
Volume Resistivity	8.00e+14 ohm-cm	8.00e+14 ohm-cm
Resinlab® EP965 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting ..
Volume Resistivity	8.00e+14 ohm-cm	8.00e+14 ohm-cm
Resinlab® EP965LVLX Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965LVLX Clear is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has ..
Volume Resistivity	8.00e+14 ohm-cm	8.00e+14 ohm-cm
Resinlab® EP965SC-7 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965SC-7 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wett..
Volume Resistivity	8.00e+14 ohm-cm	8.00e+14 ohm-cm
Resinlab® EP1056LC Urethane Modified Epoxy Adhesive Resinlab™ EP1056LC is a two part urethane modified epoxy adhesive designed to give good adhesion to metals and hard to bond surfaces such as PVC. It is thixotropic to provide good gap filling abili..
Volume Resistivity	8.00e+14 ohm-cm	8.00e+14 ohm-cm
Resinlab® EP1121 Black Electronic Grade Epoxy Encapsulant Resinlab™ EP1121 Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I..
Volume Resistivity	8.00e+14 ohm-cm	8.00e+14 ohm-cm
Resinlab® EP1305 Black Highly Toughened Urethane Modified Epoxy Resinlab™ EP1305 Black is a highly toughened urethane modified epoxy designed for bonding PVC, metals, ceramics and other difficult to bond substrates. The system has a thixotropic non-sag viscosi..